Abstract: The rod assembly for wafers comprises a plurality of rods, made of materials to be used as the wafers used for electronic devices which are assembled in parallel and bonded with each other into an integrated body. Wafers used for electronic devices can be obtained by slicing the rod assembly for the wafers. Mirror-finished bonded face is formed to the outer surface for each of the rods. The bonded face to each of the rods is cleaned by a surface treatment using chemicals. Subsequently, respective rods are assembled in parallel and brought into contact with each other at their respective bonded faces. The thus prepared rods are maintained in a heated atmosphere into an integrated body. Then, the rod assembly is applied with slicing for providing wafers used for electronic devices. Since the rod assembly has a structure in which a plurality of the rods are assembled in parallel and bonded with each other into an integrated body, the diameter for the rod assembly can remarkably be increased.

Abstract: A rod base material for forming wafers for electronic devices is formed from a plurality of rod members made of selected materials. The rods are assembled in parallel and are bonded with each other into an integrated body. In one aspect of this invention, a mirror-finished bonding face is formed at the outer surface of each of the rod members, and is cleaned by a surface treatment using chemicals. Subsequently, respective rod members are assembled in parallel and brought into contact with each other at their respective bonding faces. The thus prepared and assembled rod members are maintained in a heated atmosphere until they combine into an integrated body to provide the base material. The rod base material is thereafter subjected to slicing to provide wafers used for forming electronic devices.