Abstract: An object of the present invention is to provide a compact air flow rate measuring device with improved stain resistance. A physical quantity detecting device of the present invention includes: a semiconductor element having a flow rate detection unit 205; a circuit board 207 supporting the semiconductor element; and a conductive cover 202 fixing the circuit board 207, and the semiconductor element is fixed to the circuit board 207 such that the flow rate detection unit 205 faces the cover 202.

Abstract: A compact physical quantity detecting device is provided since it is possible to lower the mounting height of a chip package by accommodating the chip package in a notched board. In the physical quantity detecting device of the present invention, a part in a thickness direction of a support body on which a flow rate detection unit and a processing unit are mounted is accommodated in a notch provided in a printed board.

Abstract: Provided is a thermal flowmeter that can achieve both measurement accuracy and antifouling performance with a simple and space-saving passage structure. In the thermal flowmeter of the invention, a housing is disposed in a main passage through which a gas to be measured flows, and the gas to be measured is taken from the main passage into an auxiliary passage provided in a housing, and a flow rate detection unit disposed in the auxiliary passage measures a flow rate of the gas to be measured. The auxiliary passage includes an inlet opening that opens to be inclined with respect to the main flow direction of the gas to be measured flowing through the main passage, and an inclined passage that extends in a direction inclined with respect to the main flow direction of the gas to be measured flowing from the inlet opening through the main passage.

Abstract: A compact physical quantity detecting device is provided since it is possible to lower the mounting height of a chip package by accommodating the chip package in a notched board. In the physical quantity detecting device of the present invention, a part in a thickness direction of a support body on which a flow rate detection unit and a processing unit are mounted is accommodated in a notch provided in a printed board.

Abstract: The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flow meter according to the invention, a circuit package (400) that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing (302) having an inlet trench (351), a bypass passage trench on frontside (332), an outlet trench (353), and the like are formed through resin molding, and an outer circumferential surface of the circuit package (400) produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package (400) to the housing (302).

Abstract: An object of the present invention is to provide a compact air flow rate measuring device with improved stain resistance. A physical quantity detecting device of the present invention includes: a semiconductor element having a flow rate detection unit 205; a circuit board 207 supporting the semiconductor element; and a conductive cover 202 fixing the circuit board 207, and the semiconductor element is fixed to the circuit board 207 such that the flow rate detection unit 205 faces the cover 202.

Abstract: Provided is a thermal flowmeter that can achieve both measurement accuracy and antifouling performance with a simple and space-saving passage structure. In the thermal flowmeter of the invention, a housing is disposed in a main passage through which a gas to be measured flows, and the gas to be measured is taken from the main passage into an auxiliary passage provided in a housing, and a flow rate detection unit disposed in the auxiliary passage measures a flow rate of the gas to be measured. The auxiliary passage includes an inlet opening that opens to be inclined with respect to the main flow direction of the gas to be measured flowing through the main passage, and an inclined passage that extends in a direction inclined with respect to the main flow direction of the gas to be measured flowing from the inlet opening through the main passage.

Abstract: The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flow meter according to the invention, a circuit package (400) that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing (302) having an inlet trench (351), a bypass passage trench on frontside (332), an outlet trench (353), and the like are formed through resin molding, and an outer circumferential surface of the circuit package (400) produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package (400) to the housing (302).

Abstract: In order to provide a flow measuring device high in thermal responsiveness, the flow measuring device includes a temperature detecting element 2 for temperature detection, and a conductive metal lead frame 3 that supports and fixes the temperature detecting element. Of the metal lead frame, a part of the metal lead frame mounted with the temperature detecting element has a portion which is thinner than the thickness of the other metal lead frame or narrower than the width of the other metal lead frame.

Abstract: The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flow meter according to the invention, a circuit package (400) that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing (302) having an inlet trench (351), a bypass passage trench on frontside (332), an outlet trench (353), and the like are formed through resin molding, and an outer circumferential surface of the circuit package (400) produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package (400) to the housing (302).

Abstract: A thermal flowmeter circuit package having a side of a measurement surface 430 of the circuit package and a flow path 387 at a side of the backside of measurement surface 431 of a rear surface of the measurement surface 430, and an inflow-side end surface of the circuit package for dividing the measurement target gas 30 has different shapes at the side of the measurement surface and at the side of the backside of measurement surface. The inflow-side end surface of the circuit package for dividing the measurement target gas 30 is formed with a reference line 700 dividing the measurement target gas 30, and an end surface 701a at the side of the measurement surface with respect to the reference line and an end surface 701b at the side of the backside of measurement surface with respect to the reference line are formed to be asymmetrical.

Abstract: Provided is a thermal flow meter to improve the measurement accuracy of a temperature detector. The thermal flow meter includes a bypass passage through which a measurement target gas flowing through a main passage flows, and a circuit package which includes a measurement circuit for measuring a flow rate of the measurement target gas flowing through the bypass passage and a temperature detecting portion for detecting a temperature of the measurement target gas. The circuit package includes a circuit package body which is molded by a resin to internally envelope the measurement circuit and a protrusion molded by the resin. The temperature detecting portion is provided in the leading end portion of the protrusion, and at least the leading end portion of the protrusion protrudes to the outside from a housing.

Abstract: A thermal-type flowmeter includes a chip package. The chip package is formed through encapsulation with a resin of a sensor element, a drive circuit, a metal lead frame adapted to have mounted thereon the sensor element and the drive circuit, and a temperature detecting element. The chip package has an exposed structure in which a surface of the sensor element having the diaphragm is exposed. The temperature detecting element is mounted on the lead frame via an electrically conductive member.

Abstract: To obtain a thermal flow meter capable of providing thermal insulation without degrading responsiveness of a temperature detection element.

Abstract: The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flow meter according to the invention, a circuit package (400) that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing (302) having an inlet trench (351), a bypass passage trench on frontside (332), an outlet trench (353), and the like are formed through resin molding, and an outer circumferential surface of the circuit package (400) produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package (400) to the housing (302).

Abstract: The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flow meter according to the invention, a circuit package (400) that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing (302) having an inlet trench (351), a bypass passage trench on frontside (332), an outlet trench (353), and the like are formed through resin molding, and an outer circumferential surface of the circuit package (400) produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package (400) to the housing (302).

Abstract: A thermal flow meter capable of measuring flow rates of a gas flowing in a forward direction and a backward direction with a high degree of accuracy is provided. A thermal flow meter 300 according to the present invention includes a bypass passage configured to retrieve and flow a measurement target gas 30 received from a main passage 124 and a flow rate measurement circuit 601 configured to measure a flow rate by performing heat transfer with the measurement target gas flowing in the bypass passage.

Abstract: A thermal-type flowmeter includes a chip package. The chip package is formed through encapsulation with a resin of a sensor element, a drive circuit, a metal lead frame adapted to have mounted thereon the sensor element and the drive circuit, and a temperature detecting element. The chip package has an exposed structure in which a surface of the sensor element having the diaphragm is exposed. The temperature detecting element is mounted on the lead frame via an electrically conductive member.

Abstract: In order to provide a flow measuring device high in thermal responsiveness, the flow measuring device includes a temperature detecting element 2 for temperature detection, and a conductive metal lead frame 3 that supports and fixes the temperature detecting element. Of the metal lead frame, a part of the metal lead frame mounted with the temperature detecting element has a portion which is thinner than the thickness of the other metal lead frame or narrower than the width of the other metal lead frame.

Abstract: In a thermal flow meter that can simplify a manufacturing process and that has high measurement accuracy, a circuit package includes a passage portion, in which an air flow sensing portion is arranged, and a processing unit, in which a circuit is arranged. The circuit package is fixed to a fixing portion integrally formed with the circuit package, and the passage portion of the circuit package is held in a bypass passage. At least a portion of an end spaced apart from a fixing wall of the passage portion of the circuit package is exposed in the bypass passage.