Patents by Inventor Nobuaki H. Tsuji

Nobuaki H. Tsuji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having peripheral metal wiring
    Patent number: 5491352
    Abstract: At a peripheral area of a semiconductor chip where active elements are not formed, a layer underlying a power supply wiring or ground wiring is provided with an uneven surface. The uneven or corrugated surface at the interface between the wiring and the underlying layer makes the wiring unsusceptible to slide. The uneven surface can be realized by interposing foreign matters between insulating layers, by selectively reducing the thickness of an insulating layer, or by forming openings in an insulating layer.
    Type: Grant
    Filed: October 6, 1994
    Date of Patent: February 13, 1996
    Assignee: Yamaha Corporation
    Inventor: Nobuaki H. Tsuji