Abstract: An imaging device includes an image sensor, a blade operable to switch between a closed state to at least partially block light incident on the image sensor and an open state to allow light to be incident on the image sensor, a blade driver that drives the blade, a blade controller that controls the blade driver, an authentication processor that performs authentication based on a result of imaging performed by the image sensor, and an operation detector that detects an operation. The blade controller controls the blade driver to place the blade in the open state in response to a predetermined operation detected by the operation detector and to place the blade in the closed state in response to a predetermined time passing in the open state of the blade and no success in the authentication performed by the authentication processor.

Abstract: An information processing device includes an acquisition unit that acquires mobile object information, parcel information, pickup delivery information as information regarding at least one of pickup and delivery, map information, weather information, and traffic information, a calculation control unit that calculates a delivery company burden, as a cost defrayment by a delivery company, in regard to each combination of target parcels and a mobile object by using the mobile object information, the parcel information, the pickup delivery information, the map information, the weather information and the traffic information, a determination unit that determines an optimum combination out of a plurality of combinations based on the delivery company burden calculated in regard to each combination of target parcels and a mobile object, and an output unit that outputs the optimum combination.

Abstract: Disclosed is an optical control type phased array antenna apparatus having an array antenna of antenna elements. An optical signal processor optically processes input high-frequency signals, and outputs optically processed signals including signal components having phases corresponding to directions in which radio wave signals come and having frequencies equal to those of the input high-frequency signals. Then, each frequency converter mixes a received signal with the optically processed signal in correspondence with the antenna element, and outputs a frequency-converted signal having a frequency of a difference between a frequency of the received signal and a frequency of the optically processed signal. Further, a combiner combines the frequency-converted signals.

Abstract: In a semiconductor device provided with a semiconductor substrate having two surfaces opposing to each other and having a circuit including a transistor having a plurality of electrodes, the circuit is formed on at least one of the two surfaces. Insulating films are formed on the two surfaces of the semiconductor substrate, respectively, and connecting electrodes are formed on a surface of the insulating film and electrically connected to the circuit. Further, a surface grounding conductor is formed on a surface of each of the insulating films so as to cover the surface of each of the insulating films except for portions where the connecting electrodes are formed. Accordingly, any possible interference of the circuit formed on the semiconductor device with the external circuit can be prevented.

Abstract: A device for compensating for nonlinearity of amplifiers by use of a predistortion principle, and a nonlinear signal generating circuit built in such a device. The nonlinear signal generating circuit includes a quadrature hybrid of the type using a distributed constant line. Two diodes and a terminal resistor are connected in parallel and opposite in polarity to each other and connected between the terminals of coupling and passing ports of the hybrid and ground. The nonlinear compensating device is constituted by the combination of a plurality of quadrature hybrids of the type using a distributed constant line and various kinds of diodes. All the circuit segments of the device are implemented with a planar circuit provided on a single dielectric substrate and diodes which are held in a pair chip condition. Such circuitry is accommodated in a single air-tight housing to complete a microwave integrated circuit.