Abstract: Provided are a low-viscosity ultraviolet curable silicone composition capable of being used even in a surface exposure method and a lift-up method etc.; and a cured product superior in tensile strength and elongation at break.

Abstract: Appropriate network data for an indoor map can be efficiently generated using input data including a structure of an indoor space. In a network data generation device (10) that generates, from the input data including at least the structure of the indoor space and information indicating a property based on the structure of the indoor space, network data, the network data including a link representing a movable space on a map and a node that is a starting point or an ending point of the link, a link/node generation unit (142) generates a set of links and a set of nodes based on the input data.

Abstract: A developing solution for negative type photo-sensitive resin compositions which comprises an aqueous solution containing 0.01 to 1.5% by weight of at least one compound selected from quaternary ammonium bases represented by formula (I): ##STR1## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are the same or different, and are groups selected from the class consisting of alkyl and hydroxyalkyl groups, each group having 1 to 6 carbon atoms, and containing a nonionic, cationic or amphoteric surface active agent. The developing solution allows for development of sharp image patterns within a short period without forming mottles.

Abstract: A positive-type photoresist composition is disclosed, which comprises:(A) an o-quinonediazide compound;(B) an alkali-soluble phenol resin; and(C) at least one compound selected from a group consisting of urea compounds, thiourea compounds and arylamine compounds; A positive-type photoresist composition which comprises:(A) an o-quinonediazide compound;(B) an alkali-soluble phenol resin; and(C) at least one compound selected from a group consisting of urea compounds, thiourea compounds, and arylamine compounds represented by general formulae (I), (II) and (III), respectively, ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, and R.sub.4 each represents a hydrogen atom, an alkyl group, an aryl group, or any two of R.sub.1, R.sub.2, R.sub.3, and R.sub.4 form at least one ring together, ##STR2## wherein R.sub.5, R.sub.6, and R.sub.

Abstract: A positively working resist material is disclosed, comprising a compound having at least one silyl ether group and capable of directly dissociating an Si-O-C bond upon irradiation with far ultraviolet rays, X-rays, an electron beam, or an ion beam. The resist material has high sensitivity to high energy radiation, excellent resistance to dry etching, and can be developed with an alkaline aqueous solution.