Abstract: A semiconductor chip has a quadrangle main surface, a wiring substrate, and a resin seal member for sealing the semiconductor chip, in which the resin seal member has a quadrangle main surface which confronts the main surface of the semiconductor chip. A gate cut trace portion is formed on a side face extending along a first side of the main surface of the resin seal member. A sectional area of an area between the main surface of the wiring substrate and the main surface of the resin seal member at a position outside a side face of the semiconductor chip is smaller than a sectional area of an area between the main surface of the semiconductor chip and the main surface of the resin seal member.

Abstract: In a cast-iron disc brake rotor (1), each of an outer sliding surface (2a) and an inner sliding surface (3a) is covered with a phosphate coating (8) by electrolysis of a phosphate coating solution containing therein phosphate ions, zinc ions and nitrate ions. This makes it possible to attain dramatically improved rust preventive performance for the sliding surfaces (2a) and (3a). The phosphate coating (8) has a thickness of 1 to 10 &mgr;m, a mass of 4 to 35 g/m2 and a grain size of less than 50 &mgr;m. Preferably, the thickness of the phosphate coating (8) is adjusted to 2 to 8 &mgr;m.

Abstract: In a cast-iron disc brake rotor (1), each of an outer sliding surface (2a) and an inner sliding surface (3a) is covered with a phosphate coating (8) by electrolysis of a phosphate coating solution containing therein phosphate ions, zinc ions and nitrate ions. This makes it possible to attain dramatically improved rust preventive performance for the sliding surfaces (2a) and (3a). The phosphate coating (8) has a thickness of 1 to 10 &mgr;m, a mass of 4 to 35 g/m2 and a grain size of less than 50 &mgr;m. Preferably, the thickness of the phosphate coating (8) is adjusted to 2 to 8 &mgr;m.

Abstract: A semiconductor device comprising a semiconductor chip having a quadrangular main surface, a wiring substrate with the semiconductor chip disposed on a main surface thereof, a resin seal member for sealing the semiconductor chip, the resin seal member having a quadrangular main surface which confronts the main surface of the semiconductor chip, and a gate cut trace portion formed on a side face extending along a first side of the main surface of the resin seal member, wherein the first side of the main surface of the resin seal member extends along a first side of the main surface of the semiconductor chip, the main surface of the resin seal member has a second side intersecting the first side thereof, the second side of the main surface of the resin seal member extending along a second side of the main surface of the semiconductor chip which second side intersects the first side of the chip main surface, and in a section orthogonal to the second side of the main surface of the semiconductor chip, a sectional