Abstract: A high frequency module includes a first board including a connection portion protruding from an end portion thereof, and a second board including a board through-hole penetrating the second board in a thickness direction thereof. The first board includes a connection pattern connecting a terminal pad formed on a leading end of the connection portion penetrating the board through-hole and a first line pattern forming a tri-plate line. The connection pattern has a line width increasing stepwise from the terminal pad toward the first line pattern. The second board includes a connection pad electrically connected to the terminal pad penetrating the board through-hole.

Abstract: A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 ?m when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 ?g/cm2.

Abstract: A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 ?m when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 ?g/cm2.

Abstract: A heat spreader module includes a laminated assembly, a heat spreader bonded to an upper surface of the laminated assembly, and a circuit board bonded to an upper surface of the heat spreader. The laminated assembly includes a base, an insulated substrate bonded to an upper surface of the base, and an intermediate metal plate bonded to an upper surface of the insulated substrate. A nonwoven fabric impregnated with a liquid is prepared, and an exposed portion of the insulated substrate, which extends out from below the intermediate metal plate, is wiped with the nonwoven fabric. Then, the entire structure is dried until the liquid on the exposed portion of the insulated substrate is removed. Thereafter, a pulsed voltage is applied between the circuit board and the base.

Abstract: A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600° and 900° C. for 10 minutes.

Abstract: A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.

Abstract: A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.

Abstract: A composite material includes an SiC porous ceramic sintered body, which is formed by preliminarily sintering a porous body, having a coefficient of thermal expansion lower than the coefficient of thermal expansion of copper to construct a network therein. A copper alloy impregnating the porous ceramic sintered body includes copper and one or more additive elements which are prepared to impart a coefficient of thermal conductivity of 160 W/mK or higher to the composite material. The additive elements include up to 5% of at least one element selected from Be, Al, Si, Mg, Ti, Ni, Bi, Te, Zn, Pb, Sn, and mish metal, and also contain unavoidable impurities and gas components.

Abstract: Graphite is placed in a case, and the case is set in a furnace. The interior of the furnace is subjected to sintering to produce a porous sintered member of graphite. After that, the case with the porous sintered member therein is taken out of the furnace, and is set in a recess of a press machine. Subsequently, molten metal of metal is poured into the case, and then a punch is inserted into the recess to forcibly press the molten metal in the case downwardly. Open pores of the porous sintered member are infiltrated with the molten metal of the metal by the pressing treatment with the punch.

Abstract: A mass of graphite is placed into a case, and the case is put into a furnace (step S301). The space in the furnace is heated to produce a porous sintered body of graphite (step S302). Thereafter, the case with the porous sintered body contained therein is removed from the furnace, and put into a cavity in a press (step S303). Then, a molten mass of a metal is poured into the case (step S304), and a punch is inserted into the cavity to press the molten metal into the porous sintered body in the case (step S305).

Abstract: A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600° and 900° C. for 10 minutes.

Abstract: A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 &mgr;m when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 &mgr;g/cm2.

Abstract: A mass of graphite is placed into a case, and the case is put into a furnace (step S301). The space in the furnace is heated to produce a porous sintered body of graphite (step S302). Thereafter, the case with the porous sintered body contained therein is removed from the furnace, and put into a cavity in a press (step S303). Then, a molten mass of a metal is poured into the case (step S304), and a punch is inserted into the cavity to press the molten metal into the porous sintered body in the case (step S305).

Abstract: A composite material has SiC produced by preliminarily sintering a porous body having a coefficient of thermal expansion lower than the coefficient of thermal expansion of copper to construct a network therein, the SiC being impregnated with a copper alloy. The copper alloy comprises copper and one or more additive elements which are prepared to impart a coefficient of thermal conductivity of 160 W/mK or higher to the composite material. The additive elements comprise up to 5% of at least one element selected from Be, Al, Si, Mg, Ti, Ni, Bi, Te, Zn, Pb, Sn, and mish metal, and also contains unavoidable impurities and gas components.

Abstract: An etching treatment is applied to a metal plate in accordance with a predetermined circuit pattern to form a circuit. Subsequently, a sandblast treatment is applied to an entire surface including the circuit to remove a conductive reactive layer remaining at a metal-removed portion of the circuit. Accordingly, an insulating substrate as an underlying layer is exposed from the metal-removed portion of the circuit. The sandblast treatment is performed under a condition in which an Ni plating layer remains on the circuit at a stage at which the conductive reactive layer remaining at the metal-removed portion of the circuit is removed.