Patents by Inventor Nobuaki Oie

Nobuaki Oie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device and semiconductor package
    Patent number: 6097085
    Abstract: The electronic device has a structure that a semiconductor package is mounted on a mother board. To relieve stress caused by cyclic thermal load and applied to solder bumps that are electrically and mechanically connect the semiconductor package and the mother board, a shape-holding plate (stiffener) adhered to a wiring film is composed of a metal with a thermal expansion coefficient of 13.times.10.sup.-6 to 17.times.10.sup.-6 almost close to that of a glass-epoxy wiring substrate as the mother board. Examples of the metal are 25Cr-20Ni stainless steel or copper alloy containing 0.01 to 0.03% by weight of Zr.
    Type: Grant
    Filed: August 26, 1998
    Date of Patent: August 1, 2000
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Morihiko Ikemizu, Nobuaki Oie, Ken Iwasaki