Patents by Inventor Nobuaki Sekiguchi

Nobuaki Sekiguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding member and gypsum board mounting method using the same
    Publication number: 20020002805
    Abstract: A bonding member 1 comprising a metallic plate 2 formed as a small piece onto which a hot melt adhesive layer 3 is formed at least one side of said metallic plate 2, and a gypsum board mounting method for mounting a gypsum board 5 using the bonding member 1, comprising: fixing said bonding member 5 temporarily; pushing said gypsum board 5, heating the metallic plate 2 with electromagnetic induction to melt said hot melt adhesive layer 3; and thereby allowing the gypsum board 5 to be bonded easily without noise. The bonded gypsum board 5 can be recycled because it can be peeled off easily with melting the adhesive layer 3 without damage of the board.
    Type: Application
    Filed: July 2, 2001
    Publication date: January 10, 2002
    Applicant: Max Co., LTD.
    Inventors: Masakatsu Yamaguchi, Keijiro Murayama, Mitsuhiro Takatsuru, Takashi Takayama, Tsutomu Shioya, Hiroshi Shiokawa, Hiroyuki Nishikawa, Nobuaki Sekiguchi, Takumi Harigaya, Kigen Agehara, Motoshige Akatsu