Patents by Inventor Nobuatsu SEKITA

Nobuatsu SEKITA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20150235845
    Abstract: According to one embodiment, a method of manufacturing a semiconductor device, includes preparing a semiconductor substrate includes a connection pad to electrically connect to a circuit element formed on a main surface, or a rewiring line connected to the connection pad, forming an insulating photosensitive resin film on the substrate with the exclusion of at least an edge portion of the substrate by inkjet, patterning the photosensitive resin film by photolithography, and forming a rewiring line, UBM or an electrode for external connection on the substrate on which the patterned photosensitive resin film is formed.
    Type: Application
    Filed: February 18, 2015
    Publication date: August 20, 2015
    Applicant: TERA PROBE, INC.
    Inventors: Nobuatsu SEKITA, Tsutomu MIYAMOTO, Norihiko KANEKO, Ichiro KONO