Abstract: A first signal represents an image of an object to be inspected. Portions of the first signal are selected as second signals respectively. The second signals represent partial images of the inspected-object image respectively. The partial images are of a given size. The second signals are compared with a third signal representing a predetermined reference image of a size equal to the size of the partial images, and thereby pattern matching is executed between the partial images and the reference image. Calculation is made as to scores of the pattern matching between the partial images and the reference image. A maximum score is selected from among the calculated scores. A fourth signal is generated which represents a position of the partial image corresponding to the maximum score. The partial-image position is defined as being relative to the inspected-object image. An invalid area of the reference image is determined according to a fifth signal representing a predetermined unreliable image area.

Abstract: A camera is part of an appearance inspection apparatus which observes electronic components soldered to a printed circuit board from a position located directly above the electronic components. The apparatus includes an illuminating light which is emitted toward the electronic components. A laser beam which is emitted from a laser oscillator to an emission area overlaps a viewing field of a camera. The camera is for acquiring image data of the electronic component. Also included is a photo sensor which is disposed obliquely above the emission area which receives the reflected light of the laser beam which has been reflected by the solder. Also included is a moving apparatus for moving the printed circuit board in a horizontal direction relative to the camera and laser oscillator. The image data is acquired and the solder height is measured at substantially the same time. As a result, inspection time is shortened.

Abstract: An image taking device serves to take an image of an object to be inspected, and outputs an image signal representative thereof. A first deciding device serves to decide a condition of the object in response to the image signal. A measuring device serves to measure a shape of the object, and outputs a height signal representative of a height of the object. A second deciding device serves to decide a condition of the object in response to the height signal. A control device serves to, in cases where the first deciding device can not detect the condition of the object, enable the measuring device to measure the shape of the object and enable the second deciding device to decide the condition of the object, and enable the first deciding device to execute a leaning process on the object in response to a result of the decision by the second deciding device.

Abstract: A solder portion is inspected as follows. An image of the solder portion is obtained. The image of the solder portion is collated with a plurality of predetermined reference patterns corresponding to different solder portion types respectively. A type of the solder portion is identified in response to a result of the collation. A decision is made as to whether the solder portion is satisfactory or unsatisfactory in response to the identified type thereof.

Abstract: A pattern matching apparatus comprises a camera for observing an object to be detected, an image memory for storing data of a plurality of pixels input to the camera as unit date by deviating, or shifting overlapping unit data by one unit pixel in successive addresses, a reference pattern memory for storing data of a plurality of pixels of a reference pattern as unit data in successive addresses, and a matching circuit for simultaneously matching the unit data stored in the image memory to the unit data stored in the reference pattern memory. The unit data of addresses of the image memory are matched to the unit data of corresponding addresses of the reference pattern memory by the matching circuit.

Abstract: An image of the solder portion is taken. Values of goodness/poorness judgment factors are calculated from the image of the solder portion. Grades of the goodness/poorness judgment factors are calculated from the values of the goodness/poorness judgment factors and from predetermined membership functions of the goodness/poorness judgment factors according to predetermined rules each having a condition part related to the goodness/poorness judgment factors and a conclusion part related to a goodness degree. Partial figures are calculated from predetermined membership functions of the goodness degree and from the calculated grades of the goodness/poorness judgment factors. The partial figures are combined into a final figure. A position of a centroid of the final figure is calculated. A decision is made as to whether or not the solder portion is good on the basis of the calculated position of the centroid with respect to a predetermined judgment scale.

Abstract: In a height measurement apparatus, a laser light beam is applied to a surface of a height-measurement object. A portion of the laser light beam is reflected at the surface of the object. An optical position sensor is exposed to the portion of the laser light beam which is reflected at the surface of the object. The optical position sensor generates a position signal depending on a point at which the reflected laser light beam meets the optical position sensor. The position signal represents a height of the surface of the object. A position of the laser light beam is vibrated relative to the surface of the object. The height represented by the position signal is temporally averaged into a mean height while the position of the laser light beam is vibrated relative to the surface of the object. The mean height is defined as a final measurement result.

Abstract: The surface of a solder portion is specular. Besides, it includes a flat plane, a steep inclined plane and a gentle inclined plane. Accordingly, when light is projected toward the solder portion in a specified direction and light reflected from the solder portion is observed with a camera, an image having the contrast between brightness and darkness is obtained. The present invention utilizes such light reflection characteristics of the solder portion in order to judge whether the shape of the solder portion is good or bad. According to the present invention, light is projected toward a solder portion for bonding the electrode of an electrical component to a substrate, in directions of at least two angles, and the solder portion is observed by a camera disposed above this solder portion. Subsequently, image data items picked up at the respective angles by the camera are stored in corresponding image memories, and the image data items are processed in combination by an image processor.

Abstract: The upper-limit height of a solder portion based on the thickness of a lead or a chip is set, and the maximum height of the solder portion measured with a laser beam is compared with the set upper-limit height, thereby to judge the acceptance or rejection of the shape of the solder portion. In addition, the lower-limit height of a solder portion based on the thickness of a lead or a chip is set, and the maximum height of the solder portion measured with a laser beam is compared with the set lower-limit height, thereby to judge the acceptance or rejection of the shape of the solder portion. Besides, the lower-limit wetting angle of a solder fillet is set, and the wetting angle of the solder fillet measured with a laser beam is compared with the set lower-limit wetting angle, thereby to judge the acceptance or rejection of the shape of the solder fillet.

Abstract: A laser beam is projected from above toward a solder fillet for bonding the corresponding one of leads of an electronic component to a circuit board. The laser beam is reflected by the solder fillet, and the reflected beam is received by light receiving means disposed above and aslant the leads, thereby to measure a shape of the solder fillet.

Abstract: A method of inspecting an electronic device soldered on a circuit board including the steps of (a) observing an electronic device to be inspected using a camera; (b) judging whether the electronic device is properly mounted, on the basis of the observation conducted in step (a); (c) observing the soldering state of the electronic device which has been judged in step (b) to be properly mounted using the camera; (d) judging whether said electronic device is properly soldered, on the basis of the observation conducted in step (c); (e) irradiating a laser beam toward a soldered portion of an electronic device which has been judged in step (d) to be improperly soldered; (f) receiving a laser beam reflected from the soldered portion and measuring a shape of the soldered portion using the received laser beam; and (g) judging whether the electronic device is properly soldered on the basis of the measurement conducted in step (f).

Abstract: An apparatus for inspecting electronic devices mounted on a circuit board is disclosed. The apparatus includes: a camera for forming an image of a view of an electronic device to be inspected; a laser device for emitting laser light toward the device to be inspected; a laser light detector for detecting a laser beam reflected from the device to be inspected; and a control unit for inspecting the condition of mounting the device to be inspected on the circuit board based on data obtained from the camera and the laser detector. Rough inspections are performed first by the camera which can rapidly perform the inspection, and then only failing devices are inspected by the combination of the laser device and detector which is capable of precisely measuring the solder shape. Therefore, visual inspection for various items is performed at an overall faster rate while maintaining the required inspection level.

Abstract: A method for enhancing the reliability of output data from a label reader adapted to read a bar code consisting of a plurality of bars. Each bar in the bar code is scanned at a plurality of points and sets of binary symbols representative of the scanned points along each bar are obtained. Two sums are then formed for each bar, the first being the number of binary "1"s in the set and the second being the number of binary "0"s in the set, and the ratio of two sums is computed. If the ratio is larger than (1+.alpha.) for .alpha.>0, then the data corresponding to the numerator sum is regarded as reliable. If the ratio is less than (1-.beta.) for 0<.beta.<1, then the data corresponding to the denominator sum is regarded as reliable. If the ratio is equal to or larger than (1-.beta.) but equal to or less than (1+.alpha.), then the data is regarded as unreliable.

Abstract: A coincidence testing method for enhancing the reliability of output data from a label reader adapted to read a bar code consisting of a plurality of bars. Each bar in the bar code is scanned at a plurality of points and sets of binary symbols representative of the scanned points along each bar are obtained. Then the binary symbols in each set are ordered to correspond to the order of the scanned points or segments along each bar. Then coincidence tests are performed on successive pairs of binary symbols in each set to determine whether a reliable decision can be made for each bar.

Abstract: A method and apparatus for reading label bar codes in which a photoelectric signal representative of an optically scanned bar code label is differentiated. The positive and negative peaks of the differentiated signal are detected, and the time intervals between the peaks are measured by counter means to produce output signals representative of the bar code label. A multi-level threshold comparison technique is used to detect and predict the occurrence of positive and negative peaks.

Abstract: A data buffer for a label reader system including a data processor. The label reader system includes at least one label reader unit, a first memory means, a second memory means, and a data processor. The first memory means is separately, switchably connected by gate means to a label reading unit, and to the data processor. The second memory means is connected to the data processor. The label reading unit provides a control signal to the gate means so that when data is being transferred between the label reading unit and the first memory means, the data processor then only can transfer data to and from the second memory means. When no data transfer is occurring between the label reading unit and the first memory means, data can then be transferred between and among the first memory means, and second memory means.

Abstract: A laser beam label reader head of single common axis type wherein light reflection coming from a laser-irradiated label along the axis of a scanning laser beam is diverted by an apertured mirror toward a photoelectric converter. The photoelectric converter is provided with means for removing and blocking incident general light coming from sources other than the laser-irradiated label to preclude influences by ambient light and improve S/N ratio.