Patents by Inventor Nobuharu Kami

Nobuharu Kami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090150711
    Abstract: An information processing device includes: storage means containing component information on the components constituting a system having a predetermined function; and processing means for calculating a combination of components necessary for constituting a system required for a service according to the component information, calculating risk information as information on the risk that a physical failure affects the service request for the combination of the components and/or fragment information as information on the deflection degree of the use condition of the components, and ranking the selected component combinations according to a predetermined policy, calculated list information and/or the fragment information.
    Type: Application
    Filed: November 16, 2005
    Publication date: June 11, 2009
    Applicant: NEC CORPORATION
    Inventors: Nobuharu Kami, Takase Yoshikawa
  • Publication number: 20090100248
    Abstract: A lower system structure reports performance information to an upper system structure. When detecting performance deterioration of the system structure on the basis of the reported performance information, the upper system structure optimizes resource redistribution of the system structure that the upper system structure manages. If the performance is improved by the optimization in the managed system structure, the optimization results is applied to the resource control of the lower system structure, and the lower system structure redistributes the resources according to the resource control. If the performance is not improved by the optimization, the lower system structure reports the performance information to the upper system structure, which optimizes the resource redistribution.
    Type: Application
    Filed: March 12, 2007
    Publication date: April 16, 2009
    Applicant: NEC CORPORATION
    Inventor: Nobuharu Kami
  • Publication number: 20080222633
    Abstract: A virtual machine configuration system, comprising a virtualizer for, in a virtualization environment in which a plurality of physical resources connected mutually through a network circuit has been arranged on a computer system sectioned into a plurality of partitions, dynamically changing a physical resource configuration and a virtual machine configuration while simultaneously controlling a configuration of the physical resources of the partition and a configuration of virtual resources allotted to virtual machines without exerting an influence over an application service operating on the virtual machine.
    Type: Application
    Filed: March 3, 2008
    Publication date: September 11, 2008
    Applicant: NEC CORPORATION
    Inventor: Nobuharu Kami
  • Publication number: 20070230458
    Abstract: [PROBLEMS] To enable automatic setting of corresponding relations between data links and bundled links thereof. [MEANS FOR SOLVING PROBLEMS] A temporary bundled link forming device (13) associates data links having the same port attributes within own communication apparatus with the identical temporary bundle link ID. A data link neighbor discovery device (11) obtains the neighboring node IDs of the data links. A bundled link forming device (14) automatically sets, as a bundled link, the data links having the same neighboring node IDs obtained by the data link neighbor discovery device (11), among the data links that are associated with the same temporary bundled link ID by the temporary bundled link forming device (13).
    Type: Application
    Filed: June 24, 2005
    Publication date: October 4, 2007
    Applicant: NEC Corporation
    Inventors: Teruyuki Baba, Yoshihiko Suemura, Nobuharu Kami, Itaru Nishioka
  • Patent number: 7167653
    Abstract: An optical transceiver having a transmitter section and a receiver section formed on a substrate to be close to each other is provided, which suppresses the electrical and optical crosstalk between the transmitter section and the receiver section. The transceiver comprises: (a) a substrate; (b) a transmitter section formed on the substrate and including a light-emitting element; (c) a receiver section formed on the substrate to be close to the transmitter section and including a light-receiving element; (d) a conductive first connection member fixed near the substrate; and (e) a transparent second connection member fixed near the first member in such a way as to block the first opening and the second opening of the first member from a front of the first member. The first member has a first opening that allows a first light beam to penetrate the first member and a second opening that allows a second light beam to penetrate the first member.
    Type: Grant
    Filed: December 27, 2001
    Date of Patent: January 23, 2007
    Assignee: NEC Corporation
    Inventors: Kazuhiko Kurata, Nobuharu Kami
  • Patent number: 6696755
    Abstract: A semiconductor device comprises: an insulating flexible film capable of changing its profile; first and second conductive layers provided on both surfaces of the flexible film and constituting wiring patterns; an LSI mounted on the first conductive layer; a conductor provided in a hole formed in the flexible film and making connection between the wiring pattern formed in the first conductive layer and the wiring pattern formed in the second wiring pattern; a stiffener; and a heat spreader. A part of the wiring pattern constituted by each of the first conductive layer and the second wiring pattern is a conductive wiring, whose characteristic impedance is previously calculated, for a high-speed signal and a connection portion for making connection to a mother board is provided on an end of the conductive wiring for a high-speed signal.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: February 24, 2004
    Assignee: NEC Corporation
    Inventors: Nobuharu Kami, Kazuhiko Kurata, Satoshi Doumae, Takara Sugimoto
  • Patent number: 6663295
    Abstract: An optical transmitter-receiver module includes: an electrically conductive platform substrate having a transmitter region and a receiver region; a first insulating film extending over the transmitter region and the receiver region of the electrically conductive platform substrate; a first electrically conductive layer having a first fixed-potential, and the first electrically conductive layer extending over the first insulating film; a second insulating film selectively extending over the first electrically conductive layer; an optical receiver circuit including a light-receiving device and existing over the second insulating film; an optical transmitter circuit including a light-emitting device existing on the first insulating film; and a first electrically conductive shielding member spatially isolating the optical receiver circuit from the optical transmitter circuit, and being electrically coupled to the first electrically conductive layer.
    Type: Grant
    Filed: January 28, 2002
    Date of Patent: December 16, 2003
    Assignee: NEC Corporation
    Inventors: Nobuharu Kami, Kazuhiko Kurata, Mikio Oda
  • Publication number: 20030173663
    Abstract: A semiconductor device comprises: an insulating flexible film capable of changing its profile; first and second conductive layers provided on both surfaces of the flexible film and constituting wiring patterns; an LSI mounted on the first conductive layer; a conductor provided in a hole formed in the flexible film and making connection between the wiring pattern formed in the first conductive layer and the wiring pattern formed in the second wiring pattern; a stiffener; and a heat spreader. A part of the wiring pattern constituted by each of the first conductive layer and the second wiring pattern is a conductive wiring, whose characteristic impedance is previously calculated, for a high-speed signal and a connection portion for making connection to a mother board is provided on an end of the conductive wiring for a high-speed signal.
    Type: Application
    Filed: March 14, 2003
    Publication date: September 18, 2003
    Applicant: NEC CORPORATION
    Inventors: Nobuharu Kami, Kazuhiko Kurata, Satoshi Doumae, Takara Sugimoto
  • Publication number: 20030091303
    Abstract: An optical transmitter-receiver module includes: an electrically conductive platform substrate having a transmitter region and a receiver region; a first insulating film extending over the transmitter region and the receiver region of the electrically conductive platform substrate; a first electrically conductive layer having a first fixed-potential, and the first electrically conductive layer extending over the first insulating film; a second insulating film selectively extending over the first electrically conductive layer; an optical receiver circuit including a light-receiving device and existing over the second insulating film; an optical transmitter circuit including a light-emitting device existing on the first insulating film; and a first electrically conductive shielding member spatially isolating the optical receiver circuit from the optical transmitter circuit, and being electrically coupled to the first electrically conductive layer.
    Type: Application
    Filed: January 28, 2002
    Publication date: May 15, 2003
    Applicant: NEC CORPORATION
    Inventors: Nobuharu Kami, Kazuhiko Kurata, Mikio Oda
  • Publication number: 20020085254
    Abstract: An optical transceiver having a transmitter section and a receiver section formed on a substrate to be close to each other is provided, which suppresses the electrical and optical crosstalk between the transmitter section and the receiver section. The transceiver comprises: (a) a substrate; (b) a transmitter section formed on the substrate and including a light-emitting element; (c) a receiver section formed on the substrate to be close to the transmitter section and including a light-receiving element; (d) a conductive first connection member fixed near the substrate; and (e) a transparent second connection member fixed near the first member in such a way as to block the first opening and the second opening of the first member from a front of the first member. The first member has a first opening that allows a first light beam to penetrate the first member and a second opening that allows a second light beam to penetrate the first member.
    Type: Application
    Filed: December 27, 2001
    Publication date: July 4, 2002
    Applicant: NEC CORPORATION
    Inventors: Kazuhiko Kurata, Nobuharu Kami