Patents by Inventor Nobuharu Noji
Nobuharu Noji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9406480Abstract: A substrate is irradiated by primary electrons and secondary electrons generated from the substrate are detected by a detector. A reference die is placed on the stage to obtain a pattern matching template image including feature coordinates of the reference die. A pattern matching is performed with an arbitrary die in a row or column including the reference die using the template image to obtain feature coordinates of the arbitrary die. An angle of misalignment is calculated between the direction of the row or column including the reference die and one of the directions of movement of the substrate on the basis of the feature coordinates of the arbitrary die and those of the reference die. The stage is rotated to correct the angle of misalignment to conform the direction of the row or column including the reference die with the one of the directions of movement of the substrate.Type: GrantFiled: January 14, 2015Date of Patent: August 2, 2016Assignee: EBARA CORPORATIONInventors: Nobuharu Noji, Tohru Satake, Hirosi Sobukawa, Toshifumi Kimba, Masahiro Hatakeyama, Shoji Yoshikawa, Takeshi Murakami, Kenji Watanabe, Tsutomu Karimata, Kenichi Suematsu, Yutaka Tabe, Ryo Tajima, Keiichi Tohyama
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Patent number: 9390886Abstract: An electron beam apparatus for capturing images by deflecting a primary electron beam by a deflector to irradiate each of sub-visual fields which are formed by dividing an evaluation area on a sample surface, and detecting secondary electrons containing information on the sample surface in each of the sub-visual fields by a detecting device. The detecting device includes a plurality of unit detectors each including an area sensor, a bundle of optical fibers having one end coupled to a detection plane of the area sensor, and an FOP coated on the other end of the bundle of optical fibers and formed with a scintillator, on which a secondary electron beam emitted from the respective sub-visual field is focused. An electromagnetic deflector deflects the secondary electron beam each time the electron beam is irradiated to the next sub-visual field to move the secondary electron beams over the surfaces of the FOPs.Type: GrantFiled: February 17, 2006Date of Patent: July 12, 2016Assignee: EBARA CORPORATIONInventors: Mamoru Nakasuji, Nobuharu Noji, Tohru Satake, Hirosi Sobukawa
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Patent number: 9368314Abstract: An inspection apparatus by an electron beam comprises: an electron-optical device 70 having an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical systems; a stage system 50 for holding and moving the object relative to the electron-optical system; a mini-environment chamber 20 for supplying a clean gas to the object to prevent dust from contacting the object; a working chamber 31 for accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambers 41, 42 disposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; and a loader 60 for transferring the object to the stage system through the loading chambers.Type: GrantFiled: June 30, 2014Date of Patent: June 14, 2016Assignee: EBARA CORPORATIONInventors: Mamoru Nakasuji, Nobuharu Noji, Tohru Satake, Masahiro Hatakeyama, Toshifumi Kimba, Hirosi Sobukawa, Shoji Yoshikawa, Takeshi Murakami, Kenji Watanabe, Tsutomu Karimata, Shin Oowada, Mutsumi Saito, Yuichiro Yamazaki, Takamitsu Nagai, Ichirota Nagahama
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Publication number: 20150122993Abstract: A substrate is irradiated by primary electrons and secondary electrons generated from the substrate are detected by a detector. A reference die is placed on the stage to obtain a pattern matching template image including feature coordinates of the reference die. A pattern matching is performed with an arbitrary die in a row or column including the reference die using the template image to obtain feature coordinates of the arbitrary die. An angle of misalignment is calculated between the direction of the row or column including the reference die and one of the directions of movement of the substrate on the basis of the feature coordinates of the arbitrary die and those of the reference die. The stage is rotated to correct the angle of misalignment to conform the direction of the row or column including the reference die with the one of the directions of movement of the substrate.Type: ApplicationFiled: January 14, 2015Publication date: May 7, 2015Applicant: EBARA CORPORATIONInventors: Nobuharu Noji, Tohru Satake, Hirosi Sobukawa, Toshifumi Kimba, Masahiro Hatakeyama, Shoji Yoshikawa, Takeshi Murakami, Kenji Watanabe, Tsutomu Karimata, Kenichi Suematsu, Yutaka Tabe, Ryo Tajima, Keiichi Tohyama
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Patent number: 8946631Abstract: A substrate is irradiated by primary electrons and secondary electrons generated from the substrate are detected by a detector. A reference die is placed on the stage to obtain a pattern matching template image including feature coordinates of the reference die. A pattern matching is performed with an arbitrary die in a row or column including the reference die using the template image to obtain feature coordinates of the arbitrary die. An angle of misalignment is calculated between the direction of the row or column including the reference die and one of the directions of movement of the substrate on the basis of the feature coordinates of the arbitrary die and those of the reference die. The stage is rotated to correct the angle of misalignment to conform the direction of the row or column including the reference die with the one of the directions of movement of the substrate.Type: GrantFiled: January 15, 2014Date of Patent: February 3, 2015Assignee: Ebara CorporationInventors: Nobuharu Noji, Tohru Satake, Hirosi Sobukawa, Toshifumi Kimba, Masahiro Hatakeyama, Shoji Yoshikawa, Takeshi Murakami, Kenji Watanabe, Tsutomu Karimata, Kenichi Suematsu, Yutaka Tabe, Ryo Tajima, Keiichi Tohyama
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Publication number: 20140367570Abstract: There is provided a substrate inspection method. The method includes: maintaining a vacuum in said inspection chamber; isolating said inspection chamber from a vibration; positioning the substrate on a stage in the inspection chamber; selecting an evaluation parameter according to a kind of said processing apparatus; and determining inspection regions of the substrate so that an inspection time required per a lot of the substrate is equal to a processing time spent for said processing step required per a lot of the substrate. The method also includes radiating a primary electron beam from an electron gun; deflecting the primary electron beam with an E*B unit; irradiating said inspection regions of the substrate with the deflected primary electron beam; and projecting secondary electrons emitted from said substrate through the E*B unit onto a detector with a secondary optical system.Type: ApplicationFiled: July 8, 2014Publication date: December 18, 2014Applicant: EBARA CORPORATIONInventors: Toshifumi Kimba, Tohru Satake, Tsutomu Karimata, Kenji Watanabe, Nobuharu Noji, Takeshi Murakami, Masahiro Hatakeyama, Mamoru Nakasuji, Hirosi Sobukawa, Shoji Yoshikawa, Shin Oowada, Mutsumi Saito
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Publication number: 20140319346Abstract: An inspection apparatus by an electron beam comprises: an electron-optical device 70 having an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical systems; a stage system 50 for holding and moving the object relative to the electron-optical system; a mini-environment chamber 20 for supplying a clean gas to the object to prevent dust from contacting the object; a working chamber 31 for accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambers 41, 42 disposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; and a loader 60 for transferring the object to the stage system through the loading chambers.Type: ApplicationFiled: June 30, 2014Publication date: October 30, 2014Applicant: EBARA CORPORATIONInventors: Mamoru Nakasuji, Nobuharu Noji, Tohru Satake, Masahiro Hatakeyama, Toshifumi Kimba, Hirosi Sobukawa, Shoji Yoshikawa, Takeshi Murakami, Kenji Watanabe, Tsutomu Karimata, Shin Oowada, Mutsumi Saito, Yuichiro Yamazaki, Takamitsu Nagai, Ichirota Nagahama
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Patent number: 8859984Abstract: Provided is a method and an apparatus for inspecting a sample surface with high accuracy. Provided is a method for inspecting a sample surface by using an electron beam method sample surface inspection apparatus, in which an electron beam generated by an electron gun of the electron beam method sample surface inspection apparatus is irradiated onto the sample surface, and secondary electrons emanating from the sample surface are formed into an image toward an electron detection plane of a detector for inspecting the sample surface, the method characterized in that a condition for forming the secondary electrons into an image on a detection plane of the detector is controlled such that a potential in the sample surface varies in dependence on an amount of the electron beam irradiated onto the sample surface.Type: GrantFiled: July 30, 2013Date of Patent: October 14, 2014Assignee: Ebara CorporationInventors: Nobuharu Noji, Yoshihiko Naito, Hirosi Sobukawa, Kenji Terao, Masahiro Hatakeyama, Katsuya Okumura
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Patent number: 8822919Abstract: A substrate inspection apparatus 1-1 (FIG.Type: GrantFiled: January 6, 2011Date of Patent: September 2, 2014Assignee: Ebara CorporationInventors: Toshifumi Kimba, Tohru Satake, Tsutomu Karimata, Kenji Watanabe, Nobuharu Noji, Takeshi Murakami, Masahiro Hatakeyama, Mamoru Nakasuji, Hirosi Sobukawa, Shoji Yoshikawa, Shin Oowada, Mutsumi Saito
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Patent number: 8803103Abstract: An inspection apparatus by an electron beam comprises: an electron-optical device 70 having an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical system; a stage system 50 for holding and moving the object relative to the electron-optical system; a mini-environment chamber 20 for supplying a clean gas to the object to prevent dust from contacting to the object; a working chamber 31 for accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambers 41, 42 disposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; and a loader 60 for transferring the object to the stage system through the loading chambers.Type: GrantFiled: January 2, 2013Date of Patent: August 12, 2014Assignees: Ebara Corporation, Kabushiki Kaisha ToshibaInventors: Mamoru Nakasuji, Nobuharu Noji, Tohru Satake, Masahiro Hatakeyama, Toshifumi Kimba, Hirosi Sobukawa, Shoji Yoshikawa, Takeshi Murakami, Kenji Watanabe, Tsutomu Karimata, Shin Oowada, Mutsumi Saito, Yuichiro Yamazaki, Takamitsu Nagai, Ichirota Nagahama
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Patent number: 8796621Abstract: An inspecting apparatus for reducing a time loss associated with a work for changing a detector is characterized by comprising a plurality of detectors 11, 12for receiving an electron beam emitted from a sample W to capture image data representative of the sample W, and a switching mechanism M for causing the electron beam to be incident on one of the plurality of detectors 11, 12, where the plurality of detectors 11, 12 are disposed in the same chamber MC. The plurality of detectors 11, 12 can be an arbitrary combination of a detector comprising an electron sensor for converting an electron beam into an electric signal with a detector comprising an optical sensor for converting an electron beam into light and converting the light into an electric signal. The switching mechanism M may be a mechanical moving mechanism or an electron beam deflector.Type: GrantFiled: March 29, 2013Date of Patent: August 5, 2014Assignee: Ebara CorporationInventors: Masahiro Hatakeyama, Shoji Yoshikawa, Kenichi Suematsu, Tsutomu Karimata, Nobuharu Noji
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Publication number: 20140158885Abstract: A system for further enhancing speed, i.e. improving throughput in a SEM-type inspection apparatus is provided. An inspection apparatus for inspecting a surface of a substrate produces a crossover from electrons emitted from an electron beam source 25•1, then forms an image under a desired magnification in the direction of a sample W to produce a crossover. When the crossover is passed, electrons as noises are removed from the crossover with an aperture, an adjustment is made so that the crossover becomes a parallel electron beam to irradiate the substrate in a desired sectional form. The electron beam is produced such that the unevenness of illuminance is 10% or less. Electrons emitted from the sample W are detected by a detector 25•11.Type: ApplicationFiled: January 15, 2014Publication date: June 12, 2014Applicant: EBARA CORPORATIONInventors: Nobuharu Noji, Tohru Satake, Hirosi Sobukawa, Toshifumi Kimba, Masahiro Hatakeyama, Shoji Yoshikawa, Takeshi Murakami, Kenji Watanabe, Tsutomu Karimata, Kenichi Suematsu, Yutaka Tabe, Ryo Tajima, Keiichi Tohyama
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Patent number: 8742341Abstract: A system for further enhancing speed, i.e. improving throughput in a SEM-type inspection apparatus is provided. An inspection apparatus for inspecting a surface of a substrate produces a crossover from electrons emitted from an electron beam source 25•1, then forms an image under a desired magnification in the direction of a sample W to produce a crossover. When the crossover is passed, electrons as noises are removed from the crossover with an aperture, an adjustment is made so that the crossover becomes a parallel electron beam to irradiate the substrate in a desired sectional form. The electron beam is produced such that the unevenness of illuminance is 10% or less. Electrons emitted from the sample W are detected by a detector 25•11.Type: GrantFiled: May 27, 2010Date of Patent: June 3, 2014Assignee: Ebara CorporationInventors: Nobuharu Noji, Tohru Satake, Hirosi Sobukawa, Toshifumi Kimba, Masahiro Hatakeyama, Shoji Yoshikawa, Takeshi Murakami, Kenji Watanabe, Tsutomu Karimata, Kenichi Suematsu, Yutaka Tabe, Ryo Tajima, Keiichi Tohyama
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Patent number: 8674317Abstract: The present invention provides a surface inspection method and apparatus for inspecting a surface of a sample, in which a resistive film is coated on the surface, and a beam is irradiated to the surface having the resistive film coated thereon, to thereby conduct inspection of the surface of the sample. In the surface inspection method of the present invention, a resistive film having an arbitrarily determined thickness t1 is first coated on a surface of a sample. Thereafter, a part of the resistive film having the arbitrarily determined thickness t1 is dissolved in a solvent, to thereby reduce the thickness of the resistive film to a desired level. This enables precise control of a value of resistance of the resistive film and suppresses distortion of an image to be detected.Type: GrantFiled: November 4, 2011Date of Patent: March 18, 2014Assignee: Ebara CorporationInventors: Masahiro Hatakeyama, Kenji Watanabe, Takeshi Murakami, Tohru Satake, Nobuharu Noji
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Publication number: 20130313429Abstract: Provided is a method and an apparatus for inspecting a sample surface with high accuracy. Provided is a method for inspecting a sample surface by using an electron beam method sample surface inspection apparatus, in which an electron beam generated by an electron gun of the electron beam method sample surface inspection apparatus is irradiated onto the sample surface, and secondary electrons emanating from the sample surface are formed into an image toward an electron detection plane of a detector for inspecting the sample surface, the method characterized in that a condition for forming the secondary electrons into an image on a detection plane of the detector is controlled such that a potential in the sample surface varies in dependence on an amount of the electron beam irradiated onto the sample surface.Type: ApplicationFiled: July 30, 2013Publication date: November 28, 2013Applicant: EBARA CORPORATIONInventors: Nobuharu Noji, Yoshihiko Naito, Hirosi Sobukawa, Kenji Terao, Masahiro Hatakeyama, Katsuya Okumura
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Publication number: 20130228684Abstract: An inspecting apparatus for reducing a time loss associated with a work for changing a detector is characterized by comprising a plurality of detectors 11, 12 for receiving an electron beam emitted from a sample W to capture image data representative of the sample W, and a switching mechanism M for causing the electron beam to be incident on one of the plurality of detectors 11, 12, where the plurality of detectors 11, 12 are disposed in the same chamber MC. The plurality of detectors 11, 12 can be an arbitrary combination of a detector comprising an electron sensor for converting an electron beam into an electric signal with a detector comprising an optical sensor for converting an electron beam into light and converting the light into an electric signal. The switching mechanism M may be a mechanical moving mechanism or an electron beam deflector.Type: ApplicationFiled: March 29, 2013Publication date: September 5, 2013Applicant: EBARA CORPORATIONInventors: Masahiro Hatakeyama, Shoji Yoshikawa, Kenichi Suematsu, Tsutomu Karimata, Nobuharu Noji
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Patent number: 8525127Abstract: Provided is a method and an apparatus for inspecting a sample surface with high accuracy. Provided is a method for inspecting a sample surface by using an electron beam method sample surface inspection apparatus, in which an electron beam generated by an electron gun of the electron beam method sample surface inspection apparatus is irradiated onto the sample surface, and secondary electrons emanating from the sample surface are formed into an image toward an electron detection plane of a detector for inspecting the sample surface, the method characterized in that a condition for forming the secondary electrons into an image on a detection plane of the detector is controlled such that a potential in the sample surface varies in dependence on an amount of the electron beam irradiated onto the sample surface.Type: GrantFiled: February 16, 2012Date of Patent: September 3, 2013Assignee: Ebara CorporationInventors: Nobuharu Noji, Yoshihiko Naito, Hirosi Sobukawa, Kenji Terao, Masahiro Hatakeyama, Katsuya Okumura
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Patent number: 8431892Abstract: An inspecting apparatus for reducing a time loss associated with a work for changing a detector is characterized by comprising a plurality of detectors 11, 12 for receiving an electron beam emitted from a sample W to capture image data representative of the sample W, and a switching mechanism M for causing the electron beam to be incident on one of the plurality of detectors 11, 12, where the plurality of detectors 11, 12 are disposed in the same chamber MC. The plurality of detectors 11, 12 can be an arbitrary combination of a detector comprising an electron sensor for converting an electron beam into an electric signal with a detector comprising an optical sensor for converting an electron beam into light and converting the light into an electric signal. The switching mechanism M may be a mechanical moving mechanism or an electron beam deflector.Type: GrantFiled: October 6, 2010Date of Patent: April 30, 2013Assignee: Ebara CorporationInventors: Masahiro Hatakeyama, Shoji Yoshikawa, Kenichi Suematsu, Tsutomu Karimata, Nobuharu Noji
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Publication number: 20130032716Abstract: An electron beam apparatus, in which an electron beam emitted from an electron gun having a cathode and an anode is focused and irradiated onto a sample, and secondary electrons emanated from the sample are directed into a detector, the apparatus further comprising means for optimizing irradiation of the electron beam emitted from the electron gun onto the sample, the optimizing means may be two-stage deflectors disposed in proximity to the electron gun which deflects and directs the electron beam emitted in a specific direction so as to be in alignment with the optical axis direction of the electron beam apparatus, the electron beam emitted in the specific direction being at a certain angle with respect to the optical axis due to the fact that, among the crystal orientations of said cathode, a specific crystal orientation allowing a higher level of electron beam emission out of alignment with the optical axis direction.Type: ApplicationFiled: January 11, 2008Publication date: February 7, 2013Applicant: Ebara CorporationInventors: Mamoru Nakasuji, Takao Kato, Nobuharu Noji, Tohru Satake, Takeshi Murakami, Kenji Watanabe
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Patent number: 8368016Abstract: An electron beam apparatus, in which an electron beam emitted from an electron gun having a cathode and an anode is focused and irradiated onto a sample, and secondary electrons emanated from the sample are directed into a detector, the apparatus further comprising means for optimizing irradiation of the electron beam emitted from the electron gun onto the sample, the optimizing means may be two-stage deflectors disposed in proximity to the electron gun which deflects and directs the electron beam emitted in a specific direction so as to be in alignment with the optical axis direction of the electron beam apparatus, the electron beam emitted in the specific direction being at a certain angle with respect to the optical axis due to the fact that, among the crystal orientations of said cathode, a specific crystal orientation allowing a higher level of electron beam emission out of alignment with the optical axis direction.Type: GrantFiled: January 11, 2008Date of Patent: February 5, 2013Assignee: Ebara CorporationInventors: Mamoru Nakasuji, Takao Kato, Nobuharu Noji, Tohru Satake, Takeshi Murakami, Kenji Watanabe