Abstract: The present invention comprises a metal bond grind stone having a flat plate portion 10a and a tapered portion 10b; an electrode 13 opposed to the metal bond grind stone with a gap therebetween; voltage applying means 12 for applying a direct-current pulse voltage between the metal bond grind stone and the electrode; conductive liquid supplying means 14 for supplying a conductive liquid 15 between the metal bond grind stone and the electrode; and grind stone moving means 16 for moving the metal bond grind stone in a direction orthogonal to the shaft center thereof, and an ingot 1 of a single crystal SiC is thereby cut at the tapered portion 10b of the metal bond grind stone and the cut surface is then specular-worked at the flat plate portion 10a.

Abstract: There is here disclosed a metal-less bond grinding stone for protrusion of grains on the grinding stone by electrolytic dressing, comprising abrasive grains and a bond portion for holding the abrasive grains, wherein the bond portion comprises a carbon-containing nonmetallic material alone. Furthermore, this metal-less bond grinding stone is used, whereby a current which is allowed to flow between the grinding stone and the electrode is controlled within a desired range. In this way, environmental pollution with a waste liquid containing heavy metal ions and metal contamination of device wafers can be prevented, and a mirror-like high-quality level ground surface can be obtained with a satisfactory efficiency.

Abstract: An ELID centerless grinding apparatus comprising: a blade 2 for horizontally supporting a rotator workpiece 1 and and a regulating wheel 10 driven to rotate around a horizontal shaft center. An outer surface of the workpiece is subjected to ELID grinding by using a conductive grinding wheel 4. An outer peripheral portion of the wheel 10 includes a conductive elastic member 11 and abrasion resisting particles 12. An electrolytic electrode 14 is provided in close vicinity to an outer peripheral surface of the wheel 10. An electrolytic power supply 16 applies an electrolytic voltage between the electrolytic electrode and the wheel. A conductive electrolytic fluid is flow between the electrode and the wheel and the member 11 is removed by the electrolytic dressing to cause the abrasion resisting particles 12 to project, while the particles 12 are brought into contact with the outer peripheral surface of the workpiece 1 to rotate around its shaft center.

Abstract: There is provided a conductive grinding wheel 10 rotating centering on a vertical shaft center and including a horizontal working surface 10a, and the grinding wheel comprises a conductive base member 11 formed of an integrally molded flat plate, and a plurality of fan-shaped segments 12 detachably attached to the base member to entirely constitute the annular working surface. Each segment comprises a base metal 12a directly attached to the base member and a grinding wheel part 12b formed on the surface of the base metal. Moreover, the grinding wheel part comprises a recessed groove 14 for partitioning the working surface into a plurality of working areas 13, and an electrolytic fluid supply hole 15 for directly supplying the electrolytic fluid to the respective working areas, so that the electrolytic fluid is supplied to the respective electrolytic fluid supply holes through the base member.

Abstract: A metal bond grinding wheel 12 having a horizontal working surface 12a, a holding and rotating means 14 for a workpiece having a horizontal supporting surface 14a opposite to said working surface 12a, a voltage applying means 16 having the metal bond grinding wheels and an electrode 16a installed oppositely to the working surfaces in an uncontacted state and applying a pulsed voltage between them, a grinding fluid feeding means 18 for feeding an electroconductive grinding fluid to the working surfaces are installed.

Abstract: The method disclosed here comprises the steps of (a) mixing metal powder, a resin, abrasive grains, and a solid reducing agent at the normal (room) temperature through the melting point of the reducing agent to form a mixture and (b) molding and baking the mixture at the melting point of the reducing agent through that of the metal powder. The solid reducing agent is a fatty acid, preferably stearic acid having a volume ratio of 5 to 20% with respect to the metal powder. With is, it is possible to make metal-resin bond grindstones that give such high-quality mirror surfaces that have conductivity fit for ELID grinding and are not liable to have chippings or scratches and also have an Rmax value of approximately 3 nm or less.