Patents by Inventor Nobuhide Kasae

Nobuhide Kasae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molded package for light emitting device
    Patent number: 10297728
    Abstract: The present invention provides a molded package for a light emitting device including a molded resin and first and second leads, the exposed surface of the first lead having a first and second edge portions opposed to each other so as to put a mounting area therebetween in a first direction, the first and second edge portions respectively having one first cutout and second cutouts, the mounting area having a size not less than a distance between the first and the second cutouts and less than a distance between the first the second edge portions in the first direction.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: May 21, 2019
    Assignee: Nichia Corporation
    Inventors: Nobuhide Kasae, Keisuke Sejiki
  • MOLDED PACKAGE FOR LIGHT EMITTING DEVICE
    Publication number: 20150340572
    Abstract: The present invention provides a molded package for a light emitting device including a molded resin and first and second leads, the exposed surface of the first lead having a first and second edge portions opposed to each other so as to put a mounting area therebetween in a first direction, the first and second edge portions respectively having one first cutout and second cutouts, the mounting area having a size not less than a distance between the first and the second cutouts and less than a distance between the first the second edge portions in the first direction.
    Type: Application
    Filed: June 19, 2015
    Publication date: November 26, 2015
    Applicant: NICHIA CORPORATION
    Inventors: Nobuhide KASAE, Keisuke SEJIKI
  • Molded package for light emitting device
    Patent number: 9093621
    Abstract: The present invention provides a molded package for a light emitting device including a molded resin and first and second leads, the exposed surface of the first lead having a first and second edge portions opposed to each other so as to put a mounting area therebetween in a first direction, the first and second edge portions respectively having one first cutout and second cutouts, the mounting area having a size not less than a distance between the first and the second cutouts and less than a distance between the first the second edge portions in the first direction.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: July 28, 2015
    Assignee: NICHIA CORPORATION
    Inventors: Nobuhide Kasae, Keisuke Sejiki
  • Light emitting device
    Patent number: 7815343
    Abstract: The present invention provides a light emitting device which has high reliability and long service life by suppressing the sealing resin from peeling off the inner edge of the opening of the recess of the housing.
    Type: Grant
    Filed: August 2, 2007
    Date of Patent: October 19, 2010
    Assignee: Nichia Corporation
    Inventors: Ikuya Nii, Hiroaki Ukawa, Nobuhide Kasae, Toshimasa Takao
  • Light emitting device
    Publication number: 20080037252
    Abstract: The present invention provides a light emitting device which has high reliability and long service life by suppressing the sealing resin from peeling off the inner edge of the opening of the recess of the housing.
    Type: Application
    Filed: August 2, 2007
    Publication date: February 14, 2008
    Applicant: NICHIA CORPORATION, a corporation of Japan
    Inventors: Ikuya Nii, Hiroaki Ukawa, Nobuhide Kasae, Toshimasa Takao
  • Light emitting diode
    Patent number: D508233
    Type: Grant
    Filed: August 26, 2003
    Date of Patent: August 9, 2005
    Assignee: Nichia Corporation
    Inventors: Nobuhide Kasae, Tetsuya Yagi