Patents by Inventor Nobuhiko Betsuda

Nobuhiko Betsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9236551
    Abstract: According to one embodiment, there is provided a light-emitting device including a light-emitting section, a thermal radiation member, and a heat conduction layer. The light-emitting section includes a mounting substrate section and a light-emitting element section. The mounting substrate section includes a substrate, a first metal layer, and a second metal layer. The substrate includes a first principal plane including a mounting region and a second principal plane. The first metal layer includes mounting patterns provided in the mounting region. The light-emitting element section includes semiconductor light-emitting elements and a wavelength conversion layer. The semiconductor light-emitting elements are connected to the mounting patterns. The luminous existence of the light-emitting element section is equal to or higher than 10 lm/mm2 and equal to or lower than 100 lm/mm2. The thermal radiation member has an area equal to or larger than five times the area of the mounting region.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: January 12, 2016
    Assignee: Toshiba Lighting & Technology Corporation
    Inventors: Kiyoshi Nishimura, Kazuo Shimokawa, Nobuhiko Betsuda, Akihiro Sasaki, Miho Watanabe, Hirotaka Tanaka, Takuya Honma, Katsuhisa Matsumoto, Hideki Okawa
  • Publication number: 20150144970
    Abstract: According to an exemplary embodiment, there is provided a light emitting device including a ceramic substrate, first to fourth connectors, a plurality of semiconductor light emitting elements, and a first metal layer. The ceramic substrate is provided with a first main surface including first to fourth sides and first to fourth corner portions, and the first main surface includes a mounting region, and first to fourth connector region provided respectively between the first to fourth corner portion and the mounting region. The plurality of semiconductor light emitting elements is provided on the mounting region. The first to fourth connectors are respectively provided on the first to fourth connector regions. A first metal layer is provided between the plurality of semiconductor light emitting elements and the ceramic substrate, and including first to fourth connector electrode portions electrically connected respectively to the first to fourth connectors.
    Type: Application
    Filed: July 18, 2014
    Publication date: May 28, 2015
    Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATION
    Inventors: Nobuhiko Betsuda, Akihiro Sasaki, Hideki Okawa, Kazuo Shimokawa
  • Patent number: 9016924
    Abstract: According to some aspects, a light-emitting module that is small and easy to produce may be provided. On the surface of a board, a light-emitting element and an electrical connection portion electrically connected to the light-emitting element are provided. In some examples, in a position close to the electrical connection portion of the board, a through-hole that penetrates the board is formed. Through the through-hole of the board, an electric wire for supplying electric power to the light-emitting element may be inserted from the back surface of the board to the front surface to be electrically connected to the electrical connection portion.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: April 28, 2015
    Assignee: Toshiba Lighting & Technology Corporation
    Inventor: Nobuhiko Betsuda
  • Publication number: 20150060930
    Abstract: According to an embodiment, a light emitting device includes a heat radiation plate, a semiconductor light emitting element, a mounting substrate section including a ceramic substrate, and first and second metal layers, and a bonding layer. The ceramic substrate is provided between the heat radiation plate and the semiconductor light emitting element. The mounting substrate section contacts the ceramic substrate between the heat radiation plate and the ceramic substrate, and includes a first surface on a side of the heat radiation plate and a side surface intersecting a plane perpendicular to a direction from the heat radiation plate to the semiconductor light emitting element. The bonding layer is provided between the heat radiation plate and the second metal layer, and bonds the heat radiation plate and the second metal layer so as to cover the first surface and to contact a part of the side surface.
    Type: Application
    Filed: February 28, 2014
    Publication date: March 5, 2015
    Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATION
    Inventors: Akihiro Sasaki, Katsuhisa Matsumoto, Nobuhiko Betsuda
  • Patent number: 8872198
    Abstract: According to one embodiment, the light-emitting apparatus is provided with a substrate, a plurality of light-emitting devices, and a phosphor layer. The plurality of light-emitting devices are mounted on the substrate. The phosphor layer is formed of a translucent resin containing a phosphor and includes a phosphor portion that is formed in a convex shape and covers a predetermined number of the light-emitting device. Bases of the adjacent phosphor portions are formed by being linked with one another.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: October 28, 2014
    Assignee: Toshiba Lighting & Technology Corporation
    Inventors: Soichi Shibusawa, Kiyoshi Nishimura, Kozo Ogawa, Nobuhiko Betsuda, Shuhei Matsuda, Masatoshi Kumagai
  • Patent number: 8820950
    Abstract: According to one embodiment, a light emitting device which is attached to an illumination apparatus and radiates light having a correlated color temperature of 2900 to 3600K is provided. The light emitting device includes a substrate, blue light emitting LED elements and red light emitting LED elements mounted on the substrate, and a wavelength converting unit. The red light emitting LED elements have a luminous intensity of 0.2 to 2.5 times as large as that of the blue light emitting LED elements at normal use temperature in a state where the light emitting device is attached to the illumination apparatus. The wavelength converting unit is excited by light emitted from the blue light emitting LED elements and converts the light to light having a peak wavelength within a range of 500 to 600 nm.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: September 2, 2014
    Assignee: Toshiba Lighting & Technology Corporation
    Inventors: Shuhei Matsuda, Soichi Shibusawa, Nobuhiko Betsuda, Kiyoshi Nishimura
  • Patent number: 8816381
    Abstract: According to one embodiment, a light-emitting device includes a substrate, a plurality of pads and a plurality of light-emitting elements. The pads has electric conductance, and are arranged on the substrate. A reflecting layer which is formed by electroplating is provided on a surface of each of the pads. The light-emitting elements are mounted on the pads. A depressed part is left on the substrate. The depressed part is formed on the substrate by removing a pattern on the substrate, by which the pads are electrically connected.
    Type: Grant
    Filed: October 26, 2010
    Date of Patent: August 26, 2014
    Assignee: Toshiba Lighting & Technology Corporation
    Inventors: Nobuhiko Betsuda, Kozo Ogawa, Koyoshi Nishimura, Soichi Shibusawa
  • Patent number: 8770795
    Abstract: A light-emitting device includes a substrate, and a plurality of light-emitting elements mounted on the substrate. The light-emitting elements are placed to meet conditions that the number B of light-emitting elements per unit area (cm2) of a mounting part is not less than 0.4 and a mean mounting density D is not less than 58 to not greater than 334, when a relationship of formula “D=A×B” is established, assuming D as a mean mounting density of light-emitting elements on a substrate, A as a current (mA) flowing through one light-emitting element, and B as the number of light-emitting elements per unit area (cm2) of a substantial mounting part for light-emitting elements.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: July 8, 2014
    Assignee: Toshiba Lighting & Technology Corporation
    Inventors: Kozo Uemura, Soichi Shibusawa, Shuhei Matsuda, Nobuhiko Betsuda, Kiyoshi Nishimura, Masatoshi Kumagai
  • Publication number: 20140153238
    Abstract: According to one embodiment, there is provided a light-emitting device including a light-emitting section, a thermal radiation member, and a heat conduction layer. The light-emitting section includes a mounting substrate section and a light-emitting element section. The mounting substrate section includes a substrate, a first metal layer, and a second metal layer. The substrate includes a first principal plane including a mounting region and a second principal plane. The first metal layer includes mounting patterns provided in the mounting region. The light-emitting element section includes semiconductor light-emitting elements and a wavelength conversion layer. The semiconductor light-emitting elements are connected to the mounting patterns. The luminous exitance of the light-emitting element section is equal to or higher than 101 m/mm2 and equal to or lower than 1001 m/mm2. The thermal radiation member has an area equal to or larger than five times the area of the mounting region.
    Type: Application
    Filed: August 30, 2013
    Publication date: June 5, 2014
    Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATION
    Inventors: Kiyoshi Nishimura, Kazuo Shimokawa, Nobuhiko Betsuda, Akihiro Sasaki, Miho Watanabe, Hirotaka Tanaka, Takuya Honma, Katsuhisa Matsumoto, Hideki Okawa
  • Publication number: 20140138732
    Abstract: A light-emitting module that can prevent a short circuit of an LED element due to mounting is to be provided. According to one embodiment, a light-emitting module includes an LED element, a DPC substrate, and solder joining sections. The LED element is a face-down type. The DPC substrate includes a mounting surface on which the LED element is mounted. First and second wiring patterns including first and second land section are formed on the mounting surface. The LED element and the first and second land sections of the DPC substrate are joined by the first and second solder joining sections. At least the second land section is formed further on the inner side than the side surfaces of the LED element.
    Type: Application
    Filed: February 28, 2013
    Publication date: May 22, 2014
    Applicant: Toshiba Lighting & Technology Corporation
    Inventors: Akihiro SASAKI, Nobuhiko Betsuda
  • Patent number: 8690392
    Abstract: The light source unit is provided with a substrate and a decorative cover having thermal conductivity. The substrate includes a circuit pattern area, in which a plurality of LED chips are disposed, at the middle part thereof, has thermal conductivity, and transmits heat from the circuit pattern area to an area in the outer circumferential direction thereof. The decorative cover encloses the substrate, is electrically insulated from the circuit pattern area, and is thermally coupled to the surface side of the substrate at the periphery of the circuit pattern area by being face-contacted thereto. Heat of the substrate can be radiated by the decorative cover while securing an electric insulation property with respect to the circuit pattern area.
    Type: Grant
    Filed: May 14, 2012
    Date of Patent: April 8, 2014
    Assignee: Toshiba Lighting & Technology Corporation
    Inventors: Kozo Ogawa, Kiyoshi Nishimura, Nobuhiko Betsuda, Hiroki Tamai, Akiko Saito
  • Publication number: 20140063822
    Abstract: According to one embodiment, a wiring board includes a base assuming a flat plate shape, a wiring pattern provided in a position on one surface of the base and apart from a peripheral edge of the base, a first metal layer provided on the opposite side of the base side of the wiring pattern, and a second metal layer configured to cover the first metal layer and a sidewall of the wiring pattern.
    Type: Application
    Filed: December 10, 2012
    Publication date: March 6, 2014
    Applicant: Toshiba Lighting & Technology Corporation
    Inventors: Akihiro SASAKI, Kazuo SHIMOKAWA, Takuya HONMA, Nobuhiko BETSUDA, Kiyoshi NISHIMURA
  • Patent number: 8664857
    Abstract: A lighting device may include a substrate attached to one edge side of a radiator and a cover may be attached to cover the substrate. Heat-radiating fins may be provided on the other edge side of the radiator and an air-cooling unit may be rotatably provided inside the heat-radiating fins, thereby enabling freely rotation. In one or more examples, a case storing a circuit part is attached to the other edge side of the radiator and a cap is provided to the case. By the air flow from the air-cooling unit, the heat-radiating fins are caused to be a part of the ventilation path to allow for ventilation of the inside of the radiator.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: March 4, 2014
    Assignee: Toshiba Lighting & Technology Corporation
    Inventors: Nobuhiko Betsuda, Takumi Suwa, Hitoshi Kawano, Akiko Saito, Makoto Bessho, Yusuke Shibahara, Hiroki Tamai, Nobuo Shibano, Keiichi Shimizu
  • Patent number: 8632212
    Abstract: According to one embodiment, a light-emitting device comprises a substrate on which a plurality of light-emitting elements are arranged and mounted in two lines; and sealing members of two lines each sealing the plurality of light-emitting elements of each line. A distance between the lines of the sealing members is equal to 0.5 times or more but 2 times or less a width of the sealing member of each line.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: January 21, 2014
    Assignee: Toshiba Lighting & Technology Corporation
    Inventors: Soichi Shibusawa, Kozo Ogawa, Kiyoshi Nishimura, Nobuhiko Betsuda
  • Patent number: 8616732
    Abstract: According to one embodiment, a light-emitting device comprises a substrate on a surface of which a light-emitting element is mounted, a light reflection layer formed on a second area of the surface of the substrate other than a first area on which the light-emitting element is mounted, and a sealing member sealing the light-emitting element. An engagement protrusion part protruding toward the sealing member is provided at an edge part of the light reflection layer at which the light reflection layer is in contact with the area on which the light-emitting element is mounted. The engagement protrusion part juts out into the sealing member to prevent exfoliation of the sealing member.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: December 31, 2013
    Assignee: Toshiba Lighting & Technology Corporation
    Inventors: Soichi Shibusawa, Kozo Ogawa, Kiyoshi Nishimura, Nobuhiko Betsuda
  • Patent number: 8567990
    Abstract: A lighting device may include a substrate attached to one edge side of a radiator and a cover may be attached to cover the substrate. Heat-radiating fins may be provided on the other edge side of the radiator and an air-cooling unit may be rotatably provided inside the heat-radiating fins, thereby enabling freely rotation. In one or more examples, a case storing a circuit part is attached to the other edge side of the radiator and a cap is provided to the case. By the air flow from the air-cooling unit, the heat-radiating fins are caused to be a part of the ventilation path to allow for ventilation of the inside of the radiator.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: October 29, 2013
    Assignee: Toshiba Lighting & Technology Corporation
    Inventors: Nobuhiko Betsuda, Takumi Suwa, Hitoshi Kawano, Akiko Saito, Makoto Bessho, Yusuke Shibahara, Hiroki Tamai, Nobuo Shibano, Keiichi Shimizu
  • Publication number: 20130271971
    Abstract: A light-emitting circuit is formed as a straight tube in a stable shape and capable of appropriately housing and holding an LED module and the like. The light-emitting circuit includes: a plurality of light-emitting elements configured to emit light; a substrate, functioning as an arrangement member, including an arrangement surface on which the plurality of light-emitting elements are arranged; and a substantially cylindrical lamp body including a translucent section at least in a part thereof, including the arrangement member disposed on the inside, and including a louver functioning as a projecting body projecting from an inner wall opposed to the arrangement surface and extending toward the arrangement surface.
    Type: Application
    Filed: September 27, 2011
    Publication date: October 17, 2013
    Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATION
    Inventors: Kozo Uemura, Kiyoshi Nishimura, Soichi Shibusawa, Nobuhiko Betsuda, Shuhei Matsuda, Masatoshi Kumagai
  • Publication number: 20130250562
    Abstract: According to one embodiment, a wiring board device is provided in which even if the temperature of a ceramic board becomes high, the influence on a connector can be reduced and the occurrence of defects due to heat can be prevented. The wiring board device includes a common member. The ceramic board and the connector are placed on the common member. A wiring pattern of the ceramic board and the connector are electrically connected by wiring.
    Type: Application
    Filed: June 22, 2012
    Publication date: September 26, 2013
    Applicant: Toshiba Lighting & Technology Corporation
    Inventors: Hirotaka Tanaka, Kiyoshi Nishimura, Miho Watanabe, Nobuhiko Betsuda, Takuya Honma
  • Publication number: 20130250576
    Abstract: According to one embodiment, a wiring board device includes a ceramic board including a first surface and a second surface. A first electrode layer is formed on the first surface of the ceramic board, and a second electrode layer is formed on the second surface of the ceramic board. The first electrode layer and the second electrode layer are not electrically connected to each other. A first copper plated layer as a wiring pattern is formed on the first electrode layer, and a second copper plated layer is formed on the second electrode layer. The first copper plated layer and the second copper plated layer are not electrically connected to each other. A heat spreader is thermally connected to the second copper plated layer.
    Type: Application
    Filed: June 26, 2012
    Publication date: September 26, 2013
    Applicant: Toshiba Lighting & Technology Corporation
    Inventors: Nobuhiko BETSUDA, Hirotaka TANAKA, Takuya HONMA, Miho WATANABE, Kiyoshi NISHIMURA
  • Publication number: 20130114253
    Abstract: A bulb-type lamp includes a base body, a heat pipe, a light-emitting body, a cap and a lighting circuit. One end side of the heat pipe protrudes from one end side of the base body, and the other end side of the heat pipe is connected to the one end side of the base body. The light-emitting body includes plural LED elements, is connected to the one end side of the heat pipe, and is attached to the heat pipe to enable heat conduction. The cap is provided at the other end side of the base body. The lighting circuit is housed in the base body.
    Type: Application
    Filed: January 12, 2011
    Publication date: May 9, 2013
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA LIGHTING & TECHNOLOGY CORPORATION
    Inventors: Masao Segawa, Nobuo Shibano, Nobuhiko Betsuda, Kiyoshi Nishimura, Kozo Ogawa