Patents by Inventor Nobuhiko Harada

Nobuhiko Harada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11560453
    Abstract: Provided is a polyorganosilsesquioxane capable of forming, when cured, a cured product that offers high surface hardness and good heat resistance, is highly flexible, and has excellent processability. The present invention relates to a polyorganosilsesquioxane including a constitutional unit represented by Formula (1). The polyorganosilsesquioxane includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) in a mole ratio of the constitutional unit represented by Formula (I) to the constitutional unit represented by Formula (II) of 5 or more. The polyorganosilsesquioxane has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55% to 100% by mole based on the total amount (100% by mole) of all siloxane constitutional units.
    Type: Grant
    Filed: August 4, 2021
    Date of Patent: January 24, 2023
    Assignee: DAICEL CORPORATION
    Inventors: Akihiro Kuwana, Nobuhiko Harada, Maya Masui, Ichiro Takase, Shinji Maetani, Naoko Tsuji
  • Publication number: 20220002494
    Abstract: Provided is a polyorganosilsesquioxane capable of forming, when cured, a cured product that offers high surface hardness and good heat resistance, is highly flexible, and has excellent processability. The present invention relates to a polyorganosilsesquioxane including a constitutional unit represented by Formula (1). The polyorganosilsesquioxane includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) in a mole ratio of the constitutional unit represented by Formula (I) to the constitutional unit represented by Formula (II) of 5 or more. The polyorganosilsesquioxane has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55% to 100% by mole based on the total amount (100% by mole) of all siloxane constitutional units.
    Type: Application
    Filed: August 4, 2021
    Publication date: January 6, 2022
    Applicant: DAICEL CORPORATION
    Inventors: Akihiro KUWANA, Nobuhiko HARADA, Maya MASUI, Ichiro TAKASE, Shinji MAETANI, Naoko TSUJI
  • Patent number: 11111337
    Abstract: Provided is a polyorganosilsesquioxane capable of forming, when cured, a cured product that offers high surface hardness and good heat resistance, is highly flexible, and has excellent processability. The present invention relates to a polyorganosilsesquioxane including a constitutional unit represented by Formula (1). The polyorganosilsesquioxane includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) in a mole ratio of the constitutional unit represented by Formula (I) to the constitutional unit represented by Formula (II) of 5 or more. The polyorganosilsesquioxane has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55% to 100% by mole based on the total amount (100% by mole) of all siloxane constitutional units.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: September 7, 2021
    Assignee: DAICEL CORPORATION
    Inventors: Akihiro Kuwana, Nobuhiko Harada, Maya Masui, Ichiro Takase, Shinji Maetani, Naoko Tsuji
  • Patent number: 11104824
    Abstract: A shaped product comprising a hardcoat layer, wherein the hardcoat layer is a cured product of a curable composition comprising a cationic curable silicone resin and a leveling agent, the cationic curable silicone resin comprising a silsesquioxane unit, having a monomer unit having an epoxy group in a proportion of not less than 50% by mol in a total monomer unit, and having a number average molecular weight of 1000 to 3000.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: August 31, 2021
    Assignee: DAICEL CORPORATION
    Inventors: Shinji Kikuchi, Nobuhiko Harada
  • Patent number: 10619047
    Abstract: Provided is a curable composition having excellent film-formability and can be cured at low temperatures to form a cured product that has heat resistance, cracking resistance, and adhesiveness and adhesion to an adherend at excellent levels. The curable composition according to the present invention is a composition containing polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) include (a-1) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 3000 or more, and (a-2) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 2500 or less. The polyorganosilsesquioxanes (A) contain the components (a-1) and (a-2) in a total content of 50 weight percent or more of the total amount of the polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) have a ratio in content (weight ratio) of (a-1) to (a-2) of from 10:90 to 70:30.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: April 14, 2020
    Assignee: DAICEL CORPORATION
    Inventors: Naoko Tsuji, Hiroki Tanaka, Akira Yamakawa, Akihiro Shibamoto, Nobuhiko Harada
  • Publication number: 20180346759
    Abstract: A shaped product comprising a hardcoat layer, wherein the hardcoat layer is a cured product of a curable composition comprising a cationic curable silicone resin and a leveling agent, the cationic curable silicone resin comprising a silsesquioxane unit, having a monomer unit having an epoxy group in a proportion of not less than 50% by mol in a total monomer unit, and having a number average molecular weight of 1000 to 3000.
    Type: Application
    Filed: August 7, 2018
    Publication date: December 6, 2018
    Applicant: DAICEL CORPORATION
    Inventors: Shinji KIKUCHI, Nobuhiko HARADA
  • Publication number: 20180282485
    Abstract: Provided is a polyorganosilsesquioxane capable of forming, when cured, a cured product that offers high surface hardness and good heat resistance, is highly flexible, and has excellent processability. The present invention relates to a polyorganosilsesquioxane including a constitutional unit represented by Formula (1). The polyorganosilsesquioxane includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) in a mole ratio of the constitutional unit represented by Formula (I) to the constitutional unit represented by Formula (II) of 5 or more. The polyorganosilsesquioxane has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55% to 100% by mole based on the total amount (100% by mole) of all siloxane constitutional units.
    Type: Application
    Filed: June 5, 2018
    Publication date: October 4, 2018
    Applicant: DAICEL CORPORATION
    Inventors: Akihiro KUWANA, Nobuhiko HARADA, Maya MASUI, Ichiro TAKASE, Shinji MAETANI, Naoko TSUJI
  • Publication number: 20180163049
    Abstract: Provided is a curable composition having excellent film-formability and can be cured at low temperatures to form a cured product that has heat resistance, cracking resistance, and adhesiveness and adhesion to an adherend at excellent levels. The curable composition according to the present invention is a composition containing polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) include (a-1) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 3000 or more, and (a-2) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 2500 or less. The polyorganosilsesquioxanes (A) contain the components (a-1) and (a-2) in a total content of 50 weight percent or more of the total amount of the polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) have a ratio in content (weight ratio) of (a-1) to (a-2) of from 10:90 to 70:30.
    Type: Application
    Filed: June 7, 2016
    Publication date: June 14, 2018
    Applicant: DAICEL CORPORATION
    Inventors: Naoko TSUJI, Hiroki TANAKA, Akira YAMAKAWA, Akihiro SHIBAMOTO, Nobuhiko HARADA
  • Publication number: 20160297933
    Abstract: Provided is a polyorganosilsesquioxane capable of forming, when cured, a cured product that offers high surface hardness and good heat resistance, is highly flexible, and has excellent processability. The present invention relates to a polyorganosilsesquioxane including a constitutional unit represented by Formula (1). The polyorganosilsesquioxane includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) in a mole ratio of the constitutional unit represented by Formula (I) to the constitutional unit represented by Formula (II) of 5 or more. The polyorganosilsesquioxane has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55% to 100% by mole based on the total amount (100% by mole) of all siloxane constitutional units.
    Type: Application
    Filed: November 14, 2014
    Publication date: October 13, 2016
    Applicant: DAICEL CORPORATION
    Inventors: Akihiro KUWANA, Nobuhiko HARADA, Maya MASUI, Ichiro TAKASE, Shinji MAETANI, Naoko TSUJI
  • Patent number: 9447277
    Abstract: Provided is a curable resin composition capable of forming a cured product that excels in heat resistance, transparency, and flexibility and particularly excels in barrier properties against a corrosive gas (e.g., sulfur oxide). The curable resin composition includes a compound (U) containing an aliphatic carbon-carbon unsaturated bond and a compound (H) containing a hydrosilyl group and includes at least one of a ladder-type silsesquioxane [A1] and a ladder-type silsesquioxane [A2], where the ladder-type silsesquioxane [A1] contains an aliphatic carbon-carbon unsaturated bond and has a number-average molecular weight of 500-1500 and a molecular weight dispersity (Mw/Mn) of 1.00-1.40 as determined by gel permeation chromatography and calibrated with a polystyrene standard, and the ladder-type silsesquioxane [A2] contains a hydrosilyl group and has a number-average molecular weight of 500-1500 and a molecular weight dispersity (Mw/Mn) of 1.00-1.
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: September 20, 2016
    Assignee: DAICEL CORPORATION
    Inventors: Shigeaki Kamuro, Akihiro Kuwana, Nobuhiko Harada
  • Publication number: 20160083331
    Abstract: Provided are: a multifunctional (meth)acrylate compound that has excellent curability and can form a polymer or cured product having hardness and durability at excellent levels; and a method for easily and selectively producing the multifunctional (meth)acrylate compound. The multifunctional (meth)acrylate compound according to the present invention is represented by Formula (1) below. In the formula, Ring Z1 represents a tricyclo[5.2.1.02,6]decane ring, R is selected from a hydrogen atom and a methyl group, and n1 and n2 meet a condition that n1 is 2 or 3 and n2 is 1, or a condition that n1 is 3 or 4 and n2 is 0.
    Type: Application
    Filed: June 11, 2014
    Publication date: March 24, 2016
    Applicant: DAICEL CORPORATION
    Inventors: Nobuhiko HARADA, Ichiro TAKASE
  • Publication number: 20150275043
    Abstract: A curable composition comprises a cationic curable silicone resin and a leveling agent, the cationic curable silicone resin comprises a silsesquioxane unit, has a monomer unit having an epoxy group in a proportion of not less than 50% by mol in a total monomer unit, and has a number average molecular weight of 1000 to 3000.
    Type: Application
    Filed: March 30, 2015
    Publication date: October 1, 2015
    Applicant: DAICEL CORPORATION
    Inventors: Shinji KIKUCHI, Nobuhiko HARADA
  • Publication number: 20150126700
    Abstract: Provided is a curable resin composition capable of forming a cured product that excels in heat resistance, transparency, and flexibility and particularly excels in barrier properties against a corrosive gas (e.g., sulfur oxide). The curable resin composition includes a compound (U) containing an aliphatic carbon-carbon unsaturated bond and a compound (H) containing a hydrosilyl group and includes at least one of a ladder-type silsesquioxane [A1] and a ladder-type silsesquioxane [A2], where the ladder-type silsesquioxane [A1] contains an aliphatic carbon-carbon unsaturated bond and has a number-average molecular weight of 500-1500 and a molecular weight dispersity (Mw/Mn) of 1.00-1.40 as determined by gel permeation chromatography and calibrated with a polystyrene standard, and the ladder-type silsesquioxane [A2] contains a hydrosilyl group and has a number-average molecular weight of 500-1500 and a molecular weight dispersity (Mw/Mn) of 1.00-1.
    Type: Application
    Filed: May 17, 2013
    Publication date: May 7, 2015
    Applicant: DAICEL CORPORATION
    Inventors: Shigeaki Kamuro, Akihiro Kuwana, Nobuhiko Harada
  • Patent number: 4391016
    Abstract: A degreasing apparatus for an elongated member including a treatment room sequentially divided in an isolated fashion and along the feeding direction of the elongated member into a degreasing chamber, a predrying chamber and a finish drying chamber. At least one pair of rotary brushes are provided in the degreasing chamber. The degreasing chamber is also provided with means for jetting out a degreasing liquid in a direction toward the inlet side of a contact area between the brushes and elongated mechanism. Elastic degreasing members are provided, respectively, at the inlet and outlet sides of the degreasing chamber to remove oil or grease from the elongated member before it enters the degreasing chamber and to wipe off any degreasing liquid remaining on the elongated member prior to passing the same into the predrying chamber.
    Type: Grant
    Filed: September 14, 1981
    Date of Patent: July 5, 1983
    Assignee: Kabushiki Kaisha Kobe Seiko Sho
    Inventors: Teruaki Kawamura, Nobuhiko Harada, Yukihiko Komatsu, Masaru Sakai
  • Patent number: 4056428
    Abstract: An apparatus and process for etching the inner surface of a pipe or tubular member includes a primary pipe adapted to be connected with a pipe or pipes whose inner surfaces are to be treated, and treating-solution supply pipes communicating, by means of electromagnetic valves, with the aforenoted primary pipe, whereby one path for a specific solution to be fed through one of the treating-solution supply pipes by means of the primary pipe into the pipe to be treated is automatically switched to another path by means of the aforenoted electromagnetic valves, without causing mixing of one solution with another. This apparatus and process therefore provides improved operational efficiency as well as a uniform surface condition and achieves accurate dimensioning for the inner surface of the pipe to be treated.
    Type: Grant
    Filed: October 6, 1975
    Date of Patent: November 1, 1977
    Assignee: Kobe Steel, Ltd.
    Inventors: Nobuhiko Harada, Minetaka Tanaka, Masanao Shimano, Kyozo Fujinaga, Kunito Nunomura, Masamitu Tamura, Shigeharu Nakamura, Kazuo Akagi
  • Patent number: 4039148
    Abstract: A conveying device for conveying long articles within heat treatment furnaces, the driving means of which includes a drive mechanism and at least one element of linear form, for conveyance of the articles, driven by means of the drive mechanism. Product carriers are conveyed by means of the linear conveying element, each product carrier having a plurality of product supports for supporting the long articles thereon. The foremost one of the carriers, with respect to the direction of motion, has a means of engaging the linear conveying element whereby the linear conveying element transports the product carriers, and thereby the product supports and the long articles disposed thereon.
    Type: Grant
    Filed: January 14, 1976
    Date of Patent: August 2, 1977
    Assignee: Kobe Steel Ltd.
    Inventors: Masamitu Tamura, Katsumi Maeda, Nobuhiko Harada, Sigeharu Nakamura