Patents by Inventor Nobuhiko KATOH

Nobuhiko KATOH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230083722
    Abstract: Atomic diffusion bonding is carried out using a bonding film comprising a nitride formed at a bonding surface. Operating in a vacuum chamber, a bonding film comprising a nitride is formed on each of flat surfaces of two substrates that each have the flat surface, and, by overlapping the two substrates so the bonding films formed on the two substrates are in contact with each other, the two substrates are joined by the generation of atomic diffusion at a bonding interface between the bonding films.
    Type: Application
    Filed: October 14, 2022
    Publication date: March 16, 2023
    Applicants: TOHOKU UNIVERSITY, Canon Anelva Corporation
    Inventors: Takehito SHIMATSU, Miyuki UOMOTO, Kazuo MIYAMOTO, Yoshikazu MIYAMOTO, Nobuhiko KATOH, Takayuki MORIWAKI, Takayuki SAITOH
  • Patent number: 11450643
    Abstract: A bonded structure includes a first substrate; a second substrate placed opposite to the first substrate; an intermediate layer provided between the first substrate and the second substrate and including a first oxide thin film layered on the first substrate and a second oxide thin film layered on the second substrate; either or both of the first oxide thin film and the second oxide thin film of the intermediate layer being formed of oxide thin films having increased defects; and an interface between the first oxide thin film and the second oxide thin film=being bonded by chemical bonding, and the interface comprising a low-density portion whose density is lower than that of the two oxide thin films.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: September 20, 2022
    Assignees: TOHOKU UNIVERSITY, CANON ANELVA CORPORATION
    Inventors: Takehito Shimatsu, Miyuki Uomoto, Kazuo Miyamoto, Yoshikazu Miyamoto, Nobuhiko Katoh, Takayuki Moriwaki, Takayuki Saitoh
  • Publication number: 20220199569
    Abstract: A bonded structure includes a first substrate; a second substrate placed opposite to the first substrate; an intermediate layer provided between the first substrate and the second substrate and including a first oxide thin film layered on the first substrate and a second oxide thin film layered on the second substrate; either or both of the first oxide thin film and the second oxide thin film of the intermediate layer being formed of oxide thin films having increased defects; and an interface between the first oxide thin film and the second oxide thin film=being bonded by chemical bonding, and the interface comprising a low-density portion whose density is lower than that of the two oxide thin films.
    Type: Application
    Filed: February 14, 2022
    Publication date: June 23, 2022
    Applicants: TOHOKU UNIVERSITY, CANON ANELVA CORPORATION
    Inventors: Takehito SHIMATSU, Miyuki UOMOTO, Kazuo MIYAMOTO, Yoshikazu MIYAMOTO, Nobuhiko KATOH, Takayuki MORIWAKI, Takayuki SAITOH
  • Publication number: 20220157770
    Abstract: The present invention achieves chemical bonding by means of a joined film made of oxides formed on a joined surface. In a vacuum container, amorphous oxide thin films are respectively formed on smooth surfaces of two substrates, and the two substrates overlap such that the amorphous oxide thin films formed on the two substrates come into contact with each other, thereby causing chemical bonding involving an atomic diffusion at a joined interface between the amorphous oxide thin films to join the two substrates.
    Type: Application
    Filed: February 4, 2022
    Publication date: May 19, 2022
    Applicants: TOHOKU UNIVERSITY, CANON ANELVA CORPORATION
    Inventors: Takehito SHIMATSU, Miyuki UOMOTO, Kazuo MIYAMOTO, Yoshikazu MIYAMOTO, Nobuhiko KATOH, Takayuki MORIWAKI, Takayuki SAITOH