Abstract: This exposure method comprises a first step of performing the exposure processing by irradiating a projection optical system (the system) by a first pupil plane illumination distribution (the first distribution) of the system; a second step of performing the exposure processing by irradiating the system by a second pupil plane illumination distribution (the second distribution) that is different from the first distribution, after the first step; a change amount obtaining step of obtaining a change amount of an imaging performance of the system in a condition of the second distribution, with respect to the imaging performance in the first step; and a correction amount obtaining step of obtaining a correction amount for correcting the imaging performance in the second step, by using the change amount, wherein, in the second step, the exposure processing is performed by correcting the imaging performance using the correction amount.

Abstract: This exposure method comprises a first step of performing the exposure processing by irradiating a projection optical system (the system) by a first pupil plane illumination distribution (the first distribution) of the system; a second step of performing the exposure processing by irradiating the system by a second pupil plane illumination distribution (the second distribution) that is different from the first distribution, after the first step; a change amount obtaining step of obtaining a change amount of an imaging performance of the system in a condition of the second distribution, with respect to the imaging performance in the first step; and a correction amount obtaining step of obtaining a correction amount for correcting the imaging performance in the second step, by using the change amount, wherein, in the second step, the exposure processing is performed by correcting the imaging performance using the correction amount.

Abstract: The present invention provides an exposure apparatus including a projection optical system configured to project a reticle pattern onto a wafer, a selector configured to select a dummy wafer to be placed near an image plane of the projection optical system, from a plurality of dummy wafers having the same shape as that of the wafer and different reflectance with each other, a transfer unit configured to place the dummy wafer selected by the selector near the image plane of the projection optical system, and a controller configured to perform control such that dummy exposure is performed by irradiating the dummy wafer, which is placed near the image plane of the projection optical system by the transfer unit, with light via the projection optical system.

Abstract: An exposure apparatus the present invention comprises: an illumination optical system configured to illuminate an illumination area on an original with light from a light source; a projection optical system configured to project a pattern of the original onto a substrate; a first stage configured to hold the original; a second stage configured to hold the substrate; and a controller configured to control driving of at least one of the first stage, the second stage, and an optical element which forms the projection optical system so as to reduce variations in imaging characteristics of the projection optical system, based on a dependence of a transmittance of the pattern on a position in the illumination area.

Abstract: A dummy light-exposed substrate used for dummy light-exposure in an immersion exposure apparatus which exposes a substrate to light via a projection optical system and a liquid, comprises a lyophilic region, and a liquid repellent region surrounding the lyophilic region.

Abstract: The present invention provides an exposure apparatus including a projection optical system configured to project a reticle pattern onto a wafer, a selector configured to select a dummy wafer to be placed near an image plane of the projection optical system, from a plurality of dummy wafers having the same shape as that of the wafer and different reflectance with each other, a transfer unit configured to place the dummy wafer selected by the selector near the image plane of the projection optical system, and a controller configured to perform control such that dummy exposure is performed by irradiating the dummy wafer, which is placed near the image plane of the projection optical system by the transfer unit, with light via the projection optical system.

Abstract: The present invention provides an exposure apparatus including a projection optical system configured to project a reticle pattern onto a wafer, a selector configured to select a dummy wafer to be placed near an image plane of the projection optical system, from a plurality of dummy wafers having the same shape as that of the wafer and different reflectance with each other, a transfer unit configured to place the dummy wafer selected by the selector near the image plane of the projection optical system, and a controller configured to perform control such that dummy exposure is performed by irradiating the dummy wafer, which is placed near the image plane of the projection optical system by the transfer unit, with light via the projection optical system.

Abstract: A dummy light-exposed substrate used for dummy light-exposure in an immersion exposure apparatus which exposes a substrate to light via a projection optical system and a liquid, comprises a lyophilic region, and a liquid repellent region surrounding the lyophilic region.

Abstract: The present invention provides an exposure apparatus including a projection optical system configured to project a reticle pattern onto a wafer, a selector configured to select a dummy wafer to be placed near an image plane of the projection optical system, from a plurality of dummy wafers having the same shape as that of the wafer and different reflectance with each other, a transfer unit configured to place the dummy wafer selected by the selector near the image plane of the projection optical system, and a controller configured to perform control such that dummy exposure is performed by irradiating the dummy wafer, which is placed near the image plane of the projection optical system by the transfer unit, with light via the projection optical system.

Abstract: The present invention provides an exposure apparatus comprising a projection optical system configured to project a pattern of a reticle onto a substrate, a specifying unit configured to specify a first region on a pupil plane of the projection optical system based on the pattern of the reticle and a shape of an effective light source on the pupil plane of the projection optical system, and an adjusting unit configured to adjust an aberration of the projection optical system, wherein the adjusting unit adjusts the aberration of the projection optical system so that an aberration in the first region specified by the specifying unit becomes smaller than an aberration in a second region on the pupil plane of the projection optical system, which is different from the first region.

Abstract: An exposure apparatus the present invention comprises: an illumination optical system configured to illuminate an illumination area on an original with light from a light source; a projection optical system configured to project a pattern of the original onto a substrate; a first stage configured to hold the original; a second stage configured to hold the substrate; and a controller configured to control driving of at least one of the first stage, the second stage, and an optical element which forms the projection optical system so as to reduce variations in imaging characteristics of the projection optical system, based on a dependence of a transmittance of the pattern on a position in the illumination area.