Abstract: A rolling bearing test includes: a hermetic container configured to allow atmosphere gas to be introduced therein; a rotary shaft housed in the hermetic container and fitted into the rolling bearing; a pair of shaft support portions fixed to a fixing portion provided in the hermetic container and configured to rotatably support the rotary shaft at both sides of the rolling bearing in an axial direction, respectively; a drive device configured to drive the rotary shaft; a holding portion configured to hold the outer ring of the rolling bearing to avoid rotation of the outer ring; a first load application mechanism configured to apply an axial load between the inner ring and the outer ring of the rolling bearing; and a second load application mechanism.

Abstract: A rolling bearing test includes: a hermetic container configured to allow atmosphere gas to be introduced therein; a rotary shaft housed in the hermetic container and fitted into the rolling bearing; a pair of shaft support portions fixed to a fixing portion provided in the hermetic container and configured to rotatably support the rotary shaft at both sides of the rolling bearing in an axial direction, respectively; a drive device configured to drive the rotary shaft; a holding portion configured to hold the outer ring of the rolling bearing to avoid rotation of the outer ring; a first load application mechanism configured to apply an axial load between the inner ring and the outer ring of the rolling bearing; and a second load application mechanism.

Abstract: In semiconductor surface inspection apparatus, foreign matter that sticks to the wafer can reduce the quality of the wafer. The present invention is directed to improving the internal cleanliness of the apparatus. Specifically, during rotation of a semiconductor wafer, foreign matter suspended in an atmosphere surrounding the wafer is attracted to a central section of the wafer, and that while heading from the central section of the wafer, towards an outer edge thereof, the foreign matter is most likely to stick to the wafer. In conventional techniques, sufficient consideration is not given to such likelihood of foreign matter sticking. This invention supplies a medium from two directions to an inner circumferential section of a substrate. In accordance with the invention, foreign matter that sticks to a wafer can be reduced more significantly than in the conventional techniques.

Abstract: In semiconductor surface inspection apparatus, foreign matter that sticks to the wafer can reduce the quality of the wafer. The present invention is directed to improving the internal cleanliness of the apparatus. Specifically, during rotation of a semiconductor wafer, foreign matter suspended in an atmosphere surrounding the wafer is attracted to a central section of the wafer, and that while heading from the central section of the wafer, towards an outer edge thereof, the foreign matter is most likely to stick to the wafer. In conventional techniques, sufficient consideration is not given to such likelihood of foreign matter sticking This invention supplies a medium from two directions to an inner circumferential section of a substrate. In accordance with the invention, foreign matter that sticks to a wafer can be reduced more significantly than in the conventional techniques.