Abstract: An apparatus for testing electric characteristics of a semiconductor device having a plurality of hemispherical electrode terminals on one surface thereof, including: a support plate vertically movably supported by an elastic member, supporting a side of the one surface of the semiconductor device, and having through holes for accommodating the hemispherical electrode terminals; a probe pin securing block placed under the support plate; a plurality of probe pins secured to the probe pin securing block and having concave-shaped tips facing the hemispherical electrode terminals of the semiconductor device supported by the support plate; and a vertically movable pressing head placed over the support plate for applying a downward pressure on the support plate, wherein after the support plate is lowered by a predetermined amount by the downward pressure from the pressing head, the pressing head contacts the semiconductor device and applies a downward pressure thereon.

Abstract: A first conductive contact connecting a first electrode of an inspection circuit board and one external electrode of a semiconductor integrated circuit is arranged in a fixed member. A second conductive contact connecting a second electrode of a wiring board and the other external electrode of the semiconductor integrated circuit is arranged in a movable member. A third conductive contact connecting one third electrode of the inspection circuit board and the other third electrode of the wiring board is arranged in the movable member. The other third electrode is connected to the second electrode. When the movable member moves to the contacting position, the second conductive contact makes contact with the other external electrode, and the third conductive contact makes contact with the one third electrode.

Abstract: A first conductive contact connecting a first electrode of an inspection circuit board and one external electrode of a semiconductor integrated circuit is arranged in a fixed member. A second conductive contact connecting a second electrode of a wiring board and the other external electrode of the semiconductor integrated circuit is arranged in a movable member. A third conductive contact connecting one third electrode of the inspection circuit board and the other third electrode of the wiring board is arranged in the movable member. The other third electrode is connected to the second electrode. When the movable member moves to the contacting position, the second conductive contact makes contact with the other external electrode, and the third conductive contact makes contact with the one third electrode.

Abstract: A first conductive contact connecting a first electrode of an inspection circuit board and one external electrode of a semiconductor integrated circuit is arranged in a fixed member. A second conductive contact connecting a second electrode of a wiring board and the other external electrode of the semiconductor integrated circuit is arranged in a movable member. A third conductive contact connecting one third electrode of the inspection circuit board and the other third electrode of the wiring board is arranged in the movable member. The other third electrode is connected to the second electrode. When the movable member moves to the contacting position, the second conductive contact makes contact with the other external electrode, and the third conductive contact makes contact with the one third electrode.

Abstract: In a conductive contact pin brought into contact with the external electrode of a semiconductor device to conduct a test on the electrical characteristics of the semiconductor device, an upper plunger 13 which is a contact pin coming in and out of a cylindrical body is made up of a base b which is in sliding contact with the cylindrical body and is not in contact with the external electrode and an end a which comes into contact with the external electrode. The base b has at least a surface layer made of a precious metal, and the end a has at least a surface layer made of one of a different metal from the base b and a metal alloy.

Abstract: A first conductive contact connecting a first electrode of an inspection circuit board and one external electrode of a semiconductor integrated circuit is arranged in a fixed member. A second conductive contact connecting a second electrode of a wiring board and the other external electrode of the semiconductor integrated circuit is arranged in a movable member. A third conductive contact connecting one third electrode of the inspection circuit board and the other third electrode of the wiring board is arranged in the movable member. The other third electrode is connected to the second electrode. When the movable member moves to the contacting position, the second conductive contact makes contact with the other external electrode, and the third conductive contact makes contact with the one third electrode.