Patents by Inventor Nobuhiro Kojima

Nobuhiro Kojima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240152049
    Abstract: Provided is an actinic ray-sensitive or radiation-sensitive resin composition that can provide a pattern having good cross-sectional rectangularity. The actinic ray-sensitive or radiation-sensitive resin composition includes: a resin having a group that is decomposed by the action of an acid to generate a polar group; an onium salt (I) that generates an acid represented by formula (1) upon irradiation with actinic rays or radiation; and an onium salt (II) having at least one structural moiety W that includes an anionic moiety A and a cationic moiety M and forms an acidic moiety represented by HA upon irradiation with the actinic rays or radiation. The acid dissociation constant derived from the acidic moiety represented by HA and formed by replacing the cationic moiety in the structural moiety W with H+ is larger than the acid dissociation constant of the acid represented by formula (1).
    Type: Application
    Filed: December 21, 2023
    Publication date: May 9, 2024
    Applicant: FUJIFILM Corporation
    Inventors: Masafumi KOJIMA, Yosuke BEKKI, Nobuhiro HIURA
  • Patent number: 11932221
    Abstract: A system and method control an automobile by decelerating the automobile at a first deceleration using a braking mechanism in response to detecting that a parking brake switch is turned on, a second deceleration which is smaller than the first deceleration, in response to not detecting that the parking brake switch is turned on and determining that the driver is incapacitated, and a third deceleration which is smaller than the first deceleration, in response to determining that an SOS switch is turned on, detecting that the parking brake switch is changed from on to off, and not determining that the driver is incapacitated.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: March 19, 2024
    Assignee: MAZDA MOTOR CORPORATION
    Inventors: Takashi Hamada, Yuma Nishijo, Kouichi Kojima, Yoshiyuki Yamashita, Shinya Kyusaka, Yuta Tsuji, Nobuhiro Nonaka, Daisuke Shimizu, Keigo Fukuda, Yasuhiro Nakashima, Taro Oike
  • Publication number: 20240087777
    Abstract: A thermistor layer of the present invention is configured to be disposed in an electrical current path. The thermistor layer comprises a thermosensitive particle, a plurality of electro-conductive particles covering a surface of the thermosensitive particle, and a binder adhering the electro-conductive particles, the electro-conductive particles form an electro-conductive network, at least the surface of the thermosensitive particle is made of a thermoplastic resin, the thermoplastic resin softens at a temperature lower than a temperature at which the binder softens, and the thermistor layer is provided to become highly resistive due to softening and deformation of the thermoplastic resin.
    Type: Application
    Filed: February 1, 2021
    Publication date: March 14, 2024
    Inventors: Nobuhiro TSUJI, Manabu MURATA, Hisashi KAWAKAMI, Yasuto IMAI, Yoshiro KOJIMA, Takao FUKUNAGA
  • Publication number: 20240042539
    Abstract: Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.
    Type: Application
    Filed: October 17, 2023
    Publication date: February 8, 2024
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Tsutomu HIYAMA, Nobuhiro KOJIMA
  • Patent number: 11819854
    Abstract: A placement holder 1 for an analysis according to the present invention includes a frame portion 10 for placing an analysis plate, and a coupling portion 11; wherein the analysis plate includes, respectively at opposite ends in a longitudinal direction thereof, protrusions protruding in the longitudinal direction; the frame portion 10 includes a pair of wall portions that are opposed to each other, and a space surrounded by the frame portion 10 has an area 12 in which the analysis plate is to be placed; the pair of wall portions have a pair of cavities 13 into which the protrusions of the analysis plate are to be inserted, and at least one of the pair of cavities 13 is a through hole; the wall portion having the through hole has, on an inner surface thereof, an inclined surface 14 formed such that an interval between inner surfaces of the pair of wall portions gradually decreases from an upper end side toward the through hole of the wall portion; and the coupling portion 11 is disposed below the pair of cavit
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: November 21, 2023
    Assignee: ENPLAS CORPORATION
    Inventors: Nobuhiro Kojima, Yasuhiro Watanabe, Koji Muraki, Tomoki Nakao
  • Patent number: 11819952
    Abstract: Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: November 21, 2023
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Tsutomu Hiyama, Nobuhiro Kojima
  • Publication number: 20210402498
    Abstract: Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.
    Type: Application
    Filed: May 24, 2021
    Publication date: December 30, 2021
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Tsutomu HIYAMA, Nobuhiro KOJIMA
  • Publication number: 20200316608
    Abstract: A placement holder 1 for an analysis according to the present invention includes a frame portion 10 for placing an analysis plate, and a coupling portion 11; wherein the analysis plate includes, respectively at opposite ends in a longitudinal direction thereof, protrusions protruding in the longitudinal direction; the frame portion 10 includes a pair of wall portions that are opposed to each other, and a space surrounded by the frame portion 10 has an area 12 in which the analysis plate is to be placed; the pair of wall portions have a pair of cavities 13 into which the protrusions of the analysis plate are to be inserted, and at least one of the pair of cavities 13 is a through hole; the wall portion having the through hole has, on an inner surface thereof, an inclined surface 14 formed such that an interval between inner surfaces of the pair of wall portions gradually decreases from an upper end side toward the through hole of the wall portion; and the coupling portion 11 is disposed below the pair of cavit
    Type: Application
    Filed: November 26, 2018
    Publication date: October 8, 2020
    Inventors: Nobuhiro KOJIMA, Yasuhiro WATANABE, Koji MURAKI, Tomoki NAKAO
  • Patent number: 7095313
    Abstract: A meter apparatus for a vehicle, includes a circuit board, a sound generating element mounted on one face of the circuit board, a back cover covering the face of the circuit board on which the sound-generating element is mounted, and a separate sound-generating element cap attached to the back cover and covering the sound-generating element in the state that the circuit board is covered with the back cover, the sound-generating element cap being adapted to adjust a sound pressure level of the sound-generating element.
    Type: Grant
    Filed: February 9, 2004
    Date of Patent: August 22, 2006
    Assignee: Calsonic Kansei Corporation
    Inventors: Saburou Gobe, Nobuhiro Kojima
  • Publication number: 20050146421
    Abstract: A meter apparatus for a vehicle, includes a circuit board, a sound generating element mounted on one face of the circuit board, a back cover covering the face of the circuit board on which the sound-generating element is mounted, and a separate sound-generating element cap attached to the back cover and covering the sound-generating element in the state that the circuit board is covered with the back cover, the sound-generating element cap being adapted to adjust a sound pressure level of the sound-generating element.
    Type: Application
    Filed: February 9, 2004
    Publication date: July 7, 2005
    Inventors: Saburou Gobe, Nobuhiro Kojima