Patents by Inventor Nobuhiro Kojima
Nobuhiro Kojima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240152049Abstract: Provided is an actinic ray-sensitive or radiation-sensitive resin composition that can provide a pattern having good cross-sectional rectangularity. The actinic ray-sensitive or radiation-sensitive resin composition includes: a resin having a group that is decomposed by the action of an acid to generate a polar group; an onium salt (I) that generates an acid represented by formula (1) upon irradiation with actinic rays or radiation; and an onium salt (II) having at least one structural moiety W that includes an anionic moiety A and a cationic moiety M and forms an acidic moiety represented by HA upon irradiation with the actinic rays or radiation. The acid dissociation constant derived from the acidic moiety represented by HA and formed by replacing the cationic moiety in the structural moiety W with H+ is larger than the acid dissociation constant of the acid represented by formula (1).Type: ApplicationFiled: December 21, 2023Publication date: May 9, 2024Applicant: FUJIFILM CorporationInventors: Masafumi KOJIMA, Yosuke BEKKI, Nobuhiro HIURA
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Patent number: 11932221Abstract: A system and method control an automobile by decelerating the automobile at a first deceleration using a braking mechanism in response to detecting that a parking brake switch is turned on, a second deceleration which is smaller than the first deceleration, in response to not detecting that the parking brake switch is turned on and determining that the driver is incapacitated, and a third deceleration which is smaller than the first deceleration, in response to determining that an SOS switch is turned on, detecting that the parking brake switch is changed from on to off, and not determining that the driver is incapacitated.Type: GrantFiled: September 23, 2021Date of Patent: March 19, 2024Assignee: MAZDA MOTOR CORPORATIONInventors: Takashi Hamada, Yuma Nishijo, Kouichi Kojima, Yoshiyuki Yamashita, Shinya Kyusaka, Yuta Tsuji, Nobuhiro Nonaka, Daisuke Shimizu, Keigo Fukuda, Yasuhiro Nakashima, Taro Oike
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Publication number: 20240087777Abstract: A thermistor layer of the present invention is configured to be disposed in an electrical current path. The thermistor layer comprises a thermosensitive particle, a plurality of electro-conductive particles covering a surface of the thermosensitive particle, and a binder adhering the electro-conductive particles, the electro-conductive particles form an electro-conductive network, at least the surface of the thermosensitive particle is made of a thermoplastic resin, the thermoplastic resin softens at a temperature lower than a temperature at which the binder softens, and the thermistor layer is provided to become highly resistive due to softening and deformation of the thermoplastic resin.Type: ApplicationFiled: February 1, 2021Publication date: March 14, 2024Inventors: Nobuhiro TSUJI, Manabu MURATA, Hisashi KAWAKAMI, Yasuto IMAI, Yoshiro KOJIMA, Takao FUKUNAGA
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Publication number: 20240042539Abstract: Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.Type: ApplicationFiled: October 17, 2023Publication date: February 8, 2024Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Tsutomu HIYAMA, Nobuhiro KOJIMA
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Patent number: 11819854Abstract: A placement holder 1 for an analysis according to the present invention includes a frame portion 10 for placing an analysis plate, and a coupling portion 11; wherein the analysis plate includes, respectively at opposite ends in a longitudinal direction thereof, protrusions protruding in the longitudinal direction; the frame portion 10 includes a pair of wall portions that are opposed to each other, and a space surrounded by the frame portion 10 has an area 12 in which the analysis plate is to be placed; the pair of wall portions have a pair of cavities 13 into which the protrusions of the analysis plate are to be inserted, and at least one of the pair of cavities 13 is a through hole; the wall portion having the through hole has, on an inner surface thereof, an inclined surface 14 formed such that an interval between inner surfaces of the pair of wall portions gradually decreases from an upper end side toward the through hole of the wall portion; and the coupling portion 11 is disposed below the pair of cavitType: GrantFiled: November 26, 2018Date of Patent: November 21, 2023Assignee: ENPLAS CORPORATIONInventors: Nobuhiro Kojima, Yasuhiro Watanabe, Koji Muraki, Tomoki Nakao
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Patent number: 11819952Abstract: Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.Type: GrantFiled: May 24, 2021Date of Patent: November 21, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Tsutomu Hiyama, Nobuhiro Kojima
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Publication number: 20210402498Abstract: Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.Type: ApplicationFiled: May 24, 2021Publication date: December 30, 2021Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Tsutomu HIYAMA, Nobuhiro KOJIMA
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Publication number: 20200316608Abstract: A placement holder 1 for an analysis according to the present invention includes a frame portion 10 for placing an analysis plate, and a coupling portion 11; wherein the analysis plate includes, respectively at opposite ends in a longitudinal direction thereof, protrusions protruding in the longitudinal direction; the frame portion 10 includes a pair of wall portions that are opposed to each other, and a space surrounded by the frame portion 10 has an area 12 in which the analysis plate is to be placed; the pair of wall portions have a pair of cavities 13 into which the protrusions of the analysis plate are to be inserted, and at least one of the pair of cavities 13 is a through hole; the wall portion having the through hole has, on an inner surface thereof, an inclined surface 14 formed such that an interval between inner surfaces of the pair of wall portions gradually decreases from an upper end side toward the through hole of the wall portion; and the coupling portion 11 is disposed below the pair of cavitType: ApplicationFiled: November 26, 2018Publication date: October 8, 2020Inventors: Nobuhiro KOJIMA, Yasuhiro WATANABE, Koji MURAKI, Tomoki NAKAO
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Patent number: 7095313Abstract: A meter apparatus for a vehicle, includes a circuit board, a sound generating element mounted on one face of the circuit board, a back cover covering the face of the circuit board on which the sound-generating element is mounted, and a separate sound-generating element cap attached to the back cover and covering the sound-generating element in the state that the circuit board is covered with the back cover, the sound-generating element cap being adapted to adjust a sound pressure level of the sound-generating element.Type: GrantFiled: February 9, 2004Date of Patent: August 22, 2006Assignee: Calsonic Kansei CorporationInventors: Saburou Gobe, Nobuhiro Kojima
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Publication number: 20050146421Abstract: A meter apparatus for a vehicle, includes a circuit board, a sound generating element mounted on one face of the circuit board, a back cover covering the face of the circuit board on which the sound-generating element is mounted, and a separate sound-generating element cap attached to the back cover and covering the sound-generating element in the state that the circuit board is covered with the back cover, the sound-generating element cap being adapted to adjust a sound pressure level of the sound-generating element.Type: ApplicationFiled: February 9, 2004Publication date: July 7, 2005Inventors: Saburou Gobe, Nobuhiro Kojima