Patents by Inventor Nobuhiro Mineshima

Nobuhiro Mineshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface acoustic wave device with a window for adjustment of the device
    Patent number: 6628179
    Abstract: In a surface-acoustic-wave (SAW) device and method of fabricating the same, a SAW chip is flip-chip mounted in a package. The package has a window facing an electrode formed surface of the SAW chip. After the SAW chip is mounted, the in-process item is inserted into reactive ion etching equipment, with the window open. The substrate or electrodes of the SAW chip is etched by an etching gas introduced into the ion etching equipment. Films may be formed on the electrode formation surface, in place of etching. Thus, variation in characteristics stemming from variations in manufacturing processes can be suppressed.
    Type: Grant
    Filed: September 4, 2001
    Date of Patent: September 30, 2003
    Inventors: Hiromi Yatsuda, Hiroaki Iijima, Nobuhiro Mineshima
  • Surface acoustic wave device and method of producing the same
    Publication number: 20020003459
    Abstract: In a surface-acoustic-wave (SAW) device and method of fabricating the same, a SAW chip is flip-chip mounted in a package. The package has a window facing an electrode formed surface of the SAW chip. After the SAW chip is mounted, the in-process item is inserted into reactive ion etching equipment, with the window open. The substrate or electrodes of the SAW chip is etched by an etching gas introduced into the ion etching equipment. Films may be formed on the electrode formation surface, in place of etching. Thus, variation in characteristics stemming from variations in manufacturing processes can be suppressed.
    Type: Application
    Filed: September 4, 2001
    Publication date: January 10, 2002
    Inventors: Hiromi Yatsuda, Hiroaki Iijima, Nobuhiro Mineshima
  • Method of making surface acoustic wave device
    Patent number: 6321444
    Abstract: In a surface-acoustic-wave (SAW) device and method of fabricating the same, a SAW chip is flip-chip mounted in a package. The package has a window facing an electrode formed surface of the SAW chip. After the SAW chip is mounted, the in-process item is inserted into reactive ion etching equipment, with the window open. The substrate or electrodes of the SAW chip is etched by an etching gas introduced into the ion etching equipment. Films may be formed on the electrode formation surface, in place of etching. Thus, variation in characteristics stemming from variations in manufacturing processes can be suppressed.
    Type: Grant
    Filed: April 11, 2000
    Date of Patent: November 27, 2001
    Assignee: Japan Radio Co., Ltd.
    Inventors: Hiromi Yatsuda, Hiroaki Iijima, Nobuhiro Mineshima