Abstract: An array substrate includes a glass substrate GS, an alignment mark 29, and first traces 19. The glass substrate GS has a corner portion 30 having an outline defined by a first edge portion 11b1 and a second edge portion 11b2 crossing the first edge portion 11b1. The alignment mark 29 is disposed at the corner portion 30 and used as the positioning index in mounting a driver 21 and a flexible printed circuit board 13. The alignment mark 29 at least includes first and second side portions 29a, 29b parallel to the first and second edge portions 11b1, 11b2, respectively. One end of the second side portion 29b is continuous to one end of the first side portion 29a. The alignment mark 29 has an outline that is on a same plane with a reference line BL connecting other ends of the first side portion 29a and the second side portion 29b linearly. The first traces 19 include inclined portions 31 that are inclined with respect to the first and second side portions 29a, 29b along the reference line BL.

Abstract: An array substrate includes a driver, a glass substrate having a driver mounting section where the driver is mounted, an anisotropic conductive material that is interposed between the driver and driver mounting section so as to electrically connect both and that at least includes a binder made of a thermosetting resin and conductive particles in the binder, and a heat supply part provided on at least the driver mounting section of the glass substrate for supplying heat to the anisotropic conductive material.

Abstract: A mounting substrate manufacturing apparatus includes a first FPC-side pressing member 51 configured to press and heat a first mounting component group 31 including one edge side mounting component that is a flexible printed circuit board 13 arranged on one edge in an arrangement direction in which flexible printed circuit boards 13 arranged on an array substrate 11B and thermally press and bond the first mounting component group 31 on the array substrate 11B, and a second FPC-side pressing member 52 arranged next to the first FPC-side pressing member 51 in the arrangement direction and configured to press and heat a second mounting component group 32 including all the flexible printed circuit boards 13 except for the first mounting component group 31 and thermally press and bond the second mounting component group 32 on the array substrate 11B.

Abstract: An array substrate includes a glass substrate GS, an alignment mark 29, and first traces 19. The glass substrate GS has a corner portion 30 having an outline defined by a first edge portion 11b1 and a second edge portion 11b2 crossing the first edge portion 11b1. The alignment mark 29 is disposed at the corner portion 30 and used as the positioning index in mounting a driver 21 and a flexible printed circuit board 13. The alignment mark 29 at least includes first and second side portions 29a, 29b parallel to the first and second edge portions 11b1, 11b2, respectively. One end of the second side portion 29b is continuous to one end of the first side portion 29a. The alignment mark 29 has an outline that is on a same plane with a reference line BL connecting other ends of the first side portion 29a and the second side portion 29b linearly. The first traces 19 include inclined portions 31 that are inclined with respect to the first and second side portions 29a, 29b along the reference line BL.

Abstract: A driver mounting apparatus 40 includes a pressing device 50 that collectively presses drivers 21 to be mounted on terminals 23, 24 of bonded substrates 11ab, 11ab each of which is obtained by bonding a CF substrate 11a and an array substrate 11b having terminals 23, 24 with the terminals 23, 24 being uncovered, and substrate support members 41, 41 supporting the bonded substrates 11ab, 11ab, respectively. The pressing device 50 includes a driver-side pressing portion 51 and a substrate-side pressing portion 52. The substrate support members 41, 41 are movable independently from each other to position each of the bonded substrates 11ab, 11ab supported on the substrate support members 41, 41 with respect to the driver-side pressing portion 41.

Abstract: A driver mounting apparatus 40 includes a driver mount-side heat supply support member 42, a substrate support member 41, a driver-side heat supply support member 43, a first moving portion 44, and a second moving portion 45. The driver mount-side heat supply support member 42 supports a driver mount portion GSd and supplies heat to the driver mount portion GSd. The substrate support member supports a substrate main portion GSm. The driver-side heat supply support member 43 supports and sandwich a driver 21 with the driver mount-side heat supply support member 42 and supplies heat to the driver 21. The first moving portion 44 relatively moves the driver mount portion GSd and the driver mount-side heat supply support member 42 in an overlapping direction in which the glass substrate GS and the driver 21 are overlapped. The second moving portion 45 relatively moves the driver 21 and the driver-side heat supply support member 43 in the overlapping direction.

Abstract: An array substrate includes a driver, a glass substrate having a driver mounting section where the driver is mounted, an anisotropic conductive material that is interposed between the driver and driver mounting section so as to electrically connect both and that at least includes a binder made of a thermosetting resin and conductive particles in the binder, and a heat supply part provided on at least the driver mounting section of the glass substrate for supplying heat to the anisotropic conductive material.

Abstract: This panel composite body 1 according to the present invention is provided with: a main panel 11 that has a large first substrate 111 and a small second substrate 112, the edge portion 111a of the large substrate 111 protruding further outwards than the edge portion 112a of the small substrate 112, and that has a polarizing plate 115 arranged on the outer surface 112c side of the second substrate so as to fit on the plate surface of the second substrate 112; a plate member 12 that, protruding further outwards than the edge portion 112a of the second substrate 112, sandwiches the polarizing plate 115 together with the second substrate 112; and an adhesive layer 21 that, bonding the main panel 11 and the plate member 12, is disposed between the polarizing plate 115 and the plate member 12 and, so as to cover the edge portion of the polarizing plate 115, between the second substrate 112 and the plate member 12.

Abstract: This panel composite body 1 according to the present invention is provided with: a main panel 11 that has a large first substrate 111 and a small second substrate 112, the edge portion 111a of the large substrate 111 protruding further outwards than the edge portion 112a of the small substrate 112, and that has a polarizing plate 115 arranged on the outer surface 112c side of the second substrate so as to fit on the plate surface of the second substrate 112; a plate member 12 that, protruding further outwards than the edge portion 112a of the second substrate 112, sandwiches the polarizing plate 115 together with the second substrate 112; and an adhesive layer 21 that, bonding the main panel 11 and the plate member 12, is disposed between the polarizing plate 115 and the plate member 12 and, so as to cover the edge portion of the polarizing plate 115, between the second substrate 112 and the plate member 12.

Abstract: A functional panel (FP) includes a COM substrate (4) and an SEG substrate (3) that face each other. The functional panel (FP) is combined with a display panel (LP) via an adhesive. The COM substrate (4), which is provided farther from the display panel (LP) than the SEG substrate (3) is, has edges (E1, E2) that face each other. The SEG substrate (3), which is provided closer to the display panel (LP) than the COM substrate (4) is, has (i) an edge (E3) provided along and inside the edge (E1) when viewed from above and (ii) an edge (E4) provided along and inside the edge (E2) when viewed from above. This effectively prevents the occurrence of a defective external shape.

Abstract: A heating plate is disclosed which is adapted for use in a dryer for drying a sheet of wood veneer by heating said plate at a desired level and placing one surface of the plate on either side thereof in engagement with the veneer sheet. The heating plate, when heated and placed in non-engagement state, is formed such that said one surface is convex shaped.

Abstract: Method of correcting the track of an intermittently-running endless belt in a veneer dryer is disclosed. In a veneer dryer having a pair of intermittently movable endless belts provided under tension so as to form at least one straight passage therebetween through which a veneer sheet is conveyed by the endless belts while being heated by heating plates located above and below the passage, and means disposed adjacent to the opposite lateral edges of the endless belts and movable toward and away from said lateral edges for moving the belts laterally, the tension is released to loosen the belts after a predetermined number of stops of the endless belts and the belts are then moved at the edge thereof on the side corresponding to the direction in which they are displaced, by said means located adjacent to said edge, until an area of normal running track is reached by the belts.