Abstract: An optical waveguide collimator includes: an optical waveguide base material which includes a light emitting face having a light emitting end face of an optical waveguide, and an adhering area face provided separated from the light emitting face; a collimator lens arranged on a light emitting end face side of the optical waveguide; and a lens holding member which holds the collimator lens and which is adhered and fixed to the adhering area face of the optical waveguide base material.

Abstract: Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU 2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.

Abstract: Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.

Abstract: A heat receiving member of a heat receiving device includes a coolant passage comprising a bag formed of a flexible sheet made up of a thermally stable, flexible plastic material and a metal film having high heat conductivity. In the coolant passage flows a coolant having an anti-corrosion property. A heat generating member including a main body and a terminal portion is supported by an adapter fitted in an opening formed in the flexible sheet. The main body of the heat generating member comes into direct contact with the coolant flowing in the coolant passage. Since the heat from the heat generating member is directly transferred to the coolant, the heat transfer path between the heat generating member and the coolant becomes shorter. Therefore, the heat resistance is reduced, so that the heat receiving efficiency is extremely high.