Abstract: Disclosed is a liquid treatment apparatus including a nozzle positioned below the substrate retained by a substrate retaining unit. The nozzle is capable of ejecting two fluids of a mixture of a liquid and a gas. The nozzle includes a plurality of liquid-ejecting passages for ejecting a liquid and a plurality of gas-ejecting passages for ejecting a gas, and also includes a plurality of liquid-ejecting ports each corresponding to one of the liquid-ejecting passages. The liquid-ejecting ports are arrayed on a horizontal line extending inwardly from a position below a peripheral portion of the substrate. The liquid-ejecting ports are configured to eject the liquid towards the lower surface of the substrate in an ejecting direction, and the ejecting direction is inclined at an inclination angle in a rotating direction of the substrate rotated by rotational driving unit with respect to a plane including the lower surface of the substrate.

Abstract: A substrate liquid processing apparatus of the present invention includes a guide rotary cup configured to guide a process-liquid scattering from a substrate rotating and being held by a substrate holding table and a guide cup configured to guide downward the process-liquid guided by the guide rotary cup. The guide cup includes a downward extension portion extending downward from an inner peripheral end portion of a guide cup body and an inner peripheral extension portion extending inward from the inner peripheral end portion more than the downward extension portion. The inner peripheral extension portion is configured to form a gas guide space together with the guide rotary cup and the downward extension portion so that a gas turning by the rotation of the guide rotary cup can be guided downward.

Abstract: A coating film forming apparatus that holds a substrate upon a spin chuck and forms a coating film by supplying a chemical liquid upon a top surface of said substrate comprises: an outer cup provided detachably to surround the spin chuck; an inner cup provided detachably to surround a region underneath the substrate held upon the chuck; a cleaning nozzle configured to supply a cleaning liquid for cleaning a peripheral edge part of the substrate, such that the cleaning liquid is supplied to a peripheral part of a bottom surface of the substrate; a cutout part for nozzle mounting, the cutout part being provided to the inner cup to engage with the cleaning nozzle; and a cleaning liquid supply tube connected to the cleaning nozzle, the cleaning nozzle being detachable to the cutout part in a state in which the cleaning liquid supply tube is connected.

Abstract: Disclosed are a flow path switching apparatus and a fluid processing apparatus having a liquid processing unit that performs a processing by supplying different kinds of processing fluid to wafer W at different timings The atmosphere of the liquid processing unit is discharged fluid to a plurality of exclusive exhaust paths through exhaust paths and flow path switching units. A flow path switching unit includes an outer tube having a plurality of connection holes and a rotary tube inserted into the outer tube having a plurality of openings. In particular, one of the plurality of openings of the rotary tube is aligned with one of the plurality of connection holes of the outer tube in such a way that only an aligned set of an opening of the rotary tube and a connection hole of the outer tube is sequentially communicated during the rotation of the rotary tube.

Abstract: A substrate liquid processing apparatus of the present invention includes a process-liquid supply unit selectively supplying a plurality of types of process-liquids to the substrate held by a substrate holding table, first and second guide cups which are disposed in this order from the top and are configured to respectively guide downward the process-liquid scattering from the rotating substrate while being held by the substrate holding table; and a position adjustment mechanism adjusting a positional relationship between the first and second guide cups and the substrate holding table. A first process-liquid recovery tank is provided at a lower area of the first and second guide cups and recovers the process-liquid guided by the first guide cup. A second process-liquid recovery tank is provided at the inner peripheral side of the first process-liquid recovery tank and recovers the process-liquid guided by the second guide cup.

Abstract: A substrate liquid processing apparatus includes a placement table configured to hold a substrate, a rotary driving unit configured to rotate the placement table, a liquid supply unit configured to supply a liquid to the substrate placed on the placement table, and an upper liquid guide cup, a central liquid guide cup, and a lower liquid guide cup which are disposed in this order from the top and are configured to guide downward the liquid scattering from the rotating substrate being placed on the placement table. A driving mechanism is configured to move up and down the upper liquid guide cup, the central liquid guide cup, and the lower liquid guide cup. The driving mechanism is connected to the central liquid guide cup.

Abstract: A liquid treatment apparatus treating a surface of a substrate held generally horizontally on a stage in a housing by supplying a treating liquid to said surface from a supply nozzle. The liquid treatment apparatus includes a cup body provided so as to surround the substrate held in the substrate holding part laterally, the cup body being mounted detachably to a base inside the housing from an upward direction thereof; a cup body holding part holding the cup body detachably; and an elevating mechanism moving the cup body holding part up and down between a first position at which the cup body is mounted upon the base body and a second position located above the first position.

Abstract: A liquid treatment apparatus treating a surface of a substrate held generally horizontally on a stage in a housing by supplying a treating liquid to said surface from a supply nozzle. The liquid treatment apparatus includes a cup body provided so as to surround the substrate held in the substrate holding part laterally, the cup body being mounted detachably to a base inside the housing from an upward direction thereof; a cup body holding part holding the cup body detachably; and an elevating mechanism moving the cup body holding part up and down between a first position at which the cup body is mounted upon the base body and a second position located above the first position.

Abstract: A spin chuck rotatably holds a semiconductor wafer, while resist is dropped on a surface of the semiconductor wafer through a resist application nozzle and thus applied thereon, and before the resist applied on the wafer dries, a cleaning liquid is supplied through a bevel cleaning nozzle to a portion of the wafer located at a peripheral portion thereof in a vicinity of a beveled portion to remove the resist adhering to the beveled portion. Thereafter, a film of the resist that is formed on the surface of the wafer is dried.

Abstract: Disclosed is a liquid processing apparatus and a liquid processing method that can prevent a processing liquid from being left on a lift pin after a drying-out process of a substrate, thereby preventing the processing liquid from being attached to the back surface of the substrate after the liquid processing. The liquid processing apparatus of the present disclosure includes a holding plate that supports a substrate, a lift pin plate provided above the holding plate having a lift pin that supports the wafer from a lower side, and a processing liquid supply unit that supplies the processing liquid to the back surface of the wafer. The processing liquid supply unit is provided with a head part configured to close a penetrating hole of the lift pin plate. The processing liquid supply unit and the lift pin plate are configured to be elevated with respect to the holding plate.

Abstract: A coating apparatus includes a liquid film forming mechanism configured to form a liquid film of a process liquid for preventing a contaminant derived from a coating liquid from being deposited or left on a back side peripheral portion of a substrate. The liquid film forming mechanism includes a counter face portion facing the back side peripheral portion of the substrate and a process liquid supply portion for supplying the process liquid onto the counter face portion. The coating apparatus further includes a posture regulating mechanism disposed around the substrate holding member and configured to damp a vertical wobble of the peripheral portion of the substrate being rotated. The posture regulating mechanism includes delivery holes arrayed in a rotational direction of the substrate and configured to deliver a gas onto a back side region of the substrate on an inner side of the peripheral portion.

Abstract: A coating apparatus includes a driving unit configured to rotate a substrate holding member about a vertical axis to spread a coating liquid supplied on a front side central portion of a substrate toward a front side peripheral portion of the substrate by a centrifugal force. The apparatus is provided with a wobble damping mechanism including a gas delivery port and a suction port both disposed to face a back side of the substrate and configured to damp a wobble of the substrate being rotated by delivering a gas from the delivery port and sucking the gas into the suction port.

Abstract: A coating film forming apparatus that holds a substrate upon a spin chuck and forms a coating film by supplying a chemical liquid upon a top surface of said substrate comprises: an outer cup provided detachably to surround the spin chuck; an inner cup provided detachably to surround a region underneath the substrate held upon the chuck; a cleaning nozzle configured to supply a cleaning liquid for cleaning a peripheral edge part of the substrate, such that the cleaning liquid is supplied to a peripheral part of a bottom surface of the substrate; a cutout part for nozzle mounting, the cutout part being provided to the inner cup to engage with the cleaning nozzle; and a cleaning liquid supply tube connected to the cleaning nozzle, the cleaning nozzle being detachable to the cutout part in a state in which the cleaning liquid supply tube is connected.

Abstract: A liquid treatment apparatus treating a surface of a substrate held generally horizontally on a stage in a housing by supplying a treating liquid to said surface from a supply nozzle. The liquid treatment apparatus includes a cup body provided so as to surround the substrate held in the substrate holding part laterally, the cup body being mounted detachably to a base inside the housing from an upward direction thereof; a cup body holding part holding the cup body detachably; and an elevating mechanism moving the cup body holding part up and down between a first position at which the cup body is mounted upon the base body and a second position located above the first position.

Abstract: A spin chuck rotatably holds a semiconductor wafer, while resist is dropped on a surface of the semiconductor wafer through a resist application nozzle and thus applied thereon, and before the resist applied on the wafer dries, a cleaning liquid is supplied through a bevel cleaning nozzle to a portion of the wafer located at a peripheral portion thereof in a vicinity of a beveled portion to remove the resist adhering to the beveled portion. Thereafter, a film of the resist that is formed on the surface of the wafer is dried.