Patents by Inventor Nobuhiro Sakurai
Nobuhiro Sakurai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210089983Abstract: A vehicle ride-sharing assist system includes a user terminal, a vehicle terminal, and a host server. The host server includes a proximity notification unit for generating a proximity notification signal when a distance between a user and a ride-sharing vehicle becomes equal to or less than a prescribed value. The vehicle terminal includes a user response request unit for generating a user response request signal on receiving the proximity notification signal. The user terminal includes a user side notification/operation unit for notifying the user of a specific motion or cause the user terminal to perform a specific operation according to the user response request signal. The vehicle terminal further includes a user position identification unit for detecting the motion of the user or the operation of the user terminal and identifying a position of the user. A user position notification unit notifies the identified position to the driver.Type: ApplicationFiled: January 17, 2019Publication date: March 25, 2021Inventors: Ryusuke TAMANAHA, Yasuhiro SAWADA, Isao UEMATSU, Nobuhiro SAKURAI
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Patent number: 8250934Abstract: There is provided a multi-axis force sensor including first and second bridge circuit groups detecting resistances of respective first and second groups of strain resistance elements provided at respective strain producing portions. The strain producing portions are formed on two axes intersecting with respect to each other at a right angle. The first group of strain resistance elements are arranged on one axis across an action portion so as to face with respect to each other, and the second group of strain resistance elements are arranged on another axis across the action portion so as to face with respect to each other. The first bridge circuit groups respectively output a positive voltage when receiving tensile force, and the second bridge circuit groups respectively output a negative voltage when receiving tensile force.Type: GrantFiled: February 9, 2010Date of Patent: August 28, 2012Assignee: Honda Motor Co., Ltd.Inventor: Nobuhiro Sakurai
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Patent number: 7938028Abstract: A force sensor comprises a force sensor chip, and a buffering device for dampening and applying incoming external force to the force sensor chip. The buffering device comprises an input portion to which external force is input, a sensor mount for fixing the force sensor chip to the exterior, a dampening mechanism for dampening external force, and a transmission portion for transmitting the dampened external force to the active sensing portion.Type: GrantFiled: August 19, 2009Date of Patent: May 10, 2011Assignee: Honda Motor Co., Ltd.Inventors: Yusuke Hirabayashi, Takeshi Ohsato, Nobuhiro Sakurai, Shigenori Yasuie, Hiroshi Yokobayashi
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Publication number: 20100199783Abstract: There is provided a multi-axis force sensor including first and second bridge circuit groups detecting resistances of respective first and second groups of strain resistance elements provided at respective strain producing portions. The strain producing portions are formed on two axes intersecting with respect to each other at a right angle. The first group of strain resistance elements are arranged on one axis across an action portion so as to face with respect to each other, and the second group of strain resistance elements are arranged on another axis across the action portion so as to face with respect to each other. The first bridge circuit groups respectively output a positive voltage when receiving tensile force, and the second bridge circuit groups respectively output a negative voltage when receiving tensile force.Type: ApplicationFiled: February 9, 2010Publication date: August 12, 2010Applicant: Honda Motor Co., Ltd.Inventor: Nobuhiro SAKURAI
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Patent number: 7757571Abstract: A force sensor with a force sensor chip, and a buffering device for dampening and applying incoming external force to the force sensor chip. The buffering device includes an input portion to which external force is input, a sensor mount for fixing the force sensor chip to the exterior, a dampening mechanism for dampening external force, and a transmission portion for transmitting the dampened external force to the active sensing portion.Type: GrantFiled: July 3, 2008Date of Patent: July 20, 2010Assignee: Honda Motor Co., Ltd.Inventors: Yusuke Hirabayashi, Takeshi Ohsato, Nobuhiro Sakurai, Shigenori Yasuie, Hiroshi Yokobayashi
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Patent number: 7707899Abstract: A force sensor chip including a semiconductor substrate having a plurality of strain resistance elements and temperature-compensating resistance elements corresponding to the resistance elements is disclosed. The structure in the periphery of parts where the strain resistance elements, which are provided to deforming parts in the action part formed on the semiconductor substrate, are disposed is the same as the structure in the periphery of parts where the temperature-compensating resistance elements in the action part are disposed.Type: GrantFiled: December 12, 2007Date of Patent: May 4, 2010Assignee: Honda Motor Co., Ltd.Inventors: Nobuhiro Sakurai, Takeshi Ohsato
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Patent number: 7703340Abstract: A force sensor chip which comprises: a base member, which includes an action portion to which an external force is applied through an attenuator, a support portion supporting the action portion, and a connection portion which connects the action portion and the support portion and deflects according to the applied external force; and a plurality of strain resistance elements which are arranged in the connection portion and detect the applied external force based on a deflection of the connection portion, wherein longitudinal directions of the plurality of the strain resistance elements are oriented in an identical direction.Type: GrantFiled: August 29, 2007Date of Patent: April 27, 2010Assignee: Honda Motor Co., Ltd.Inventors: Nobuhiro Sakurai, Takeshi Ohsato
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Publication number: 20090301226Abstract: A force sensor comprises a force sensor chip, and a buffering device for dampening and applying incoming external force to the force sensor chip. The buffering device comprises an input portion to which external force is input, a sensor mount for fixing the force sensor chip to the exterior, a dampening mechanism for dampening external force, and a transmission portion for transmitting the dampened external force to the active sensing portion.Type: ApplicationFiled: August 19, 2009Publication date: December 10, 2009Inventors: Yusuke Hirabayashi, Takeshi Ohsato, Nobuhiro Sakurai, Shigenori Yasuie, Hiroshi Yokobayashi
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Patent number: 7594445Abstract: A force sensor comprises a force sensor chip, and a buffering device for dampening and applying incoming external force to the force sensor chip. The buffering device comprises an input portion to which external force is input, a sensor mount for fixing the force sensor chip to the exterior, a dampening mechanism for dampening external force, and a transmission portion for transmitting the dampened external force to the active sensing portion.Type: GrantFiled: June 28, 2006Date of Patent: September 29, 2009Assignee: Honda Motor Co., Ltd.Inventors: Yusuke Hirabayashi, Takeshi Ohsato, Nobuhiro Sakurai, Shigenori Yasuie, Hiroshi Yokobayashi
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Patent number: 7536922Abstract: In a force sensor chip, a semiconductor substrate includes: a plurality of operating parts each including an external-force acting area section and a non-deforming section; a supporting part for supporting the operating parts, and a plurality of connecting parts for connecting the operating parts and the supporting part. Strain resistance elements are provided on deformation-generating sections of the connecting parts. The plurality of operating parts are provided, in corresponding relation to the plurality of connecting parts, between the connecting parts and the supporting part.Type: GrantFiled: August 13, 2007Date of Patent: May 26, 2009Assignee: Honda Motor Co., Ltd.Inventors: Nobuhiro Sakurai, Takeshi Ohsato
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Patent number: 7536923Abstract: A force sensor chip having a multiaxial force sensing function is disclosed. The force sensor chip comprises a base member having an operating part provided with an external force application area, a supporting part for supporting the operating part, connecting parts for connecting the operating part and the supporting part, and strain resistance elements disposed in the connecting parts or within boundaries between the connecting parts and the operating part. The base member has a thin area formed with a small thickness, and the boundaries of the thin area are disposed in the supporting part and operating part.Type: GrantFiled: May 1, 2007Date of Patent: May 26, 2009Assignee: Honda Motor Co., Ltd.Inventors: Yusuke Hirabayashi, Nobuhiro Sakurai, Takeshi Ohsato
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Patent number: 7490524Abstract: In a force sensor chip, a base member, to which an external force is applied, includes: an operating part provided in a central portion of the base member and having an external-force acting area section; a supporting part provided, in an outer peripheral portion of the base member, for supporting the operating part; an intermediate part provided between the operating part and the supporting part; a first connecting arm section connecting the operating part and the intermediate section; a second connecting arm section connecting the intermediate part and the supporting part; and at least one strain resistance element provided on each of respective deformation-generating portions of the first and the second connecting arm sections.Type: GrantFiled: July 31, 2007Date of Patent: February 17, 2009Assignee: Honda Motor Co., Ltd.Inventors: Takeshi Ohsato, Nobuhiro Sakurai
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Patent number: 7458281Abstract: A multi-axis sensor chip provided by the invention includes a semiconductor substrate having an action part having an external force action area part and non-deforming area parts, a support part supporting the action part, and connecting parts connecting the action part to the support part. The sensor chip also has strain resistance devices provided on deforming parts of the connecting parts and has temperature-compensating resistance devices provided on the non-deforming area parts. Temperature compensation is carried out exactly by means of the temperature-compensating resistance devices when an external force or a load acts on the action part, and highly accurate stress detection can be carried out.Type: GrantFiled: October 25, 2005Date of Patent: December 2, 2008Assignee: Honda Motor Co., Ltd.Inventors: Takeshi Ohsato, Nobuhiro Sakurai, Yusuke Hirabayashi, Hiroshi Yokobayashi
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Publication number: 20080282813Abstract: A force sensor with a force sensor chip, and a buffering device for dampening and applying incoming external force to the force sensor chip. The buffering device includes an input portion to which external force is input, a sensor mount for fixing the force sensor chip to the exterior, a dampening mechanism for dampening external force, and a transmission portion for transmitting the dampened external force to the active sensing portion.Type: ApplicationFiled: July 3, 2008Publication date: November 20, 2008Inventors: Yusuke Hirabayashi, Takeshi Ohsato, Nobuhiro Sakurai, Shigenori Yasuie, Hiroshi Yokobayashi
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Publication number: 20080156112Abstract: A force sensor chip including a semiconductor substrate having a plurality of strain resistance elements and temperature-compensating resistance elements corresponding to the resistance elements is disclosed. The structure in the periphery of parts where the strain resistance elements, which are provided to deforming parts in the action part formed on the semiconductor substrate, are disposed is the same as the structure in the periphery of parts where the temperature-compensating resistance elements in the action part are disposed.Type: ApplicationFiled: December 12, 2007Publication date: July 3, 2008Inventors: Nobuhiro Sakurai, Takeshi Ohsato
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Publication number: 20080066562Abstract: A force sensor chip which comprises: a base member, which includes an action portion to which an external force is applied through an attenuator, a support portion supporting the action portion, and a connection portion which connects the action portion and the support portion and deflects according to the applied external force; and a plurality of strain resistance elements which are arranged in the connection portion and detect the applied external force based on a deflection of the connection portion, wherein longitudinal directions of the plurality of the strain resistance elements are oriented in an identical direction.Type: ApplicationFiled: August 29, 2007Publication date: March 20, 2008Inventors: Nobuhiro Sakurai, Takeshi Ohsato
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Publication number: 20080053247Abstract: In a force sensor chip, a semiconductor substrate includes: a plurality of operating parts each including an external-force acting area section and a non-deforming section; a supporting part for supporting the operating parts, and a plurality of connecting parts for connecting the operating parts and the supporting part. Strain resistance elements are provided on deformation-generating sections of the connecting parts. The plurality of operating parts are provided, in corresponding relation to the plurality of connecting parts, between the connecting parts and the supporting part.Type: ApplicationFiled: August 13, 2007Publication date: March 6, 2008Inventors: Nobuhiro Sakurai, Takeshi Ohsato
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Publication number: 20080034897Abstract: In a force sensor chip, a base member, to which an external force is applied, includes: an operating part provided in a central portion of the base member and having an external-force acting area section; a supporting part provided, in an outer peripheral portion of the base member, for supporting the operating part; an intermediate part provided between the operating part and the supporting part; a first connecting arm section connecting the operating part and the intermediate section; a second connecting arm section connecting the intermediate part and the supporting part; and at least one strain resistance element provided on each of respective deformation-generating portions of the first and the second connecting arm sections.Type: ApplicationFiled: July 31, 2007Publication date: February 14, 2008Inventors: Takeshi Ohsato, Nobuhiro Sakurai
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Publication number: 20070266797Abstract: A force sensor chip having a multiaxial force sensing function is disclosed. The force sensor chip comprises a base member having an operating part provided with an external force application area, a supporting part for supporting the operating part, connecting parts for connecting the operating part and the supporting part, and strain resistance elements disposed in the connecting parts or within boundaries between the connecting parts and the operating part. The base member has a thin area formed with a small thickness, and the boundaries of the thin area are disposed in the supporting part and operating part.Type: ApplicationFiled: May 1, 2007Publication date: November 22, 2007Inventors: Yusuke Hirabayashi, Nobuhiro Sakurai, Takeshi Ohsato
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Publication number: 20070006668Abstract: A force sensor comprises a force sensor chip, and a buffering device for dampening and applying incoming external force to the force sensor chip. The buffering device comprises an input portion to which external force is input, a sensor mount for fixing the force sensor chip to the exterior, a dampening mechanism for dampening external force, and a transmission portion for transmitting the dampened external force to the active sensing portion.Type: ApplicationFiled: June 28, 2006Publication date: January 11, 2007Inventors: Yusuke Hirabayashi, Takeshi Ohsato, Nobuhiro Sakurai, Shigenori Yasuie, Hiroshi Yokobayashi