Abstract: A purpose is to provide a method for producing a wafer lens and a device, capable of forming a wafer lens provided with a plurality of optical elements having intended properties. In order to adjust the gap between a molding die 91 and a transparent substrate 95, a positioning device 50 provided independently of the molding die 91 is used, and thus provision of a gap-adjusting projection in the molding die 91 becomes unnecessary and the thickness of an optical element 15 based on an optical surface Pd can be set regardless of the thickness of the transparent substrate 95. Consequently, there can be formed a wafer lens WL provided with a plurality of optical elements 15 having intended properties.

Abstract: Since a second molding surface 103a is separated from the second mold 42 before a first molding surface 102a is completely separated from the first mold 41, in a state difficult to take the unbalanced force, the separating force is applied at the same time on the first and the second molding surfaces 102a and 103a of the substrate 101, it is possible to prevent damage to the substrate 101 at the time of mold release even if the substrate 101 is comparatively thin. Since the mold release is performed with unseparated portions remaining on each of the first and the second molding surfaces 102a and 103a, it is unnecessary to separately provide a step of protecting a first and a second optical surfaces 11d and 12d on the opposite side during the mold release, whereby a precise wafer lens 100 can be produced simply and efficiently.

Abstract: Disclosed is a method for producing an imaging lens in which a plurality of layers including one or more wafer lenses each provided with a lens portion that is formed from a curable resin are laminated on at least one surface of a substrate. The method for producing an imaging lens comprises, before lamination of the plurality of layers including the wafer lenses, a first lens portion cleaning step wherein carbon dioxide cleaning of the lens portions is carried out by spouting carbon dioxide so as to form dry ice particles and by causing the dry ice particles to hit on the lens portions of the wafer lenses or the vicinities of the lens portions. Consequently, deterioration of optical performance, changes in optical performance due to moisture absorption, and separation of the resin from the substrate can be prevented.

Abstract: Disclosed is a method for producing a wafer lens, wherein misalignment between a glass substrate and a molding mold is suppressed from occurring. The method for producing a wafer lens comprises: a step wherein, in a first reduced pressure atmosphere, an energy-curable resin is arranged between a glass substrate (11) and a molding mold, and the glass substrate (11) is pressed against the molding mold, while sucking the glass substrate (11) and affixing the molding mold; a step wherein, in a second reduced pressure atmosphere that is under a higher pressure than the first reduced pressure atmosphere, the arrangement of the glass substrate (11) and the molding mold is adjusted while sucking the glass substrate (11) and affixing the molding mold; and a step wherein the energy-curable resin is cured by applying energy to the energy-curable resin, and the glass substrate (11) is released from the molding mold.

Abstract: Disclosed are a method for producing a wafer lens and an apparatus for producing the same, wherein a high precision wafer lens is obtained easily. Specifically disclosed is a method for producing a wafer lens in which at least one surface of a glass substrate is provided with a lens part that is formed of photocurable resin. The method comprises in order: a dispensing step wherein photocurable resin is dispensed to a mold having a surface of a negative shape corresponding to an optical surface shape of the lens part; an imprinting step wherein the resin and the glass plate are pressed against each other; an exposure step wherein the resin is irradiated with light; and a releasing step wherein the mold is separated from the glass substrate, wherein the pressure is reduced in at least a part of the dispensing step, imprinting step, exposure step and the releasing step.

Abstract: A device for producing a wafer lens, including: a stage which supports a glass substrate; an XY-axis moving mechanism which moves the stage on an XY-plane; an XY air slide guide mechanism which floats the stage relative to an XY guide by means of air, and guides the movement of the stage; a molding die to be filled with resin; a Z-axis moving mechanism which elevates or lowers the molding die; a Z air slide guide mechanism which floats the molding die relative to a Z guide by means of air, and guides the elevation and lowering of the molding die; and a control device which locks a moving position of the stage by controlling an activation and a deactivation of the XY air slide guide mechanism, and also locks a moving position of the molding die by controlling an activation or a deactivation of the Z air slide guide mechanism.

Abstract: A producing method for an image pickup device in which an image pickup optical unit that picks up an image of an object is provided on a base board, wherein there are provided a first process for mounting an image sensor and other electric parts on the base board and a second process for assembling the image pickup optical unit on the base board from one direction, and the first process and the second process are independent from each other.

Abstract: A producing method for an image pickup device in which an image pickup optical unit that picks up an image of an object is provided on a base board, wherein there are provided a first process for mounting an image sensor and other electric parts on the base board and a second process for assembling the image pickup optical unit on the base board from one direction, and the first process and the second process are independent from each other.