Patents by Inventor Nobuhiro Suematsu

Nobuhiro Suematsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin-molded semiconductor device and method for manufacturing the same
    Publication number: 20010045640
    Abstract: A semiconductor chip (15) is bonded on a die pad (13) of a leadframe, and inner leads (12) are electrically connected to electrode pads of the semiconductor chip (15) with metal fine wires (16). The die pad (13), semiconductor chip (15) and inner leads are molded with a resin encapsulant (17). However, no resin encapsulant (17) exists on the respective back surfaces of the inner leads (12), which protrude downward from the back surface of the resin encapsulant (17) so as to be external electrodes (18). That is to say, since the external electrodes (18) protrude, a standoff height can be secured in advance for the external electrodes (18) in bonding the external electrodes (18) to electrodes of a motherboard. Thus, the external electrodes (18) may be used as external terminals as they are, and no ball electrodes of solder or the like need to be provided for the external electrodes (18). Accordingly, this process is advantageous in terms of the number of manufacturing process steps and the manufacturing costs.
    Type: Application
    Filed: July 20, 2001
    Publication date: November 29, 2001
    Inventors: Seishi Oida, Yukio Yamaguchi, Nobuhiro Suematsu
  • Resin molded semiconductor device and method for manufacturing the same
    Patent number: 6291274
    Abstract: A method for manufacturing a semiconductor chip (15) which is bonded on a die pad (13) of a leadframe, and inner leads (12) are electrically connected to electrode pads of the semiconductor chip (15) with metal fine wires (16). The die pad (13), semiconductor chip (15) and inner leads are molded with a resin encapsulant (17). However, no resin encapsulant (17) exists on the respective back surfaces of the inner leads (12), which protrude downward from the back surface of the resin encapsulant (17) so as to be external electrodes (18).
    Type: Grant
    Filed: July 21, 1999
    Date of Patent: September 18, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seishi Oida, Yukio Yamaguchi, Nobuhiro Suematsu
  • Method for manufacturing resin-molded semiconductor device
    Patent number: 6258314
    Abstract: According to the present invention, a method for manufacturing a resin-molded semiconductor device by interposing a sealing sheet within a molding die for encapsulating a lead frame, on which a semiconductor chip has been bonded, with a molding compound, is provided. In adhering the sealing sheet to the lead frame and encapsulating the lead frame with the molding compound, tension is applied to the sealing sheet.
    Type: Grant
    Filed: June 20, 2000
    Date of Patent: July 10, 2001
    Assignee: Matsushita Electronics Corporation
    Inventors: Seishi Oida, Yukio Yamaguchi, Nobuhiro Suematsu, Takeshi Morikawa, Yuichiro Yamada
  • Method for manufacturing resin-molded semiconductor device
    Patent number: 6126885
    Abstract: According to the present invention, a method for manufacturing a resin-molded semiconductor device by interposing a sealing sheet within a molding die for encapsulating a lead frame, on which a semiconductor chip has been bonded, with a molding compound, is provided. In adhering the sealing sheet to the lead frame and encapsulating the lead frame with the molding compound, tension is applied to the sealing sheet.
    Type: Grant
    Filed: June 26, 1998
    Date of Patent: October 3, 2000
    Assignee: Matsushita Electronics Corporation
    Inventors: Seishi Oida, Yukio Yamaguchi, Nobuhiro Suematsu, Takeshi Morikawa, Yuichiro Yamada