Abstract: The invention provides a thermal adhesive laminated oriented film containing a substrate layer comprising a resin composition containing 99.9 to 60% by mass of a polyamide resin or a polymethylpentene resin and 0.1 to 40% by mass of a modified polyolefin resin; and a thermal adhesive layer containing a thermal adhesive polyolefin resin and provided on each of both surfaces of the substrate layer so as to be in direct contact therewith by coextrusion. When a machine direction is defined as an X axis, a transverse direction is defined as a Y axis, and a thickness direction is defined as a Z axis, the film is stretched and oriented in at least one direction of the X axis or the Y axis, and has a thermal deformation rate at 150° C. of 4% or less in both directions of the X axis and the Y axis.

Abstract: [PROBLEM] To provide a polyamide resin composition capable of stably providing a molded article which is less likely to be affected by variations in production conditions, and has high rigidity, and good appearance. [SOLUTION] A polyamide resin composition including 0 to 3 parts by mass of a metal hypophosphite (D) with respect to a total of 100 parts by mass of 20 to 60 parts by mass of an aliphatic polyamide resin (A), 5 to 20 parts by mass of a polyamide MXD6 resin (B), and 30 to 59 parts by mass of an inorganic reinforcing material (C), wherein the polyamide resin composition has an MFR of 3 to 60 g/10 min when measured under conditions of a load of 2.16 kg and 275° C.

Abstract: The present invention aims to provide an inorganic reinforced polyamide resin composition that achieves incompatible mechanical properties, i.e., high stiffness and impact resistance (high toughness), has excellent flowability, and further has excellent long-term wear resistance (high sliding performance) to an inorganic fiber reinforcing material used as a sliding counterpart material. An inorganic reinforced polyamide resin composition containing: 10 to 55 mass% of a crystalline polyamide resin (A); 1 to 20 mass% of an amorphous polyamide resin (B); 40 to 70 mass% of an inorganic reinforcing material (C); and 0.5 to 10 mass% of a modified polyolefin resin (D) having a reactive functional group that is capable of reacting with a terminal group and/or a main-chain amide group of a polyamide resin, characterized in that a blending mass ratio between the components (A) and (D) satisfies 0.01 ? (D)/(A) ? 0.2, and a blending mass ratio between the components (A) and (B) satisfies 0.05 ? (B)/(A) ? 0.7.

Abstract: A method for producing a polyamide resin composition containing a crystalline polyamide resin (A) containing a polycaproamide resin as a main component, a semi-aromatic amorphous polyamide resin (B), an inorganic reinforcing material (C), a master batch of carbon black (D), and a copper compound (E); a dispersion liquid of the copper compound (E) has a concentration of 0.04% by mass to 1.0% by mass; and the crystalline polyamide resin (A) containing a polycaproamide resin as a main component, the semi-aromatic amorphous polyamide resin (B), the master batch of carbon black (D), and the dispersion liquid of the copper compound (E) are mixed in advance, followed by charging the mixture is into a hopper part of an extruder, and charging the inorganic reinforcing material (C) into the extruder by a side feed method.

Abstract: A polyamide resin composition includes: (A) a crystalline polyamide resin including a polycapramide resin as a main component; (B) a semi-aromatic amorphous polyamide resin; (C) an inorganic reinforcing material, (D) a carbon black masterbatch; and (E) a copper compound, wherein as (C) the inorganic reinforcing material, the polyamide resin composition includes (C-1) a glass fiber, (C-2) a needle-shaped wollastonite, and (C-3) a plate-crystal inorganic reinforcing material, a melt mass flow rate (MFR) and a cooling crystallization temperature (TC2) of the polyamide resin composition fall within predetermined respective ranges, mass ratios and contents of the component satisfy specific conditions. By the polyamide resin composition, not only a molded product having a higher level of external appearance is obtained when a mold temperature is less than or equal to 100° C. during molding, but also an excellent weather resistance of the external appearance of the surface of the molded product is attained.

Abstract: Provided is a polyamide resin composition which is used for a foam molded body and has high appearance performance, high load resistance, and high impact resistance. This polyamide resin composition for foam molding contains: 40 to 70 parts by mass of a crystalline polyamide resin (A); 5 to 15 parts by mass of a non-crystalline polyamide resin (B); 15 to 50 parts by mass of an inorganic reinforcing material (C); 0.1 to 10 parts by mass of an elastomer (D); and 0.5 to 15 parts by mass of a copolymer (E) having a functional group that reacts with a terminal group of the polyamide resin. The total amount of the crystalline polyamide resin (A), the non-crystalline polyamide resin (B), the inorganic reinforcing material (C), the elastomer (D), and the copolymer (E) having a functional group that reacts with a terminal group of the polyamide resin is 100 parts by mass.

Abstract: The present invention provides a polyamide-based resin composition for injection molding suitable for a sliding component required to have excellent moldability, heat resistance stability, abrasion resistance, and sliding stability. The polyamide-based resin composition is a polyamide-based resin composition for injection molding containing a crystalline polyamide resin (A) and a polyester fiber (B) having a liquid crystal skeleton. The crystalline polyamide resin (A) preferably has a melting point of 170° C. or higher, and the polyamide-based resin composition preferably contains 0.1 to 40% by mass of the polyester fiber (B) having a liquid crystal skeleton based on the total mass of the polyamide-based resin composition.

Abstract: The present invention aims to provide a glass-fiber-reinforced polyamide resin composition, characterized in that, the composition contains a crystalline aliphatic polyamide resin (A), an amorphous polyamide resin (B), an acrylic resin (C), mica (D), glass fiber (E) and a master batch of carbon black (F) in a ratio by mass of (17 to 30):(10 to 16):(3 to 8):(10 to 25):(20 to 50):(1 to 8), respectively, in that, a mass ratio of (A) and (B) ((B)/(A)) satisfies 0.50 to 0.61, and in that, the composition further contains a copper compound (G) in a rate of 0.005 to 1.0 part by mass when a total amount of the ingredients (A) to (F) is taken as 100 parts by mass. From the glass-fiber-reinforced polyamide resin composition, it is possible to obtain a molded product that is highly excellent in a surface appearance (textured surface uniformity) and has a weather resistance in a level being enough for maintaining an excellent surface appearance even after the weathering test.

Abstract: The present invention aims to provide a method for producing a glass-fiber-reinforced polyamide resin composition which can stably provide a molded product that has excellent weather resistance, and has a highly excellent appearance (textured surface uniformity).

Abstract: The present invention provides a polyamide resin composition containing (A) a crystalline polyamide resin containing a polycapramide resin as a main component, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the polyamide resin composition contains, as the (C), (C-1) a glass fiber, (C-2) a wollastonite having a needle shape, and (C-3) an inorganic reinforcing material of a plate-like crystal; a mass ratio of the (B) to (A) satisfies 0.35?(B)/(A)?0.80; when a total content of the (A), (B), and (C) is 100 parts by mass, a content (parts) of each component satisfies 30?(A)+(B)?55; 10?(B)?23; 20?(C-1)?40; 8?(C-2)?25; 8?(C-3)?25; 45?(C-1)+(C-2)+(C-3)?70; and an amount of a carboxyl group in the polyamide resin composition is less than 120 meq/kg.

Abstract: Disclosed is a conductive polyamide resin composition that excels not only in electroconductivity, but also in fuel resistance, particularly resistance against alcohol-containing fuel, and further excels in fluidity and moldability, and is capable of yielding a molded article with high impact resistance, the conductive polyamide resin composition including: 84 to 40% by mass of a polyamide resin (A); 5 to 30% by mass of conductive carbon black (B); 3 to 30% by mass of an ethylene-?-olefin copolymer (C) that has a reactive functional group capable of reacting with a terminal group of polyamide resin and/or an amido group on a principal chain of polyamide resin; and 1 to 20% by mass of a conductive polyethylene resin (D).

Abstract: The polyamide resin composition according to the present invention contains a polyamide resin (A) wherein an average carbon number of an alkylene group between amide groups is 5 or less and a polyamide resin (B) wherein an average carbon number of an alkylene group between amide groups is more than 5, wherein a ratio by mass (A)/(B) of the polyamide resin (A) to the polyamide resin (B) is from 98/2 to 40/60, and wherein, to 100 parts by mass of a total amount of the polyamide resin (A) and the polyamide resin (B), 0.5 to 20 part(s) by mass of a metal cyanide salt of a composition formula (1) (Ax[M(CN)y]) is compounded.

Abstract: Disclosed is a conductive polyamide resin composition that excels not only in electroconductivity, but also in fuel resistance, particularly resistance against alcohol-containing fuel, and further excels in fluidity and moldability, and is capable of yielding a molded article with high impact resistance, the conductive polyamide resin composition including: 84 to 40% by mass of a polyamide resin (A); 5 to 30% by mass of conductive carbon black (B); 3 to 30% by mass of an ethylene-?-olefin copolymer (C) that has a reactive functional group capable of reacting with a terminal group of polyamide resin and/or an amido group on a principal chain of polyamide resin; and 1 to 20% by mass of a conductive polyethylene resin (D).

Abstract: The present invention is a polyamide resin composition having a thermal aging resistance in a level which is resistant to a high-temperature and long-term environment of 200° C. and longer than 1000 hours. According to the present invention, there is provided a polyamide resin composition containing a polyamide resin (A) and another polyamide resin (B) which exhibits lower oxygen permeability than the polyamide resin (A), wherein a ratio by mass (A)/(B) of the polyamide resin (A) to the polyamide resin (B) is from 98/2 to 60/40, and wherein, to 100 parts by mass of the total amount of the polyamide resin (A) and the polyamide resin (B), 0.5 to 20 part (s) by mass of a metal cyanide salt of a composition formula (1) is compounded.

Abstract: The polyamide resin composition according to the present invention contains a polyamide resin (A) wherein an average carbon number of an alkylene group between amide groups is 5 or less and a polyamide resin (B) wherein an average carbon number of an alkylene group between amide groups is more than 5, wherein a ratio by mass (A)/(B) of the polyamide resin (A) to the polyamide resin (B) is from 98/2 to 40/60, and wherein, to 100 parts by mass of a total amount of the polyamide resin (A) and the polyamide resin (B), 0.5 to 20 part(s) by mass of a metal cyanide salt of a composition formula (1) (Ax[M(CN)y]) is compounded.

Abstract: Provided is a component used in a fuel feed apparatus (500), containing: a conductive polyamide layer (25) formed of a conductive polyamide resin composition, in which the conductive polyamide resin composition contains: a polyamide resin, a conductive carbon black, an ethylene-?-olefin copolymer, and a conductive polyethylene resin, and satisfies the following characteristics (a) and (b): (a) initial volume resistivity of a flat plate obtained by injection forming is 1×105 ?·cm or less, and volume resistivity after exposing the flat plate to CM15 fuel for 168 hours is 1×107 ?·cm or less, and (b) charpy impact strength at ?40° C. of a test piece obtained by injection forming is 2.0 KJ/m2 or greater.

Abstract: The present invention is a polyamide resin composition having a thermal aging resistance in a level which is resistant to a high-temperature and long-term environment of 200° C. and longer than 1000 hours. According to the present invention, there is provided a polyamide resin composition containing a polyamide resin (A) and another polyamide resin (B) which exhibits lower oxygen permeability than the polyamide resin (A), wherein a ratio by mass (A)/(B) of the polyamide resin (A) to the polyamide resin (B) is from 98/2 to 60/40, and wherein, to 100 parts by mass of the total amount of the polyamide resin (A) and the polyamide resin (B), 0.5 to 20 part (s) by mass of a metal cyanide salt of a composition formula (1) is compounded.

Abstract: The present invention is a polyamide resin composition having excellent thermal aging resistance and excellent mechanical characteristics, and containing 0.5 to 20 part(s) by mass of a metal cyanide salt having the general composition formula (Ax[M(CN)y]) to 100 parts by mass of a polyamide resin. In the general composition formula, M is at least one member of transition metal elements in groups 5 to 10 and periods 4 to 6 of a periodic table; A is at least one member of alkali metal and alkaline earth metal; y is an integer of from 3 to 6; and x is a number calculated by (y?m)/a, wherein m is a valence of M and a is a valence of A.

Abstract: The present invention is a polyamide resin composition having excellent thermal aging resistance and excellent mechanical characteristics, and containing 0.5 to 20 part(s) by mass of a metal cyanide salt having the general composition formula (Ax[M(CN)y]) to 100 parts by mass of a polyamide resin. In the general composition formula, M is at least one member of transition metal elements in groups 5 to 10 and periods 4 to 6 of a periodic table; A is at least one member of alkali metal and alkaline earth metal; y is an integer of from 3 to 6; and x is a number calculated by (y?m)/a, wherein m is a valence of M and a is a valence of A.

Abstract: The present invention provides a polyamide resin composition containing 1 to 10 part (s) by mass of swellable layered silicate and 0.01 to 0.3 part by mass of a phosphorus-containing compound having 3 or less phosphorus oxidation number to 100 parts by mass of polyamide resins, characterized in that, the polyamide resins comprise a polyamide resin A1 having relative viscosity of from 3.0 to 4.0 and a polyamide resin A2 having relative viscosity of from 1.5 to less than 3.0, that their mixing rate A1/A2 (in terms of ratio by mass) is from 98/2 to 5/95, and that tensile elongation at break of the polyamide resin composition is 3.0% or more. The polyamide resin composition has tenacity which has not been achieved in the conventional nano-composite and has excellent strength, rigidity and hot rigidity in spite of small content of inorganic filler and specific gravity.