Patents by Inventor Nobuhisa Maeda

Nobuhisa Maeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5190590
    Abstract: A vacuum coating apparatus for coating films on the surfaces of objects to be deposited under vacuum is provided with a vacuum deposition chamber, a carrier accommodated in the vacuum deposition chamber for carrying the objects, a rotary mechanism extending through the vacuum deposition chamber and being rotatable with respect to the carrier, and a container mounted on the rotary mechanism and accommodated in the vacuum deposition chamber. The container accommodates a material to be evaporated and is rotated by the rotary mechanism during a deposition operation while the objects are maintained stationary.
    Type: Grant
    Filed: April 8, 1991
    Date of Patent: March 2, 1993
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masaki Suzuki, Hidetoshi Kawa, Shigeyuki Yamamoto, Nobuhisa Maeda
  • Patent number: 4746397
    Abstract: A treatment method for plate-shaped substrate capable of uniformly performing the treating operation, performing a large amount of treatment, and facilitating the automation of the work independently of the surface nature of the substrate such as base plates of Si wafer for integrated circuit manufacturing use. The method is achieved by making it easier for the whole substrate surface to be wetted with the treatment liquid, through exposing the substrate to liquid or gas material which is soluble mutually with a treatment liquid prior to treatment with the treating liquid, to avoid treatment and thus uneven treatment to improve the yield.
    Type: Grant
    Filed: January 15, 1987
    Date of Patent: May 24, 1988
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Nobuhisa Maeda, Takashi Suzuki, Shigeyuki Yamamoto
  • Patent number: 4524160
    Abstract: A directly moldable resin composition for a composite plastic is disclosed, which comprises a predetermined amount of a mixture of pellets of a thermoplastic synthetic resin having an average size of 2.0 mm or larger and particles of a thermoplastic resin having an average size in a predetermined range, or particles of a thermoplastic resin alone having an average size of below 900 microns, and the balance of at least one filler such as particulate inorganic fillers or fibrous fillers. The particles of a thermoplastic resin should preferably be contained in an amount equal to or higher than 100% by volume of the at least one filler. When determined by a suspending tensile failure method at a tension speed of 2 mm/cm.sup.2, a particulate filler should preferably have an adhesion force in the range of below 4 g/cm.sup.2. Greater amounts of the mixture or the particles of thermoplastic resins can be used when the filler is treated on the surface thereof with organic compounds with a H.L.B.
    Type: Grant
    Filed: January 27, 1984
    Date of Patent: June 18, 1985
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Nobuhisa Maeda, Tadashi Sakairi, Tamotsu Wakahata