Patents by Inventor Nobuhito Hamada
Nobuhito Hamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10527937Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ?-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second ?-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.Type: GrantFiled: November 7, 2017Date of Patent: January 7, 2020Assignee: GOO CHEMICAL CO., LTD.Inventors: Yoshio Sakai, Nobuhito Hamada, Michiya Higuchi, Tokuzan Miyake
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Publication number: 20190359845Abstract: The present invention aims to provide a coating resin composition which can be formed into a coating film having an anti-fogging property and an anti-dirt property. A coating resin composition is used for forming a coating film and contains: a cyclic ether group-containing polymer (A) which is a polymer of a polymerizable monomer component (a) containing an ethylene-based unsaturated monomer (a11) having a cyclic ether group; and a component (B) consisting of at least one compound selected from a group consisting of a polycarboxylic acid (b1) and a polycarboxylic acid anhydride (b2). A cured product of the coating resin composition which is cured by being heated for 0.1 hour or more at a temperature higher than or equal to 100° C. and lower than or equal to a decomposition temperature of the coating resin composition has a water contact angle of 900 or less under a measurement specified by JIS R3257.Type: ApplicationFiled: March 28, 2018Publication date: November 28, 2019Inventors: Sakina Miyauchi, Hisashi Marusawa, Nobuhito Hamada, Hideo Sawada
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Patent number: 10317796Abstract: A solder resist composition includes: a carboxyl group-containing resin; a photopolymerizable compound; a photopolymerization initiator containing a bisacylphosphine oxide-based photopolymerization initiator and an ?-hydroxy alkylphenone-based photopolymerization initiator; and a fluorescent dye. The bisacylphosphine oxide-based photopolymerization initiator contains bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide. The ?-hydroxy alkylphenone-based photopolymerization initiator contains 2-hydroxy-2-methyl-1-phenyl-propane-1-one. A mass ratio of the bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide to the 2-hydroxy-2-methyl-1-phenyl-propane-1-one is 2:1 to 1:10.Type: GrantFiled: December 10, 2014Date of Patent: June 11, 2019Assignee: GOO CHEMICAL CO., LTD.Inventors: Michiya Higuchi, Yoshio Sakai, Nobuhito Hamada, Tokuzan Miyake
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Patent number: 10234758Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, a titanium dioxide, and a compound having a cyclic ether skeleton. The titanium dioxide contains both of a rutile titanium dioxide manufactured by a sulfuric acid method and a rutile titanium dioxide manufactured by a chlorine method.Type: GrantFiled: December 10, 2014Date of Patent: March 19, 2019Assignee: GOO CHEMICAL CO., LTD.Inventors: Yoshio Sakai, Michiya Higuchi, Nobuhito Hamada, Tokuzan Miyake
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Publication number: 20180210336Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, a titanium dioxide, and a compound having a cyclic ether skeleton. The titanium dioxide contains both of a rutile titanium dioxide manufactured by a sulfuric acid method and a rutile titanium dioxide manufactured by a chlorine method.Type: ApplicationFiled: December 10, 2014Publication date: July 26, 2018Inventors: Yoshio Sakai, Michiya Higuchi, Nobuhito Hamada, Tokuzan Miyake
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Publication number: 20180059544Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ?-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second ?-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.Type: ApplicationFiled: November 7, 2017Publication date: March 1, 2018Inventors: Yoshio Sakai, Nobuhito Hamada, Michiya Higuchi, Tokuzan Miyake
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Patent number: 9835944Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ?-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second ?-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.Type: GrantFiled: December 10, 2014Date of Patent: December 5, 2017Assignee: GOO CHEMICAL CO., LTD.Inventors: Yoshio Sakai, Nobuhito Hamada, Michiya Higuchi, Tokuzan Miyake
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Publication number: 20170315443Abstract: A liquid solder resist composition contains: a carboxyl group-containing resin; a photopolymerizable compound which contains one or more kinds of compounds selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer; a photopolymerization initiator; an epoxy compound; and titanium dioxide. The carboxyl group-containing resin is obtained by polymerization of a monomer composition which contains: a carboxyl group-containing monomer represented by following formula (1); and a maleimide compound represented by following formula (2). The carboxyl group-containing resin does not contain a photopolymerizable functional group. In the formula (1), X represents Ra—COO.Type: ApplicationFiled: December 10, 2014Publication date: November 2, 2017Applicant: GOO CHEMICAL CO., LTD.Inventors: Nobuhito Hamada, Yoshio Sakai, Michiya Higuchi, Tokuzan Miyake
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Publication number: 20170269477Abstract: A solder resist composition includes: a carboxyl group-containing resin; a photopolymerizable compound; a photopolymerization initiator containing a bisacylphosphine oxide-based photopolymerization initiator and an ?-hydroxy alkylphenone-based photopolymerization initiator; and a phosphorescent dye. The bisacylphosphine oxide-based photopolymerization initiator contains bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide. The ?-hydroxy alkylphenone-based photopolymerization initiator contains 2-hydroxy-2-methyl-1-phenyl-propane-1-one. A mass ratio of the bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide to the 2-hydroxy-2-methyl-1-phenyl-propane-1-one is 2:1 to 1:10.Type: ApplicationFiled: December 10, 2014Publication date: September 21, 2017Inventors: Michiya Higuchi, Yoshio Sakai, Nobuhito Hamada, Tokuzan Miyake
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Publication number: 20160342085Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ?-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second ?-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.Type: ApplicationFiled: December 10, 2014Publication date: November 24, 2016Applicant: Goo Chemical Co., Ltd.Inventors: Yoshio Sakai, Nobuhito Hamada, Michiya Higuchi, Tokuzan Miyake
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Patent number: 8148047Abstract: A carboxyl resin according to the present invention is obtained by a process including following steps: epoxy groups on a resin (a) having two or more epoxy groups in one molecule is made to react with 0.3-0.85 mol of a monocarboxylic acid (b) per one epoxy-group equivalent weight to obtain a reaction product (c); the epoxy group or groups on the reaction product (c) are made to react with 0.15-0.95 mol of a polybasic acid (d) per one epoxy-group equivalent weight to obtain a reaction product (e); and the epoxy group or groups on the reaction product (e) are further made to react with 1.0-5.0 mol of a monocarboxylic acid (f) per one epoxy-group equivalent weight. The carboxyl resin thus obtained has an acid value within a range from 20 to 200 mgKOH/g and is soluble in an organic solvent.Type: GrantFiled: February 20, 2009Date of Patent: April 3, 2012Assignee: Goo Chemical Company, Ltd.Inventors: Koichi Ikegami, Noboru Kohiyama, Teppei Nishikawa, Michiya Higuchi, Nobuhito Hamada, Hiroko Daido, Chieko Inui, Tatsuya Kubo
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Publication number: 20110082229Abstract: A carboxyl resin according to the present invention is obtained by a process including following steps: epoxy groups on a resin (a) having two or more epoxy groups in one molecule is made to react with 0.3-0.85 mol of a monocarboxylic acid (b) per one epoxy-group equivalent weight to obtain a reaction product (c); the epoxy group or groups on the reaction product (c) are made to react with 0.15-0.95 mol of a polybasic acid (d) per one epoxy-group equivalent weight to obtain a reaction product (e); and the epoxy group or groups on the reaction product (e) are further made to react with 1.0-5.0 mol of a monocarboxylic acid (f) per one epoxy-group equivalent weight. The carboxyl resin thus obtained has an acid value within a range from 20 to 200 mgKOH/g and is soluble in an organic solvent.Type: ApplicationFiled: February 20, 2009Publication date: April 7, 2011Applicant: GOO CHEMICAL CO., LTD.Inventors: Koichi Ikegami, Noboru Kohiyama, Teppei Nishikawa, Michiya Higuchi, Nobuhito Hamada, Hiroko Daido, Chieko Inui, Tatsuya Kubo
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Patent number: 6432612Abstract: An ultraviolet-curable type photo solder resist ink comprises the following components (A) to (E). That is. the component (A) is an ultraviolet-curable resin having at least two ethylenically unsaturated groups and a carboxyl group per one molecule thereof. The component (B) is an epoxy compound having at least two epoxy groups per one molecule thereof. The component (C) is at least one selected from a compound having at least one carboxyl group and a polycarboxylic acid anhydride. The component (D) is a photopolymerization initiator. The component (E) is a diluent. This photo solder resist ink shows a good developing property even when a developer having a pH value of about 10 is used, and is excellent in a storage stability of resist, electrical corrosion resistance, electric performance, chemical resistance, plating resistance, heat resistance to solder, adhesion, and pencil hardness.Type: GrantFiled: February 23, 1999Date of Patent: August 13, 2002Assignee: Goo Chemical Co., Ltd.Inventors: Nobuhito Hamada, Koichi Yoshioka, Soichi Hashimoto