Patents by Inventor Nobuhito Hirosumi

Nobuhito Hirosumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7733408
    Abstract: A solid-state image sensor, a transparent cover, a DSP, a wiring board and the like are sealed in a sealing portion by molding of a synthetic resin, and fixed to an imaging unit. At this time, a portion of the transparent cover is exposed from the sealing portion. The optical path fixing device and the imaging unit sealed by the sealing portion are fixedly combined by engagement of hook engaging portions and hook portions, in a state where the lower end surface of a lens barrel comes into contact with the exposed portion. As the result, positioning accuracy of a lens with respect to a pixel area of the solid-state image sensor dose not deteriorate even if a substrate on which the solid-state image sensor is arranged is deflected or distorted.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: June 8, 2010
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hiroaki Tsukamoto, Nobuhito Hirosumi, Takashi Yasudome, Kazuo Kinoshita
  • Patent number: 7397023
    Abstract: An optical path delimiter having a lens is disposed so as to be in contact with a transparent lid bonded to a surface of a solid-state image sensor, and is fixed without bonded. Further, the solid-state image sensor to which the transparent lid is bonded, the optical path delimiter disposed so as to be in contact with the transparent lid without bonded, a DSP serving as a signal processor, a circuit part and a wiring board are fixed by being sealed in a synthetic resin. Even when distortion occurs due to warpage, flexure or the like on a board where the solid-state image sensor is disposed, the accuracy of the alignment of the lens with respect to the solid-state image sensor never decreases. In addition, the solid-state image sensor or the signal processor is never damaged by an external shock.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: July 8, 2008
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hiroaki Tsukamoto, Nobuhito Hirosumi, Takashi Yasudome, Kazuo Kinoshita
  • Patent number: 7294828
    Abstract: A screw portion is provided on an image sensing unit, a screw hole portion to be engaged with the screw portion is provided on an optical path delimiter, and the screw portion and the screw hole portion are engaged together to thereby fix the image sensing unit and the optical path delimiter so that a lens barrel of the optical path delimiter is in contact with a transparent lid bonded to a surface of a solid-state image sensor. The solid-state image sensor, the transparent lid, a DSP, a wiring board and the like are sealed by a sealing portion made of a resin. Even when distortion occurs due to warpage, flexure or the like on the board where the solid-state image sensor is disposed, the accuracy of the positioning of the lens with respect to a pixel area of the solid-state image sensor is never decreased, it can be prevented that the solid-state image sensor or a signal processor is damaged by an external shock, and the optical device module is easily fabricated.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: November 13, 2007
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Kazuo Kinoshita, Nobuhito Hirosumi, Takashi Yasudome, Hiroaki Tsukamoto
  • Publication number: 20060221225
    Abstract: A solid-state image sensor, a transparent cover, a DSP, a wiring board and the like are sealed in a sealing portion by molding of a synthetic resin, and fixed to an imaging unit. At this time, a portion of the transparent cover is exposed from the sealing portion. The optical path fixing device and the imaging unit sealed by the sealing portion are fixedly combined by engagement of hook engaging portions and hook portions, in a state where the lower end surface of a lens barrel comes into contact with the exposed portion. As the result, positioning accuracy of a lens with respect to a pixel area of the solid-state image sensor dose not deteriorate even if a substrate on which the solid-state image sensor is arranged is deflected or distorted.
    Type: Application
    Filed: March 23, 2006
    Publication date: October 5, 2006
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Hiroaki Tsukamoto, Nobuhito Hirosumi, Takashi Yasudome, Kazuo Kinoshita
  • Publication number: 20060219884
    Abstract: An optical path delimiter having a lens is disposed so as to be in contact with a transparent lid bonded to a surface of a solid-state image sensor, and is fixed without bonded. Further, the solid-state image sensor to which the transparent lid is bonded, the optical path delimiter disposed so as to be in contact with the transparent lid without bonded, a DSP serving as a signal processor, a circuit part and a wiring board are fixed by being sealed in a synthetic resin. Even when distortion occurs due to warpage, flexure or the like on a board where the solid-state image sensor is disposed, the accuracy of the alignment of the lens with respect to the solid-state image sensor never decreases. In addition, the solid-state image sensor or the signal processor is never damaged by an external shock.
    Type: Application
    Filed: March 23, 2006
    Publication date: October 5, 2006
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Hiroaki Tsukamoto, Nobuhito Hirosumi, Takashi Yasudome, Kazuo Kinoshita
  • Publication number: 20060219885
    Abstract: A screw portion is provided on an image sensing unit, a screw hole portion to be engaged with the screw portion is provided on an optical path delimiter, and the screw portion and the screw hole portion are engaged together to thereby fix the image sensing unit and the optical path delimiter so that a lens barrel of the optical path delimiter is in contact with a transparent lid bonded to a surface of a solid-state image sensor. The solid-state image sensor, the transparent lid, a DSP, a wiring board and the like are sealed by a sealing portion made of a resin. Even when distortion occurs due to warpage, flexure or the like on the board where the solid-state image sensor is disposed, the accuracy of the positioning of the lens with respect to a pixel area of the solid-state image sensor is never decreased, it can be prevented that the solid-state image sensor or a signal processor is damaged by an external shock, and the optical device module is easily fabricated.
    Type: Application
    Filed: March 30, 2006
    Publication date: October 5, 2006
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Kazuo Kinoshita, Nobuhito Hirosumi, Takashi Yasudome, Hiroaki Tsukamoto
  • Publication number: 20060208182
    Abstract: A solid-state image sensing device has a printed board; a solid-state image sensing element fixed to the printed board; and a light-transmitting lid section fixed to the solid-state image sensing element so as to cover an image sensing area (effective pixel area). The printed board has a bore which penetrates through the printed board in a thickness direction thereof, at least a part of the light-transmitting lid section is fitted in the bore, and connecting terminals of the printed board are connected to connecting terminals of the solid-state image sensing element.
    Type: Application
    Filed: March 1, 2006
    Publication date: September 21, 2006
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Hiroaki Tsukamoto, Nobuhito Hirosumi, Takashi Yasudome, Kazuo Kinoshita
  • Publication number: 20060197864
    Abstract: A solid-state imaging device which has a wiring substrate, a solid-state image sensor having a face opposite to a pixel area fixed to the wiring substrate, and a transparent cover fixed to the solid-state image sensor through an adhesive layer so as to oppose the pixel area of the solid-state image sensor. The wiring substrate has, on a side opposing the transparent cover, a cavity being provided with plural connecting terminals. The solid-state image sensor is fixed to a bottom face of the cavity in a state where the solid-state image sensor falls into the cavity. The connecting terminals of the cavity are connected with a connecting terminals of the solid-state image sensor, respectively through a wiring which falls into the cavity.
    Type: Application
    Filed: February 21, 2006
    Publication date: September 7, 2006
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Hiroaki Tsukamoto, Nobuhito Hirosumi, Takashi Yasudome, Kazuo Kinoshita