Patents by Inventor Nobuhito Kinoshita

Nobuhito Kinoshita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heater
    Patent number: 10631371
    Abstract: A heater includes an elongated substrate, a heating resistor formed on the substrate, a resistor electrode that is formed and is in contact with the heating resistor, and a heat conducting film. The substrate includes a heat generating section and a non-heat generating section. The heat generating section is a section that is overlapped with, out of the heating resistor and the resistor electrode, only the heating resistor in the lengthwise direction of the substrate. The non-heat generating section is a section that is different from the heat generating section and is adjacent to the heat generating section in the lengthwise direction of the substrate. The heat conducting film is formed so as to extend from the heat generating section into the non-heat generating section on the substrate.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: April 21, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Yasuyuki Aritaki, Tomoharu Horio, Masatoshi Nakanishi, Masashi Takagi, Nobuhito Kinoshita
  • HEATER
    Publication number: 20160227607
    Abstract: A heater includes an elongated substrate, a heating resistor formed on. the substrate, a resistor electrode that is formed and is in contact with the heating resistor, and a heat conducting film. The substrate includes a heat generating section and a non-heat generating section. The heat generating section is a section that is overlapped with, out of the heating resistor and the resistor electrode, only the heating resistor in the lengthwise direction of the substrate. The non-heat generating section is a section that is different from the heat generating section and is adjacent to the heat generating section in the lengthwise direction of the substrate. The heat conducting film is formed so as to extend from the heat generating section into the non-heat generating section on the substrate.
    Type: Application
    Filed: January 30, 2015
    Publication date: August 4, 2016
    Inventors: Yasuyuki ARITAKI, Tomoharu HORIO, Masatoshi NAKANISHI, Masashi TAKAGI, Nobuhito KINOSHITA
  • Fine wiring pattern, manufacturing method thereof, and thermal print head
    Patent number: 9358804
    Abstract: According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: June 7, 2016
    Assignee: Rohm Co., Ltd.
    Inventors: Shinobu Obata, Koji Nishi, Takafumi Katsuno, Masumi Okumura, Nobuhito Kinoshita
  • FINE WIRING PATTERN, MANUFACTURING METHOD THEREOF, AND THERMAL PRINT HEAD
    Publication number: 20150138298
    Abstract: According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.
    Type: Application
    Filed: January 30, 2015
    Publication date: May 21, 2015
    Inventors: Shinobu Obata, Koji Nishi, Takafumi Katsuno, Masumi Okumura, Nobuhito Kinoshita
  • Fine wiring pattern and composition, manufacturing method thereof, and thermal print head including fine wiring pattern
    Patent number: 8982169
    Abstract: According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.
    Type: Grant
    Filed: January 23, 2013
    Date of Patent: March 17, 2015
    Assignee: Rohm Co., Ltd.
    Inventors: Shinobu Obata, Koji Nishi, Takafumi Katsuno, Masumi Okumura, Nobuhito Kinoshita