Patents by Inventor Nobukatsu Saito
Nobukatsu Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8105871Abstract: A semiconductor device includes a semiconductor element provided over a wiring board; sealing resin configured to seal the semiconductor element; and reinforcing resin provided at least at a part of a boundary part of the sealing resin and the wiring board. In the above-mentioned semiconductor device, the reinforcing resin may be provided along a perimeter of the boundary part of the sealing resin and the wiring board. The reinforcing resin may be provided at a boundary part of the sealing resin and the wiring board in a vicinity of a corner part of the sealing resin.Type: GrantFiled: December 22, 2006Date of Patent: January 31, 2012Assignee: Fujitsu Semiconductor LimitedInventors: Tadashi Uno, Nobukatsu Saito
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Patent number: 7754534Abstract: A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.Type: GrantFiled: April 21, 2008Date of Patent: July 13, 2010Assignee: Fujitsu Semiconductor LimitedInventors: Nobukatsu Saito, Masaharu Minamizawa, Yoshiyuki Yoneda, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi, Tadahiro Okamoto, Eiji Watanabe
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Publication number: 20080261336Abstract: A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.Type: ApplicationFiled: April 21, 2008Publication date: October 23, 2008Applicant: FUJITSU LIMITEDInventors: Nobukatsu Saito, Masaharu Minamizawa, Yoshiyuki Yoneda, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi, Tadahiro Okamoto, Eiji Watanabe
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Publication number: 20080042254Abstract: A semiconductor device includes a semiconductor element provided over a wiring board; sealing resin configured to seal the semiconductor element; and reinforcing resin provided at least at a part of a boundary part of the sealing resin and the wiring board. In the above-mentioned semiconductor device, the reinforcing resin may be provided along a perimeter of the boundary part of the sealing resin and the wiring board. The reinforcing resin may be provided at a boundary part of the sealing resin and the wiring board in a vicinity of a corner part of the sealing resin.Type: ApplicationFiled: December 22, 2006Publication date: February 21, 2008Applicant: FUJITSU LIMITEDInventors: Tadashi Uno, Nobukatsu Saito
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Publication number: 20040232549Abstract: A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.Type: ApplicationFiled: June 29, 2004Publication date: November 25, 2004Applicant: FUJITSU LIMITEDInventors: Nobukatsu Saito, Masaharu Minamizawa, Yoshiyuki Yoneda, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi, Tadahiro Okamoto, Eiji Watanabe
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Patent number: 6794273Abstract: A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.Type: GrantFiled: December 31, 2002Date of Patent: September 21, 2004Assignee: Fujitsu LimitedInventors: Nobukatsu Saito, Masaharu Minamizawa, Yoshiyuki Yoneda, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi, Tadahiro Okamoto, Eiji Watanabe
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Publication number: 20030219969Abstract: A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.Type: ApplicationFiled: December 31, 2002Publication date: November 27, 2003Applicant: FUJITSU LIMITEDInventors: Nobukatsu Saito, Masaharu Minamizawa, Yoshiyuki Yoneda, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi, Tadahiro Okamoto, Eiji Watanabe