Abstract: The invention has a turnback roll which can transfer and guide a polishing tap in a tangential direction of a pressure contacting roll, a vertical oscillation mechanism which linearly oscillates the pressure contacting roll in a tangential direction of a ball groove while being orthogonal to a rotating axis line, and a horizontal oscillation mechanism which linearly oscillates the pressure contacting roll in a direction of a rotating axis line toward both inner side surfaces of the ball groove. The ball groove can be securely polished by the polishing tape on the basis of the continuous or intermittent transfer of the polishing tape and the linear oscillating motion of the ball groove. It is possible to improve a polishing precision, it is possible to improve a surface roughness of the ball groove and it is possible to improve a polishing workability of the ball groove.

Abstract: The invention has a turnback roll which can transfer and guide a polishing tap in a tangential direction of a pressure contacting roll, a vertical oscillation mechanism which linearly oscillates the pressure contacting roll in a tangential direction of a ball groove while being orthogonal to a rotating axis line, and a horizontal oscillation mechanism which linearly oscillates the pressure contacting roll in a direction of a rotating axis line toward both inner side surfaces of the ball groove. The ball groove can be securely polished by the polishing tape on the basis of the continuous or intermittent transfer of the polishing tape and the linear oscillating motion of the ball groove. It is possible to improve a polishing precision, it is possible to improve a surface roughness of the ball groove and it is possible to improve a polishing workability of the ball groove.

Abstract: A method for polishing a ball screw comprising a screw shaft defining a screw axis. The screw shaft is formed with a screw groove. The method comprises the steps of: rotating the screw shaft at a rotational speed about the screw axis; conveying a polishing tape having a polishing portion traveled around an outer peripheral surface of a pressing roller, the press roller being configured to rotate about a rotational axis; guiding the polishing tape such that the polishing portion is traveled around the outer peripheral surface; pressing the polishing portion against the screw groove; tilting the pressing roller such that the rotational axis is aligned with a lead angle; oscillating the pressing roller linearly along the rotational axis; moving the polishing tape at a moving speed in a direction parallel to the screw axis; and synchronizing the rotational speed with the moving speed based on a lead.

Abstract: A method for polishing a ball screw comprising a screw shaft defining a screw axis. The screw shaft is formed with a screw groove. The method comprises the steps of: rotating the screw shaft at a rotational speed about the screw axis; conveying a polishing tape having a polishing portion traveled around an outer peripheral surface of a pressing roller, the press roller being configured to rotate about a rotational axis; guiding the polishing tape such that the polishing portion is traveled around the outer peripheral surface; pressing the polishing portion against the screw groove; tilting the pressing roller such that the rotational axis is aligned with a lead angle; oscillating the pressing roller linearly along the rotational axis; moving the polishing tape at a moving speed in a direction parallel to the screw axis; and synchronizing the rotational speed with the moving speed based on a lead.

Abstract: A substrate polishing method includes starting to rotate a circular substrate and polishing an inner peripheral edge surface of a center circular hole formed in the circular substrate into a chamfered or rounded surface by pressing the inner peripheral edge surface against a bypass polishing part of a polishing tape that is conveyed intermittently or continuously and by oscillating the bypass polishing part of the polishing tape about a direction perpendicular to a direction that the center circular hole penetrates through the circular substrate. The polishing tape is guided so as to have an advancing portion advancing toward the circular substrate, a returning portion returning from the circular substrate, and a turning-back portion between the advancing portion and the returning portion guided along a side bypass. The bypass polishing part of the polishing tape is the turning-back portion of the polishing tape.

Abstract: A substrate polishing method includes starting to rotate a circular substrate and polishing an inner peripheral edge surface of a center circular hole formed in the circular substrate into a chamfered or rounded surface by pressing the inner peripheral edge surface against a bypass polishing part of a polishing tape that is conveyed intermittently or continuously and by oscillating the bypass polishing part of the polishing tape about a direction perpendicular to a direction that the center circular hole penetrates through the circular substrate. The polishing tape is guided so as to have an advancing portion advancing toward the circular substrate, a returning portion returning from the circular substrate, and a turning-back portion between the advancing portion and the returning portion guided along a side bypass. The bypass polishing part of the polishing tape is the turning-back portion of the polishing tape.

Abstract: A surface polishing method comprises allowing a holder to hold a flat sheet-like workpiece, placing a pad tape in a location opposite to the holder, the pad tape consisting of a tape substrate and grains bonded to the substrate surface, supplying free grains between the holder and the pad tape, and rotating the holder and/or a mechanism holding the tape, thereby causing the free grains to polish the workpiece. An apparatus for practicing the method comprises a holder capable of holding a flat sheet-like workpiece, a tape holding mechanism located opposite to the surface of the workpiece and carrying a pad tape which consists of a tape substrate and grains bonded to the substrate, a rotary mechanism for rotating the holder and/or the tape holding mechanism, and an abrasive supplying mechanism for supplying free grains between the surface of the workpiece and the pad tape.