Patents by Inventor Nobuko Ohgake

Nobuko Ohgake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemically amplified positive-type photoresist composition for thick film, chemically amplified dry film for thick film, and method for production of thick film resist pattern
    Patent number: 8507180
    Abstract: Disclosed are a chemically amplified positive-type photoresist composition for a thick film, a chemically amplified dry film for a thick film, and a method for producing a thick film resist pattern, all of which are capable of obtaining a satisfactory resist pattern with high sensitivity even on a substrate having a portion formed of copper on an upper surface thereof. The chemically amplified positive-type photoresist composition for a thick film comprises component (A) which includes at least one compound capable of producing an acid upon irradiation with an actinic ray or radiation, and component (B) which includes at least one resin whose alkali solubility increases by the action of an acid, in which the component (A) includes an onium fluorinated alkyl fluorophosphate having a specific structure.
    Type: Grant
    Filed: October 18, 2007
    Date of Patent: August 13, 2013
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Yasushi Washio, Kazuhide Uno, Koichi Misumi, Takahiro Senzaki, Koji Saito, Nobuko Ohgake
  • CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTORESIST COMPOSITION FOR THICK FILM, CHEMICALLY AMPLIFIED DRY FILM FOR THICK FILM, AND METHOD FOR PRODUCTION OF THICK FILM RESIST PATTERN
    Publication number: 20100047715
    Abstract: Disclosed are a chemically amplified positive-type photoresist composition for a thick film, a chemically amplified dry film for a thick film, and a method for producing a thick film resist pattern, all of which are capable of obtaining a satisfactory resist pattern with high sensitivity even on a substrate having a portion formed of copper on an upper surface thereof. The chemically amplified positive-type photoresist composition for a thick film comprises component (A) which includes at least one compound capable of producing an acid upon irradiation with an actinic ray or radiation, and component (B) which includes at least one resin whose alkali solubility increases by the action of an acid, in which the component (A) includes an onium fluorinated alkyl fluorophosphate having a specific structure.
    Type: Application
    Filed: October 18, 2007
    Publication date: February 25, 2010
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Yasushi Washio, Mitsuaki Ohgake, Nobuko Ohgake, Kazuhide Uno, Koichi Misumi, Takahiro Senzaki, Koji Saito