Abstract: Provided is a light-emitting device that is capable of adjusting color temperature through the supply of electric power from a single power supply. The light-emitting device includes an anode electrode land, a cathode electrode land, and first and second wires through which the anode electrode land and the cathode electrode land are connected to each other. The first wire is higher in electric resistance than the second wire. The color temperature of light that is emitted by a whole light-emitting unit including a first light-emitting unit electrically connected to the first wire and a second light-emitting unit electrically connected to the second wire is adjustable.

Abstract: There is provided a semiconductor laser apparatus capable of sufficiently discharging heat generated at a semiconductor laser element, having a simple manufacturing step, and capable of adjusting an optical path length, as well as a method for manufacturing the same. A laser chip is connected through a block and a plate to a housing. Further, the plate is partially exposed from a connecting surface between the block and the plate, and when disposed in the housing, the semiconductor chip and the block are inserted from an outside of the housing to an inside thereof, and the plate is exposed outwardly from the housing. An optical axis of an output light beam from the laser chip is in parallel to a ground plane of the housing.

Abstract: A semiconductor light emitting apparatus includes a non-conductive sub mount; a metal layer provided on the sub mount; a solder material member provided on the metal layer; and a semiconductor light emitting device die-bonded to the metal layer by the solder material member. A surface of the metal layer includes a solder material attachment area having the solder material member attached thereto, and a metal layer exposed area where the surface of the metal layer is exposed. The solder material attachment area is electrically connected to the metal layer exposed area. The solder material attachment area is larger than a die-bond area of the semiconductor light emitting device. The metal layer exposed area has a metal layer removed area therein where the sub mount is exposed.

Abstract: An optical pick-up apparatus and a semiconductor laser apparatus which can suppress reduction of optical utilization efficiency for the laser light emitted from the semiconductor laser element. When a laser light which is emitted from a laser element for DVD and whose polarization direction is perpendicular to a direction of a groove of the polarization grating is incident on the polarization grating, the polarization grating does not diffract the laser light and transmits the laser light as zero-order diffraction light. Consequently, all of the laser light emitted from the laser element for DVD can be used for reading information signal of DVD and detecting FES and TES. This enables reduction of optical utilization efficiency arising by diffracting action of a grating used for detecting TES of CD in a conventional optical pick-up apparatus to be suppressed.

Abstract: A semiconductor laser device, with which a compact and thin optical pickup can be realized, is provided. On the top surface of a supporting member, there is formed an element mounting area for mounting a series of elements including a semiconductor laser element, and a light detecting element which detects a laser beam emitted from the semiconductor laser element and reflected by a surface of an outside optical disc so as to be re-entered. An optical path from the semiconductor laser element to the surface of the optical disc includes a vertical optical path advancing from the element mounting area of the supporting member in an approximately vertical upward direction. On a pair of right and left opposing ends of the supporting member, arcuate curved outer surfaces are formed, respectively, so as to fit the supporting member into an installation hole, for a semiconductor laser device, having arcuate curved inner surfaces.

Abstract: A semiconductor light emitting apparatus includes a non-conductive sub mount; a metal layer provided on the sub mount; a solder material member provided on the metal layer; and a semiconductor light emitting device die-bonded to the metal layer by the solder material member. A surface of the metal layer includes a solder material attachment area having the solder material member attached thereto, and a metal layer exposed area where the surface of the metal layer is exposed. The solder material attachment area is electrically connected to the metal layer exposed area. The solder material attachment area is larger than a die-bond area of the semiconductor light emitting device. The metal layer exposed area has a metal layer removed area therein where the sub mount is exposed.

Abstract: The object of the invention is to provide an optical pick-up apparatus and a semiconductor laser apparatus which can suppress reduction of optical utilization efficiency for the laser light emitted from the semiconductor laser element. When a laser light which is emitted from a laser element for DVD and whose polarization direction is perpendicular to a direction of a groove of the polarization grating is incident on the polarization grating, the polarization grating does not diffract the laser light and transmits the laser light as zero-order diffraction light. Consequently, all of the laser light A emitted from the laser element for DVD can be used for reading information signal of DVD and detecting FES and TES. This enables reduction of optical utilization efficiency arising by diffracting action of a grating used for detecting TES of CD in a conventional optical pick-up apparatus to be suppressed.

Abstract: A semiconductor laser device, with which a compact and thin optical pickup can be realized, is provided. On the top surface of a supporting member, there is formed an element mounting area for mounting a series of elements including a semiconductor laser element, and a light detecting element which detects a laser beam emitted from the semiconductor laser element and reflected by a surface of an outside optical disc so as to be re-entered. An optical path from the semiconductor laser element to the surface of the optical disc includes a vertical optical path advancing from the element mounting area of the supporting member in an approximately vertical upward direction. On a pair of right and left opposing ends of the supporting member, arcuate curved outer surfaces are formed, respectively, so as to fit the supporting member into an installation hole, for a semiconductor laser device, having arcuate curved inner surfaces.