Patents by Inventor Nobumasa Tomizawa
Nobumasa Tomizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230235147Abstract: A silicone rubber sponge composition, including: (A) 100 parts by mass of an addition-crosslinkable silicone rubber composition containing a reinforcing silica and being liquid at 25° C.; (B) 1.0 to 20 parts by mass of expanded resin fine particles having a specific gravity of 0.01 to 0.3, having an average particle diameter of 10 to 200 ?m, and having an organic resin shell; and (C) 0.1 to 10 parts by mass of spherical particles having average particle diameter being 0.001 to 0.5 times larger than average particle diameter of the component (B) expanded resin fine particles, and having an average circularity of 0.8 to 1. This improves flowability of silicone rubber sponge composition containing the expanded resin fine particles, reduces contractive deformation due to pressure of the expanded resin fine particles during casting or injection-molding. Thus, provided are a silicone rubber sponge composition that can reduce density of a sponge rubber.Type: ApplicationFiled: May 7, 2021Publication date: July 27, 2023Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Satao HIRABAYASHI, Tomoya MINAMIKAWA, Mikio IINO, Nobumasa TOMIZAWA
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Patent number: 10203639Abstract: A thermal fixing roll or belt-forming silicone rubber composition having a high thermal conductivity, a low compression set, and an improved heat resistance which is well adapted for use as a coating material in a fixing roll or fixing belt is provided. Also provided are a fixing roll and a fixing belt formed by using such composition. The thermal fixing roll or belt-forming silicone rubber composition comprises 100 parts by weight of a heat-curable silicone rubber composition and 50 to 800 parts by weight of silicon carbide having an iron content of up to 0.2% by weight at the surface and an average particle size of 1 to 50 ?m.Type: GrantFiled: July 2, 2010Date of Patent: February 12, 2019Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Noriyuki Meguriya, Satao Hirabayashi, Nobumasa Tomizawa, Hiroki Furukawa, Masao Matuhira
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Patent number: 8831499Abstract: A thermally conductive silicone rubber sponge composition which is composed of 100 parts by weight of heat-curable organopolysiloxane composition, 0.1 to 50 parts by weight of organic resin hollow filler having an average particle diameter of up to 200 ?m and a true specific gravity of up to 0.3, and 20 to 300 parts by weight of thermally conductive filler having an average particle diameter of 1 to 30 ?m and a thermal conductivity of at least 15 W/m·K, with the highly thermally conductive silicone rubber sponge having voids accounting for 10 to 70% of the entire volume thereof. The silicone rubber sponge composition of the present invention gives a silicone rubber sponge having high thermal conductivity, small heat capacity, low hardness, light weight, and low permanent compression set.Type: GrantFiled: December 21, 2011Date of Patent: September 9, 2014Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Satao Hirabayashi, Nobumasa Tomizawa, Noriyuki Meguriya
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Publication number: 20120161066Abstract: A thermally conductive silicone rubber sponge composition which is composed of 100 parts by weight of heat-curable organopolysiloxane composition, 0.1 to 50 parts by weight of organic resin hollow filler having an average particle diameter of up to 200 ?m and a true specific gravity of up to 0.3, and 20 to 300 parts by weight of thermally conductive filler having an average particle diameter of 1 to 30 ?m and a thermal conductivity of at least 15 W/m·K, with the highly thermally conductive silicone rubber sponge having voids accounting for 10 to 70% of the entire volume thereof. The silicone rubber sponge composition of the present invention gives a silicone rubber sponge having high thermal conductivity, small heat capacity, low hardness, light weight, and low permanent compression set.Type: ApplicationFiled: December 21, 2011Publication date: June 28, 2012Inventors: Satao HIRABAYASHI, Nobumasa Tomizawa, Noriyuki Meguriya
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Publication number: 20110003089Abstract: A thermal fixing roll or belt-forming silicone rubber composition having a high thermal conductivity, a low compression set, and an improved heat resistance which is well adapted for use as a coating material in a fixing roll or fixing belt is provided. Also provided are a fixing roll and a fixing belt formed by using such composition. The thermal fixing roll or belt-forming silicone rubber composition comprises 100 parts by weight of a heat-curable silicone rubber composition and 50 to 800 parts by weight of silicon carbide having an iron content of up to 0.2% by weight at the surface and an average particle size of 1 to 50 ?m.Type: ApplicationFiled: July 2, 2010Publication date: January 6, 2011Inventors: Noriyuki MEGURIYA, Satao HIRABAYASHI, Nobumasa TOMIZAWA, Hiroki FURUKAWA, Masao MATUHIRA
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Patent number: 7537838Abstract: A heat fixing roll or belt having a silicone rubber layer which is formed by curing a silicone rubber composition comprising (A) 100 pbw of an organopolysiloxane having at least two silicon-bonded alkenyl radicals in a molecule, (B) 20-500 pbw of a metallic silicon powder having an average particle size of up to 100 ?m, and (C) an effective amount of a curing agent. The silicone rubber layer has a high heat conductivity and long-term temperature durability.Type: GrantFiled: November 27, 2006Date of Patent: May 26, 2009Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Satao Hirabayashi, Mikio Iino, Nobumasa Tomizawa, Noriyuki Meguriya
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Publication number: 20070135555Abstract: A heat fixing roll or belt having a silicone rubber layer which is formed by curing a silicone rubber composition comprising (A) 100 pbw of an organopolysiloxane having at least two silicon-bonded alkenyl radicals in a molecule, (B) 20-500 pbw of a metallic silicon powder having an average particle size of up to 100 ?m, and (C) an effective amount of a curing agent. The silicone rubber layer has a high heat conductivity and long-term temperature durability.Type: ApplicationFiled: November 27, 2006Publication date: June 14, 2007Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Satao HIRABAYASHI, Mikio IINO, Nobumasa Tomizawa, Noriyuki Meguriya
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Patent number: 7166363Abstract: A silicone rubber composition comprising (A) a normally liquid organopolysiloxane having at least two silicon atom-bonded alkenyl radicals, (B) a liquid organohydrogenpolysiloxane having at least two Si—H radicals, (C) a blend of two inorganic powders selected from three highly heat conductive inorganic powders which form 30% slurries at pH at least 8, 6 to less than 8, and less than 6, and (D) an addition reaction catalyst cures into a silicone rubber having a high thermal conductivity and heat resistance and is suited for fixing rolls or belts in copiers.Type: GrantFiled: August 24, 2004Date of Patent: January 23, 2007Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Noriyuki Meguriya, Satao Hirabayashi, Shigeru Ubukata, Nobumasa Tomizawa
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Publication number: 20050048296Abstract: A silicone rubber composition comprising (A) a normally liquid organopolysiloxane having at least two silicon atom-bonded alkenyl radicals, (B) a liquid organohydrogenpolysiloxane having at least two Si—H radicals, (C) a blend of two inorganic powders selected from three highly heat conductive inorganic powders which form 30% slurries at pH at least 8, 6 to less than 8, and less than 6, and (D) an addition reaction catalyst cures into a silicone rubber having a high thermal conductivity and heat resistance and is suited for fixing rolls or belts in copiers.Type: ApplicationFiled: August 24, 2004Publication date: March 3, 2005Inventors: Noriyuki Meguriya, Satao Hirabayashi, Shigeru Ubukata, Nobumasa Tomizawa
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Patent number: 6333364Abstract: A silicone rubber composition comprising (A) 100 parts by weight of a heat curable organopolysiloxane composition, (B) 0.1-30 parts by weight of unexpanded or expanded organic resin-base microspheres, and (C) 0.5-50 parts by weight of a polyhydric alcohol or derivative thereof cures into a low specific gravity silicone rubber elastomer which experiences a minimal compression set at elevated temperature.Type: GrantFiled: February 8, 2001Date of Patent: December 25, 2001Assignee: Shin Etsu Chemical Co., Ltd.Inventors: Noriyuki Meguriya, Nobumasa Tomizawa
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Publication number: 20010016609Abstract: A silicone rubber composition comprising (A) 100 parts by weight of a heat curable organopolysiloxane composition, (B) 0.1-30 parts by weight of unexpanded or expanded organic resin-base microspheres, and (C) 0.5-50 parts by weight of a polyhydric alcohol or derivative thereof cures into a low specific gravity silicone rubber elastomer which experiences a minimal compression set at elevated temperature.Type: ApplicationFiled: February 8, 2001Publication date: August 23, 2001Inventors: Noriyuki Meguriya, Nobumasa Tomizawa
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Patent number: 6231954Abstract: A silicone rubber layer is formed on a metal mandrel by curing an addition reaction curing type liquid silicone rubber composition so as to provide a resilience of 5-30% according to JIS K-6301, and an organic resin layer having a low surface energy is provided thereon, thereby yielding a low-hardness silicone rubber fixing roll, which ensures an appropriate nip width even under a low nip pressure and even when the silicone rubber layer is made thin.Type: GrantFiled: October 6, 1998Date of Patent: May 15, 2001Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Takeo Yoshida, Shigeki Shudo, Nobumasa Tomizawa
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Patent number: 6111221Abstract: A heat fixing roll includes a silicone rubber layer on a cylindrical metal mandrel having a penetration of at least 10 according to ASTM D1403 and a fluoroplastic layer thereon. The silicone rubber layer is obtained by molding and curing an addition reaction type liquid silicone rubber composition to the mandrel. The roll provides a sufficient nip width under low pressure, improved abrasion resistance, long-lasting toner release, and a satisfactory fixing function even at a high speed over a long period of time.Type: GrantFiled: May 26, 1998Date of Patent: August 29, 2000Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Masanobu Miyakoshi, Shigeki Shudo, Nobumasa Tomizawa, Takashi Kondou
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Patent number: 5352731Abstract: A silicone rubber composition having thermal conductivity higher than 5.times.10.sup.-3 cal/cm.multidot.sec.multidot..degree.C. and excellent workability in various molding processes, which comprises A) 95-50 parts by weight of an organopolysiloxane having an average polymerization degree of 6,000-12,000, B) 5-50 parts by weight of an organopolysiloxane having an average polymerization degree of 200-2,000, C) 500-1,200 parts by weight of a spherical aluminum oxide powder and D) a curing agent ample for curing the composition consisting of A) to C) .Type: GrantFiled: September 1, 1993Date of Patent: October 4, 1994Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Akio Nakano, Tsutomu Yoneyama, Nobumasa Tomizawa
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Patent number: 5221575Abstract: A thermally conductive sheet comprising a metal foil of which at least one side is coated with a graphite powder-containing silicone rubber layer to gain improved thermally conductive efficiency without attended by decrease in thermal conductivity with time and increase in production cost, and further to enable the enhancement of adhesiveness to other materials by easy incorporation of organopolysiloxanes of adhesion-conferring type into the silicone rubber layer, thus showing excellent aptitude for a thermally conductive sheet of full pack mold transistors.Type: GrantFiled: October 29, 1991Date of Patent: June 22, 1993Assignee: Shin-Etsu Chemical Co. Ltd.Inventors: Akio Nakano, Nobumasa Tomizawa