Abstract: A conveying system includes a first belt conveyor; a second belt conveyor; a workpiece guide that includes guide paths that receive workpieces that have fallen from a downstream end portion of the first belt conveyor one by one and then guide the workpieces to an upstream end portion of the second belt conveyor; a rotary mechanism that displaces the downstream end portion along a substantially arc-shaped trajectory to distribute the workpieces that have fallen from the downstream end portion into the guide paths; a first sensor that detects first information that represents that one of the workpieces has fallen from the downstream end portion; and a controlling device that controls an operation of the rotary mechanism. The controlling device controls the rotary mechanism by transmitting an operation command to the displacement mechanism to intermittently displace the downstream end portion by a predetermined distance in response to first information.

Abstract: A bonding material applying apparatus includes a syringe in which a bonding material is filled. The syringe includes a discharge nozzle disposed at a tip thereof to discharge the bonding material filled in the syringe. A compressed air supply mechanism supplies compressed air to the syringe and discharges the bonding material from the discharge nozzle. When a discharge interval from the end of discharge to the start of discharge of the bonding material lasts for a certain time or longer, the compressed air supply mechanism supplies the compressed air for a time, which is shorter than a discharge time necessary to discharge the bonding material, to such an extent that the bonding material is substantially not discharged.

Abstract: A method for manufacturing a terminal-strip-equipped electronic component in which terminal strips made of a metal plate are bonded with solder to terminal electrodes of an electronic chip component on two opposing end surfaces. Solder cream is applied to outer surfaces of the terminal electrodes. The terminal strips are thermocompression bonded to the terminal electrodes by placing the electronic chip component between the terminal strips and pressing the terminal strips against the terminal electrodes using a pair of heating elements so as to obtain an electronic component to which the terminal strips are temporarily fixed. The terminal strips are fully fixed to the electronic component by melting the solder cream as a result of heating the electronic component in a heating furnace so as to obtain a terminal-strip-equipped electronic component.

Abstract: A conveying apparatus includes first, second, and third conveying sections, and a controller. The first and second conveying sections include first and second conveying mechanisms configured to convey workpieces at first and second speeds, respectively. The third conveying section includes a third conveying mechanism, a rotation mechanism, and a first sensor. The third conveying mechanism is in a form of a slide and positioned between the first and second conveying mechanisms. The third conveying mechanism is configured to allow the workpieces dropped thereon from the first conveying mechanism to slide to be transferred onto the second conveying mechanism. The rotation mechanism is configured to turn the third conveying mechanism about a rotation shaft. The first sensor is configured to detect first information indicating that the workpieces have passed the second end portion of the third conveying mechanism. The controller is coupled to the first sensor and the rotation mechanism.

Abstract: A conveying apparatus includes first, second, and third conveying sections, and a controller. The first and second conveying sections include first and second conveying mechanisms configured to convey workpieces at first and second speeds, respectively. The third conveying section includes a third conveying mechanism, a rotation mechanism, and a first sensor. The third conveying mechanism is in a form of a slide and positioned between the first and second conveying mechanisms. The third conveying mechanism is configured to allow the workpieces dropped thereon from the first conveying mechanism to slide to be transferred onto the second conveying mechanism. The rotation mechanism is configured to turn the third conveying mechanism about a rotation shaft. The first sensor is configured to detect first information indicating that the workpieces have passed the second end portion of the third conveying mechanism. The controller is coupled to the first sensor and the rotation mechanism.

Abstract: A ceramic electronic component includes an electronic component body and first and second metal terminals. The electronic component body includes a bare ceramic body and first and second outer electrodes. The first and second outer electrodes of the electronic component body are connected respectively to the first and second metal terminals by solders containing Sn as a main constituent. An alloy layer containing Ni—Sn is provided in at least a portion of a bonding interface between adjacent two of the first and second metal terminals and the first and second outer electrodes.

Abstract: A conveying system includes a first belt conveyor; a second belt conveyor; a workpiece guide that includes guide paths that receive workpieces that have fallen from a downstream end portion of the first belt conveyor one by one and then guide the workpieces to an upstream end portion of the second belt conveyor; a rotary mechanism that displaces the downstream end portion along a substantially arc-shaped trajectory to distribute the workpieces that have fallen from the downstream end portion into the guide paths; a first sensor that detects first information that represents that one of the workpieces has fallen from the downstream end portion; and a controlling device that controls an operation of the rotary mechanism. The controlling device controls the rotary mechanism by transmitting an operation command to the displacement mechanism to intermittently displace the downstream end portion by a predetermined distance in response to first information.

Abstract: A bonding material applying apparatus includes a syringe in which a bonding material is filled. The syringe includes a discharge nozzle disposed at a tip thereof to discharge the bonding material filled in the syringe. A compressed air supply mechanism supplies compressed air to the syringe and discharges the bonding material from the discharge nozzle. When a discharge interval from the end of discharge to the start of discharge of the bonding material lasts for a certain time or longer, the compressed air supply mechanism supplies the compressed air for a time, which is shorter than a discharge time necessary to discharge the bonding material, to such an extent that the bonding material is substantially not discharged.

Abstract: A method for manufacturing a terminal-strip-equipped electronic component in which terminal strips made of a metal plate are bonded with solder to terminal electrodes of an electronic chip component on two opposing end surfaces. Solder cream is applied to outer surfaces of the terminal electrodes. The terminal strips are thermocompression bonded to the terminal electrodes by placing the electronic chip component between the terminal strips and pressing the terminal strips against the terminal electrodes using a pair of heating elements so as to obtain an electronic component to which the terminal strips are temporarily fixed. The terminal strips are fully fixed to the electronic component by melting the solder cream as a result of heating the electronic component in a heating furnace so as to obtain a terminal-strip-equipped electronic component.

Abstract: A ceramic electronic component includes an electronic component body and first and second metal terminals. The electronic component body includes a bare ceramic body and first and second outer electrodes. The first and second outer electrodes of the electronic component body are connected respectively to the first and second metal terminals by solders containing Sn as a main constituent. An alloy layer containing Ni—Sn is provided in at least a portion of a bonding interface between adjacent two of the first and second metal terminals and the first and second outer electrodes.