Patents by Inventor Nobuo Asada

Nobuo Asada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module
    Patent number: 7737369
    Abstract: A semiconductor module (A1) comprises a semiconductor device (10) provided with a semiconductor chip, and a conductive cover (6) for electromagnetic shielding bonded to the semiconductor device (10) via an adhesive coat (8). The conductive cover (6) includes a surface facing the adhesive coat (8), and the surface is formed with a convex portion (6a) protruding toward the adhesive coat (8). Around the convex portion (6a), a space (7) is formed for filling in adhesive to form the adhesive coat (8).
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: June 15, 2010
    Assignee: Rohm Co., Ltd.
    Inventors: Tomoharu Horio, Nobuo Asada
  • Semiconductor Module
    Publication number: 20080315215
    Abstract: A semiconductor module (A1) comprises a semiconductor device (10) provided with a semiconductor chip, and a conductive cover (6) for electromagnetic shielding bonded to the semiconductor device (10) via an adhesive coat (8). The conductive cover (6) includes a surface facing the adhesive coat (8), and the surface is formed with a convex portion (6a) protruding toward the adhesive coat (8). Around the convex portion (6a), a space (7) is formed for filling in adhesive to form the adhesive coat (8).
    Type: Application
    Filed: December 20, 2004
    Publication date: December 25, 2008
    Inventors: Tomoharu Horio, Nobuo Asada
  • Light-receiving module
    Publication number: 20070138493
    Abstract: A light receiving module M comprises a photodiode 1, an IC chip 2, a light permeable and electrically insulating sealing resin member 4 for sealing the photodiode 1 and the IC chip 2, a lens 43 provided at a surface of the sealing resin member 4 facing the photodiode 1, and a light impermeable and conductive coating5 for covering the sealing resin member 4 with the lens 43 being exposed. The coating 5 is connected to the ground and is made of a conductive resin, while being formed with a vertical wall 51 surrounding the lens 43.
    Type: Application
    Filed: January 24, 2005
    Publication date: June 21, 2007
    Applicant: ROHM CO., LTD.
    Inventors: Kazumi Morimoto, Nobuo Asada