Patents by Inventor Nobuo Ebina

Nobuo Ebina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microporous copper film and electroless copper plating solution for obtaining the same
    Publication number: 20020046679
    Abstract: A copper metal film having 105 to 109 micropores per square centimeter and a product plated with the film. The copper metal film is obtained by immersing a work in an electroless plating solution which contains copper ions, a completing agent, a hypophosphorus acid compound, a metal catalyst for initiating reduction, and a compound having an acetylenic bond.
    Type: Application
    Filed: November 9, 2001
    Publication date: April 25, 2002
    Applicant: Hideo HONMA
    Inventors: Hideo Honma, Tomoyuki Fujinami, Nobuo Ebina
  • Microporous copper film and electroless copper plating solution for obtaining the same
    Patent number: 6329072
    Abstract: A printed circuit board comprising a metal copper film having 105 to 109 micropores per square centimeter wherein the metal copper film is prepared by dipping a plating object into an electroless copper plating solution comprising a copper ion, a complexing agent, a hypophosphorus acid compound, a metallic catalyst for initiating the reductive reaction, and a compound containing an acetylenic bond.
    Type: Grant
    Filed: August 23, 1999
    Date of Patent: December 11, 2001
    Assignees: Ebara-Udylite Co., Ltd.
    Inventors: Hideo Honma, Tomoyuki Fujinami, Nobuo Ebina