Abstract: A flash heating part including a plurality of flash lamps is provided over a chamber for receiving a semiconductor wafer therein, and an auxiliary heating part including a plurality of laser diodes and a plurality of VCSELs (Vertical Cavity Surface Emitting Lasers) is provided under the chamber. During the preheating of the semiconductor wafer, an optical element irradiates the entire surface of the semiconductor wafer with light emitted from the laser diodes with a uniform illuminance distribution while the VCSELs irradiate a peripheral portion of the semiconductor wafer with highly directional light. The laser diodes, which irradiate the semiconductor wafer with relatively intense light with a wavelength shorter than 1 ?m, are capable of heating the semiconductor wafer efficiently to a high temperature. The light irradiation from the VCSELs provides a uniform in-plane temperature distribution of the semiconductor wafer.

Abstract: A substrate processing apparatus according to the present invention comprises a substrate holding mechanism for holding a substrate and rotating the held substrate; a process liquid supply mechanism for supplying a process liquid to the substrate; a process liquid acquisition section arranged so as to enclose the substrate holding mechanism and having an acquisition port for acquiring the process liquid scattered by the rotation of the substrate; a movement mechanism for changing a relative position between the process liquid acquisition section and the substrate held by the substrate holding mechanism; and a control mechanism for controlling, when the process liquid scattered by the rotation of the substrate is acquired in the acquisition port, a relative position between the substrate and the acquisition port such that the scattered process liquid is acquired in the acquisition port on the basis of predetermined substrate process condition.

Abstract: A substrate processing apparatus according to the present invention comprises a substrate holding mechanism for holding a substrate and rotating the held substrate; a process liquid supply mechanism for supplying a process liquid to the substrate; a process liquid acquisition section arranged so as to enclose the substrate holding mechanism and having an acquisition port for acquiring the process liquid scattered by the rotation of the substrate; a movement mechanism for changing a relative position between the process liquid acquisition section and the substrate held by the substrate holding mechanism; and a control mechanism for controlling, when the process liquid scattered by the rotation of the substrate is acquired in the acquisition port, a relative position between the substrate and the acquisition port such that the scattered process liquid is acquired in the acquisition port on the basis of predetermined substrate process condition.

Abstract: A substrate processing apparatus according to the present invention comprises a substrate holding mechanism for holding a substrate and rotating the held substrate; a process liquid supply mechanism for supplying a process liquid to the substrate; a process liquid acquisition section arranged so as to enclose the substrate holding mechanism and having an acquisition port for acquiring the process liquid scattered by the rotation of the substrate; a movement mechanism for changing a relative position between the process liquid acquisition section and the substrate held by the substrate holding mechanism; and a control mechanism for controlling, when the process liquid scattered by the rotation of the substrate is acquired in the acquisition port, a relative position between the substrate and the acquisition port such that the scattered process liquid is acquired in the acquisition port on the basis of predetermined substrate process condition.