Patents by Inventor Nobuo Eitoh

Nobuo Eitoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transparent electrode for semiconductor light-emitting device
    Patent number: 7498611
    Abstract: A transparent electrode for a gallium nitride-based compound semiconductor light-emitting device includes a p-type semiconductor layer (5), a contact metal layer (1) formed by ohmic contact on the p-type semiconductor layer, an current diffusion layer (12) formed on the contact metal layer and having a lower magnitude of resistivity on the plane of the transparent electrode than the contact metal, and a bonding pad (13) formed on the current diffusion layer. The transparent electrode is at an advantage in widening the surface of light emission in the p-type semiconductor layer, decreasing the operation voltage in the forward direction, and enabling the bonding pad to provide excellent adhesive strength.
    Type: Grant
    Filed: July 27, 2005
    Date of Patent: March 3, 2009
    Assignee: Showa Denko K.K.
    Inventors: Nobuo Eitoh, Noritaka Muraki, Hisayuki Miki, Munetaka Watanabe
  • Transparent Electrode for Semiconductor Light-Emitting Device
    Publication number: 20080042159
    Abstract: A transparent electrode for a gallium nitride-based compound semiconductor light-emitting device includes a p-type semiconductor layer (5), a contact metal layer (1) formed by ohmic contact on the p-type semiconductor layer, an current diffusion layer (12) formed on the contact metal layer and having a lower magnitude of resistivity on the plane of the transparent electrode than the contact metal, and a bonding pad (13) formed on the current diffusion layer. The transparent electrode is at an advantage in widening the surface of light emission in the p-type semiconductor layer, decreasing the operation voltage in the forward direction, and enabling the bonding pad to provide excellent adhesive strength.
    Type: Application
    Filed: July 27, 2005
    Publication date: February 21, 2008
    Applicant: SHOWA DENKO K.K
    Inventors: Nobuo Eitoh, Noritaka Muraki, Hisayuki Miki, Munetaka Watanabe