Abstract: A fishing reel cap for mounting on a reel body of a fishing reel includes a bottomed cylindrical cap body and an annular reinforcing member. The bottomed cylindrical cap body has a cylindrical portion with threads capable of being screwed onto threads on the reel body and projections extending radially outward on an outside surface of the cylindrical portion. The annular reinforcing member has recesses, a portion of each projection of the projections being configured to fit into a respective recess of the recesses, and the annular reinforcing member being configured to fit on the outside surface of the cap body, exposing at least a portion of each of the projections in a radially outward direction.

Abstract: A fishing reel cap for mounting on a reel body of a fishing reel includes a bottomed cylindrical cap body and an annular reinforcing member. The bottomed cylindrical cap body has a cylindrical portion with threads capable of being screwed onto threads on the reel body and projections extending radially outward on an outside surface of the cylindrical portion. The annular reinforcing member has recesses, a portion of each projection of the projections being configured to fit into a respective recess of the recesses, and the annular reinforcing member being configured to fit on the outside surface of the cap body, exposing at least a portion of each of the projections in a radially outward direction.

Abstract: A semiconductor integrated circuit device includes a plurality of flip-flops configured to form a scan chain in a scan path test to operate as a shift register. The first flip-flop of the plurality of flip-flops latches a first input signal in synchronization with a clock signal, outputs a first output signal and fixes the first output signal based on the first selection control signal. A second flip-flop of the plurality of flip-flops latches a second input signal in synchronization with the clock signal, outputs a second output signal, and fixes the second output signal based on a second selection control signal. The semiconductor integrated circuit device further includes a control circuit configured to generate the first and second selection control signals such that a period during which the first flip-flop fixes the first output signal is different from a period during which the second flip-flop fixes the second output signal.

Abstract: A semiconductor chip has: a plurality of hard macros which operates based on a reference clock; and a clock pad through which the reference clock is supplied from the outside to one of the plurality of hard macros. The reference clock supplied to the one hard macro is relayed to other hard macros of the plurality of hard macros in order.

Abstract: A semiconductor integrated circuit device includes a plurality of flip-flops configured to form a scan chain in a scan path test to operate as a shift register. The first flip-flop of the plurality of flip-flops latches a first input signal in synchronization with a clock signal, outputs a first output signal and fixes the first output signal based on the first selection control signal. A second flip-flop of the plurality of flip-flops latches a second input signal in synchronization with the clock signal, outputs a second output signal, and fixes the second output signal based on a second selection control signal. The semiconductor integrated circuit device further includes a control circuit configured to generate the first and second selection control signals such that a period during which the first flip-flop fixes the first output signal is different from a period during which the second flip-flop fixes the second output signal.

Abstract: The present invention provides a metal coated fiber with excellent coating strength and corrosion resistance, and a conductive resin composition with excellent conductivity. A feature of a metal coated fiber of the present invention is that following provision of a metal coating on the surface of the fiber, heat treatment is conducted at a temperature greater than the crystallization temperature but less than the melting temperature of the fiber. Gradual cooling is preferably performed following the heat treatment. Furthermore, a conductive metal coating may be provided as the metal coating, and an additional corrosion resistant metal coating then laminated onto the surface of the conductive metal coating. In addition, a feature of a conductive resin composition of the present invention is that metal coated short fibers, formed by providing a conductive metal coating on the surface of a substrate fiber formed from a synthetic resin and then conducting heat treatment, are mixed into a substrate resin.

Abstract: A semiconductor chip has: a plurality of hard macros which operates based on a reference clock; and a clock pad through which the reference clock is supplied from the outside to one of the plurality of hard macros. The reference clock supplied to the one hard macro is relayed to other hard macros of the plurality of hard macros in order.

Abstract: The present invention provides a metal coated fiber with excellent coating strength and corrosion resistance, and a conductive resin composition with excellent conductivity. A feature of a metal coated fiber of the present invention is that following provision of a metal coating on the surface of the fiber, heat treatment is conducted at a temperature greater than the crystallization temperature but less than the melting temperature of the fiber. Gradual cooling is preferably performed following the heat treatment. Furthermore, a conductive metal coating may be provided as the metal coating, and an additional corrosion resistant metal coating then laminated onto the surface of the conductive metal coating. In addition, a feature of a conductive resin composition of the present invention is that metal coated short fibers, formed by providing a conductive metal coating on the surface of a substrate fiber formed from a synthetic resin and then conducting heat treatment, are mixed into a substrate resin.

Abstract: A white conductive fiber is manufactured at an inexpensive cost having superior conductivity and high degree of whiteness, in which a metal coating plated on the fiber has superior adhesiveness. A method for manufacturing the white conductive fiber comprises the steps of mounting a wound fiber body formed by winding a continuous fiber to the fixing shaft, a step of flowing a plating solution from the fixing shaft to a plating bath via the wound fiber body so as to infiltrate the plating solution into the wound fiber body, and a step of performing electroless plating of silver, platinum, or the like on the fiber material while the plating solution flows.