Abstract: Firstly, using a cutting tool 30, connecting ribs 13 are cut off from the end face of a duplex pipe 10 which is held with an outer pipe 11 chucked (rib cutting step). Next, the duplex pipe 10 is cut at and from the end face of the duplex pipe 10 up to the portion thereof corresponding to the exposed length of the inner pipe 12 to thereby form a slit 21 in the outer pipe 11 and connecting ribs 13 (slit forming step) The cutting tool 30 comprises a guide hole 31 into which the inner pipe 12 can be inserted while guiding the inner pipe outer peripheral surface 12a, a cutting device 32 for cutting the connecting ribs 13, and a guide pin 33 which is disposed in the guide hole 31 and can be inserted into the inner pipe 12 while guiding the inner pipe inner peripheral surface 12b.

Abstract: A refrigerating cycle has a condenser, an evaporator, a variable displacement compressor, and an expansion valve. The variable displacement compressor is connected between the condenser and the evaporator to form the refrigerating cycle, and includes a control valve designed to provide a control valve characteristic sloping downward with increase in a discharge pressure. The expansion valve is connected between the condenser and the evaporator, to return a refrigerant from the condenser through the evaporator to the variable displacement compressor, and designed to provide an open valve characteristic whose slope is approximately equal to the downward slope of the control valve characteristic.

Abstract: A joint 50 for duplex pipes is to connect to a duplex 100 where an outer pipe 101, an inner pipe 102, and ribs 103 are unitized to be the duplex pipe 100 as one body through an extruding process or a drawing process, having a main body 110 which is provided at its one end to an end portion 101a of the outer pipe exposing the inner pipe 102 by partially eliminating the outer pipe 101, a wall face part 112 equipped at the other end of the main body 110 for penetrating the exposed inner pipe 102, and a connecting pipe 120 provided in the opening 113. An opening is formed at places to be determined in response to disposing conditions of the connecting pipes.

Abstract: An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.

Abstract: An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubustituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.

Abstract: An electroconductive resin paste suitable for bonding a semiconductor element onto a substrate and exhibiting a superior adhesion strength and processability when heated to 200.degree. C. to 350.degree. C., and a process for producing a semiconductor device using the electroconductive resin paste are provided, which electroconductive resin paste comprises.(A) a mixed epoxy resin of a phenolic novolac type epoxy resin with an epi-bis type epoxy resin,(B) a phenolic novolac resin and/or phenol aralkyl resin,(C) organic borate,(D) a diluent containing a silane compound having one glycidyl group as at least one component therein, and(E) an electroconductive metal powder.

Abstract: An electroconductive adhesive comprising an epoxy-novolak resin, a phenol-aralkyl resin, a glycidyl group-containing silane coupling agent, an organic borate and an electro-conductive metal power is excellent in reliability in moisture and hydrolytic resistance and useful for semiconductor devices.

Abstract: In a resin packaged semiconductor device including a semiconductor element, the back side of which is bonded to a support and the front side of which has electrodes which are electrically connected to electroconductive portions by fine leads, when an adhesive composition comprising an epoxy resin, a novolak type phenolic resin, a solvent for the both resins and a powdery filler, and if necessary, a curing accelerator and a coupling agent, is used for binding the semiconductor and the support, the resulting semiconductor device is excellent in moisture resistance and corrosion resistance.