Abstract: There is provided a method for manufacturing an optical element comprising a base material, and a stack covering of layers formed on the base material. The method of the present disclosure comprises a multi-layers forming step for forming an optical multi-layered part of the stack covering, and an outermost surface forming step for forming an outermost surface part of the stack covering. A pressure condition for the formation of the stack covering is made discontinuous between the multi-layers forming step and the outermost surface forming step. In the outermost surface forming step, a silicon oxide-containing layer is formed prior to a formation of a fluorine compound-containing layer.

Abstract: A method for manufacturing a semiconductor device having a cathode layer divided into a plurality of mesa type cathode layer portions and used under pressure applied from the cathode layer side through a pressing plate, the method comprising steps of disposing a flat plate having a lateral width covering at least from the outer edge of a cathode electrode disposed on one outermost cathode layer portion to the outer edge of a cathode electrode disposed on the other outermost cathode layer portion, applying an external pressure through the flat plate, and then disposing the pressing plate.