Patents by Inventor Nobuo Kayaba

Nobuo Kayaba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5133403
    Abstract: A cooling device for cooling semiconductor elements by removing heat generated from the semiconductor elements such as, for example, semiconductor integrated chips in a large-sized electronic computer. The cooling device is fashioned of a composite AlN-BN sintered material having a Vickers hardness not higher than one-fifth of that of an AlN material, and an anisotropic property of thermal conductivity in a two dimensional direction is higher than that of AlN which is isotropic in thermal conductivity. The cooling device may be mass-produced while nevertheless having a high transfer performance matching the quantity of heat generated for each semiconductor element even if the composite sintered material is uniform in shape and size. The composite sintered material is formed by a mixture of a hexagonal BN powder having an average particle diameter of not less than 1 .mu.m and an AlN powder having an average particle diameter of about 2 .mu.
    Type: Grant
    Filed: October 19, 1989
    Date of Patent: July 28, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Hitoshi Yokono, Takao Terabayashi, Nobuo Kayaba, Takahiro Daikoku, Shigekazu Kieda, Fumiyuki Kobayashi, Shizuo Zushi