Patents by Inventor Nobuo Morikita

Nobuo Morikita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6003339
    Abstract: A molding die assembly includes an upper molding die and a lower molding die facing the upper molding die with provision for their alignment. The upper molding die includes an upper core, while the lower molding die includes a hollow cylinder and a lower core. The upper core has one of the molding surfaces that corresponds to a molding, while the lower core has the other molding surface corresponding to the molding. The lower core slides in the cylinder and defines a cavity in cooperation with the upper core. A clamping device applies a clamping force to the upper molding die and the lower molding die, and a compression device applies a compressive force between the upper core and the lower core. The clamping force is generated between the upper molding die and the lower molding die but not between the upper core and the lower core so that no clamping force is applied to the preform.
    Type: Grant
    Filed: May 28, 1993
    Date of Patent: December 21, 1999
    Assignee: Sumitomo Heavy Industries, Ltd.
    Inventor: Nobuo Morikita
  • Patent number: 5616161
    Abstract: A machining chamber encloses a glass molding apparatus including a molding die assembly composed of upper and lower molding dies cooperating to define a mold therebetween. The glass molding apparatus, contained within the sealed machining chamber, further includes a clamping/heating/compressing station, a cooling station and a preform-loading/molding-ejecting station. A shutter is provided in the casing for selectively opening the casing to the ambient atmosphere. An annular nozzle surrounds a molding surface provided on one of the upper and lower molding dies and is used to supply a first inactive-gas to the region between the two dies. A second, independent inactive-gas supply provides inactive-gas directly into the sealed casing, whereby the region between the dies is maintained at a lower oxygen level than that within the remainder of the sealed casing.
    Type: Grant
    Filed: January 31, 1995
    Date of Patent: April 1, 1997
    Assignee: Sumitomo Heavy Industries, Ltd.
    Inventor: Nobuo Morikita
  • Patent number: 5512223
    Abstract: A local pressurizing type injection molding apparatus including a stationary die, a movable die disposed for movement into and out of contact with the stationary diet a first local pressurizing pin extending through the movable die and having a tip facing a gate, and a second local pressurizing pin extending through the movable die and having a tip facing the cavity. The apparatus is further provided with first advancing mechanism for advancing the first local pressurizing pin, second advancing mechanism for advancing the second local pressurizing pint and a device for individually setting the points in time at which advancing movements of the first local pressurizing pin and the second local pressurizing pin are started and for individually setting the pressurizing pressures given by the first local pressurizing pin and the second local pressurizing pin.
    Type: Grant
    Filed: August 1, 1994
    Date of Patent: April 30, 1996
    Assignee: Sumitomo Heavy Industries, Ltd.
    Inventor: Nobuo Morikita
  • Patent number: 5472335
    Abstract: A locally pressurizing type injection molding machine includes a stationary die and a movable die. An ejector pin extends through the movable die, with its tip end facing a mold cavity and its trailing end fixed by an ejector plate. A vibrating/pressurizing pin extends through the movable die and the ejector plate, with its tip end facing a resin passage and with its trailing end fixed by the vibrating/pressurizing plate. A vibrating/pressurizing actuator is disposed in rear of the vibrating/pressurizing plate, so that the vibrating/pressurizing can be effected through the vibrating/pressurizing plate, and the ejector pin can be advanced through the vibrating/pressurizing plate and the ejector plate, both by operation of the vibrating/pressurizing actuator.
    Type: Grant
    Filed: September 29, 1993
    Date of Patent: December 5, 1995
    Assignee: Sumitomo Heavy Industries, Ltd.
    Inventor: Nobuo Morikita
  • Patent number: 5405259
    Abstract: A locally pressing type injection molding machine which performs various working operations on a molded product during an injection molding cycle is designed so that it can perform various working operation on a molded product after the injection step. To achieve this, a pressing pin is provided to extend in such a manner that it passes through at least part of either the fixed mold or the movable mold. A distal end of the pressing pin is provided in such a manner that it can advance into or retract from a cavity. A pressing cylinder is disposed behind the pressing pin to vibrate the pressing pin when a hydraulic pressure supply means supplies a pulsating hydraulic pressure to the pressing cylinder. A pulsating pressing force is applied to a resin which fills the cavity to work the molded product in a desired form. Therefore, a highly accurate worked surface can be obtained.
    Type: Grant
    Filed: May 26, 1993
    Date of Patent: April 11, 1995
    Assignee: Sumitomo Heavy Industries, Ltd.
    Inventor: Nobuo Morikita
  • Patent number: 5403370
    Abstract: A glass compression molding apparatus includes a horizontal upper platen and a lower platen disposed parallel to the upper platen. A top die is mounted for movement along the upper platen between a plurality of stations, and a bottom die is mounted for movement along the lower platen between another plurality of stations. A preform is introduced into the bottom die and then heated and compressed to form a molded product. The molded product is annealed and then removed from the bottom die. A clamping device forces the upper and lower platens together. A compression device compresses the preform. A conveying device moves at least the bottom die while suspended above the lower platen. Thus, wear of the lower platen, which would otherwise result from the sliding of the bottom die on the lower platen or the entry of foreign matter between the bottom die and the lower platen, is avoided. Such a wear or entry of foreign matter would occur while the mold is moved between stations in the conventional apparatus.
    Type: Grant
    Filed: April 19, 1993
    Date of Patent: April 4, 1995
    Assignee: Sumitomo Heavy Industries, Ltd.
    Inventor: Nobuo Morikita