Abstract: A process for forming electroless copper plating patterns comprising: (a) laminating a substrate with a photocurable laminate, (b) exposing said photocurable laminate to a high energy ray, (c) removing unexposed parts of the laminate, and (d) electrolessly plating a desired pat of the laminate with copper; wherein said photocurable layer comprises (a) 100 parts by weight of a compound having recurring units represented by the following formulae [A] and [B] ##STR1## and (b) 5 to 1,000 parts by weight of a compound, which is compatible with compound (a), having a group represented by the formula--(R.sub.4).sub.nwherein R.sub.4 is a group having a double bond and n is an integer of 1 to 50 and characterized by a viscosity at 20.degree. C. of from 0.001 to 500 poises.

Abstract: Disclosed is an image-forming material having a high sensitivity to high-energy beams and excellent in dry etching resistance, heat stability and resolution which comprises a copolymer containing a total of 1 to 99 mole-% of at least one of recurring structural units represented by the following formulas [A] and [A'] and 1 to 99 mole-% of at least one recurring structural unit represented by the following formula [B] and having a number-average molecular weight of 500 to 1,000,000: ##STR1## wherein R.sub.1 of the formulas [A] and [A'] represents a hydrogen or halogen atom, or an alkyl group having 1 to 6 carbon atoms, the substituent groups R.sub.